In recent years, a theme for generally discussion in IC design domain is how to do the efficient verification in complex SoC environment and raise the confidence when chip taped-out. But when we face the different abstraction levels of verification environment like the System Modeling Level, Register Transfer Level, FPGA Emulation Level and Chip Level verification environment, how to unifiy test-patterns and makes them can be reused and do mutual-verification in different abstraction level verification environments is our main topic. Therefore, this thesis proposed a verification methodology that based on the 3D graphics SoC and unified the test patterns that let the different abstraction levels of verification environment can use the same test patterns. And to face the exetensive test patterns of 3DG SoC, we also proposed an automatic verification mechanism which can run the simulation and compare the simulation results automatically and improve the verification efficiency. Finally, we also share the 3DG SoC integration and verification experience from front-end to back-end, hope to makes everyone understand the related flow from RTL design to test-chip testing.
| Identifer | oai:union.ndltd.org:NSYSU/oai:NSYSU:etd-0815108-194250 |
| Date | 15 August 2008 |
| Creators | Huang, Wei-Sheng |
| Contributors | Chia-Lin Yang, Shu-Min Li, Ing-Jer Huang, Chua-Chin Wang, Steve Haga |
| Publisher | NSYSU |
| Source Sets | NSYSU Electronic Thesis and Dissertation Archive |
| Language | Cholon |
| Detected Language | English |
| Type | text |
| Format | application/pdf |
| Source | http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0815108-194250 |
| Rights | restricted, Copyright information available at source archive |
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