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Prospects for Mirror-Enabled Polymer Pillar I/O Optical Interconnects for Gigascale Integration

Digital systems have derived performance benefits due to the scaling down of CMOS microprocessor feature sizes towards packing billions of transistors on a chip, or gigascale integration (GSI). This has placed immense bandwidth demands on chip-to-chip and chip-to-board interconnects. The present-day electrical interconnect may limit bandwidth as transmission rates grow. As such, optical interconnects have been proposed as a potential solution. A critical requirement for enabling chip-to-chip and chip-to-board optical interconnection is out-of-plane coupling for directing light between a chip and the board. Any solution for this problem must be compatible with conventional packaging and assembly requirements. This research addresses the prospects for integrating waveguides with mirrors and polymer pillar optical I/O interconnects to provide such a compatible, out-of-plane, chip-to-board packaging solution through the design, analysis, fabrication, and testing of its constituent parts and their ultimate integration.

Identiferoai:union.ndltd.org:GATECH/oai:smartech.gatech.edu:1853/14067
Date27 October 2006
CreatorsOgunsola, Oluwafemi Olusegun
PublisherGeorgia Institute of Technology
Source SetsGeorgia Tech Electronic Thesis and Dissertation Archive
Languageen_US
Detected LanguageEnglish
TypeDissertation
Format8345758 bytes, application/pdf

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