Return to search

Prediction and validation of thermomechanical reliability in electronic packaging

No description available.
Identiferoai:union.ndltd.org:GATECH/oai:smartech.gatech.edu:1853/17565
Date08 1900
CreatorsDing, Hai
PublisherGeorgia Institute of Technology
Source SetsGeorgia Tech Electronic Thesis and Dissertation Archive
Detected LanguageEnglish
TypeDissertation
RightsAccess restricted to authorized Georgia Tech users only.

Page generated in 0.0017 seconds