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Damage metric-based thermal cycling guidelines for area-array packages used in harsh thermal conditions

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Identiferoai:union.ndltd.org:GATECH/oai:smartech.gatech.edu:1853/18851
Date05 1900
CreatorsPyland, James
PublisherGeorgia Institute of Technology
Source SetsGeorgia Tech Electronic Thesis and Dissertation Archive
Detected LanguageEnglish
TypeThesis
RightsAccess restricted to authorized Georgia Tech users only.

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