ABSTRACT
This thesis gathered the actual Burn-In (BI) data from one of the leading cooperation in the semiconductor industry, and analyzed the major factors¡¦ impact on BGA package solder ball deformation. The Taguchi Method was used for these analyses, and the commercial statistic software MiniTab14 was widely used on this thesis. The solder ball stress was analized by using the commercial FEM software Ansys 8.1.
Some electrical characters (such as device power) can be only observed from Burn-In process, but not static acceleration tests. These effects were fully discussed in this thesis. The analyses got the result that the smaller solder ball pitch/solder ball diameter causes the more serious solder ball deformation under the specific socket vendor precondition. Burn-In time are also a significant factor for solder deformation. Basically the longer BI time cause the more serious solder deformation. The device power effect is not significant within the power sampling range of this thesis.
| Identifer | oai:union.ndltd.org:NSYSU/oai:NSYSU:etd-0116107-191139 |
| Date | 16 January 2007 |
| Creators | Hsiao, Chia-ping |
| Contributors | Chi-hui Chien, T. N. Shiau, R. H. Sun |
| Publisher | NSYSU |
| Source Sets | NSYSU Electronic Thesis and Dissertation Archive |
| Language | English |
| Detected Language | English |
| Type | text |
| Format | application/pdf |
| Source | http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0116107-191139 |
| Rights | not_available, Copyright information available at source archive |
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