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Physics-based process modeling, reliability prediction, and design guidelines for flip-chip devices

No description available.

1. http://hdl.handle.net/1853/16028
2. 503426

Identifer	oai:union.ndltd.org:GATECH/oai:smartech.gatech.edu:1853/16028
Date	08 1900
Creators	Michaelides, Stylianos
Publisher	Georgia Institute of Technology
Source Sets	Georgia Tech Electronic Thesis and Dissertation Archive
Detected Language	English
Type	Dissertation
Rights	Access restricted to authorized Georgia Tech users only.