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Damage metric-based thermal cycling guidelines for area-array packages used in harsh thermal conditions

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1. http://hdl.handle.net/1853/18851
2. 629523

Identifer	oai:union.ndltd.org:GATECH/oai:smartech.gatech.edu:1853/18851
Date	05 1900
Creators	Pyland, James
Publisher	Georgia Institute of Technology
Source Sets	Georgia Tech Electronic Thesis and Dissertation Archive
Detected Language	English
Type	Thesis
Rights	Access restricted to authorized Georgia Tech users only.