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Enhance thermomechanical reliability of microsystems packaging through new base substrate and dielectric materials

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1. http://hdl.handle.net/1853/17141
2. 669960

Identifer	oai:union.ndltd.org:GATECH/oai:smartech.gatech.edu:1853/17141
Date	05 1900
Creators	Hegde, Shashikant
Publisher	Georgia Institute of Technology
Source Sets	Georgia Tech Electronic Thesis and Dissertation Archive
Detected Language	English
Type	Thesis
Rights	Access restricted to authorized Georgia Tech users only.