ABSTRACT
In this study, the properties of the high impedance surface structure are studied. We proceed to design the low profile and miniature high impedance surface structure.
In order to conform to the IC chips of RFID and reduce the influence of metal objects, we add a layer of electromagnetic band-gap (EBG) structure on the back of the antenna. The EBG behaves as a high impedance surface, similar to a perfect magnetic conductor. This property of the EBG structure is able to isolate the antenna and backside environment and reduce the metallic effect.
In order to achieve the requirements of small size and low cost on RFID tag antenna, we design the miniature, low profile and low cost high impedance surface structure. In this study, we use the slots and chip capacitance to miniaturize the dimension. Both approaches can reduce the influence of metallic objects. Although using slots can reduce the metallic effect, it does not have the advantage of low profile. Using chip capacitor can miniaturize the dimension and reduce metallic effect effectively. It also has advantages of low profile, low cost and low sensitivity to the frequency of the tag antenna. Finally, the high impedance surface structures are fabricated and measured when they combine with the tag antenna attached to the metallic object. The measured results agree with simulated ones well.
| Identifer | oai:union.ndltd.org:NSYSU/oai:NSYSU:etd-0724108-160624 |
| Date | 24 July 2008 |
| Creators | Lee, Jui-Ni |
| Contributors | Chih-Wen Kuo, none, Ken-Huang Lin, Tzyy-Sheng Horng, none |
| Publisher | NSYSU |
| Source Sets | NSYSU Electronic Thesis and Dissertation Archive |
| Language | Cholon |
| Detected Language | English |
| Type | text |
| Format | application/pdf |
| Source | http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0724108-160624 |
| Rights | not_available, Copyright information available at source archive |
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