Abstract
This thesis is mainly aimed to the study the basic physical properties of different flux, and the combination with semiconductor packaging of 0.6mm Sn96.5/Ag3.0/Cu0.5 (SAC305) big solder ball, and 0.3mm Sn98.5/Ag1.0/Cu0.5 (SAC105) small solder ball.
Big solder ball was proceeded with shear stress test, pull ball test, and tray drop test. However small solder ball was proceeded with shear stress test, pull ball test, zone shear solder balls test and board level drop test. After experiments, samples of different flux, the effect of solder strength and mechanical properties were received and discussed. And failure modes were observed by high-power microscope, SEM and OM.
The experimental result shows that the flux doesn¡¦t have direct relationship with the point of welding strong and weak, the point of welding strong and weak is determined by the metal¡¦s characteristics. However, the less of residual flux is, the higher the solder balls shearing force as well as pulling force are. As for the more of residual more of flux, after aged processing, some solder balls have the phenomenon of missing from the IMC layer. And the difference of the residual flux will affect the various failure modes of zone shear solder balls. From board level drop test, the majority of failure modes is pad peeling at the corner of test board side for all test flux, and the remaining failure modes exhibit solder fractured and IMC layer broken. Therefore, the judgement of the residual flux is a very important key factor for the semiconductor packaging. It doesn¡¦t have the direct correlation with the reliability of final products.
Keywords: Lead Free, Solder Ball, Flux, Semiconductor Packaging, Tests.
Identifer | oai:union.ndltd.org:NSYSU/oai:NSYSU:etd-0129107-141104 |
Date | 29 January 2007 |
Creators | Chang, Chia-Wei |
Contributors | Chorng-Fuh Liu, Chien-fan Chen, Ming-Hwa R. Jen |
Publisher | NSYSU |
Source Sets | NSYSU Electronic Thesis and Dissertation Archive |
Language | Cholon |
Detected Language | English |
Type | text |
Format | application/pdf |
Source | http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0129107-141104 |
Rights | unrestricted, Copyright information available at source archive |
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