The diversity of network disruptions that occur in patients with neuropsychiatric disorders creates a strong demand for personalized medicine. Such approaches often take the form of implantable bioelectronic devices that are capable of monitoring pathophysiological activity for identifying biomarkers to allow for local and responsive delivery of intervention. They are also required to transmit this data outside of the body for evaluation of the treatment’s efficacy. However, the ability to perform these demanding electronic functions in the complex physiological environment with minimum disruption to the biological tissue remains a big challenge. An optimal fully implantable bioelectronic device would require each component from the front-end to the data transmission to be conformable and biocompatible. For this reason, organic material-based conformable electronics are ideal candidates for components of bioelectronic circuits due to their inherent flexibility, and soft nature. In this work, first an organic mixed-conducting particulate composite material (MCP) able to form functional electronic components and non-invasively acquire high–spatiotemporal resolution electrophysiological signals by directly interfacing human skin is presented. Secondly, we introduce organic electrochemical internal ion-gated transistors (IGTs) as a high-density, high-amplification sensing component as well as a low leakage, high-speed processing unit. Finally, a novel wireless, battery-free strategy for electrophysiological signal acquisition, processing, and transmission that employs IGTs and an ionic communication circuit (IC) is introduced. We show that the wirelessly-powered IGTs are able to acquire and modulate neurophysiological data in-vivo and transmit them transdermally, eliminating the need for any hard Si-based electronics in the implant.

No description available.

No description available.

The Gallium Arsenide Field Effect transistor (GaAs FET) is experiencing a widespread acceptance in space and terrestrial systems due to its low noise, high gain and frequency characteristics unmatched by bipolar devices. This paper describes a design of a 4 GHz low noise amplifier with GaAs FETs using the scattering parameters method. Special attention is given to overall noise/gain optimization in the band of interest. The Smith Chart is used extensively to match the two-port device with microstrip networks. Analysis and performance of the amplifier are presented.

This work presents data concerning the optical nature of the insulated gate field effect transistor (IGFET), how its optical sensitivity relates to its electrical operation, and explores its usefulness as a microluminometer for a chemisensor and biosensor. Although the experiments performed for this dissertation show that the IGFET's light sensitivity does not involve the standard operation of the FET, i.e., the modulation of the source to drain current, they also show that the IGFET's light sensitivity is not a simple photodiode response of the source/base or drain/base junction. This work raises many interesting questions to be answered by future studies concerning the light sensitivity of the IGFET and its possible uses. In this work an instrument was built to probe the IGFET with photons, the IGFET's wavelength response is presented, the detection of recaequorin in a static system is shown to have a limit of detection of 6*10⁻²⁰ moles of recaequorin, and the IGFET is demonstrated as a microluminometer in a FIA system for detecting hypochlorite. The hypochlorite limit of detection is 39 * 10⁻¹² moles.. The author proposes new uses for the IGFET employing its traditional ion sensing role as well as its photosensitivity. Construction of a three dimensional biosensor is suggested. / Ph. D.

No description available.

Les transistors HEMTs (High Electron Mobility Transistors) de la filière GaN sont destinés à des applications dans les domaines militaire et spatial. C’est pourquoi nous avons étudié l’influence de trois types de stress électriques : à canal ouvert, à canal pincé et NGB (Negative Gate Bias), ainsi que l’influence de neutrons thermalisés avec une fluence pouvant aller jusqu’à 1,7.1012 neutrons.cm-2, sur leurs performances électriques dc.Dans un premier temps, nous avons étudié des HEMTs AlInN/GaN de laboratoire. Pour les trois stress, nous avons observé une dégradation due à la création de pièges accepteurs et donneurs au cours des différents stress et à la présence de pièges préexistants. Nous avons ensuite irradié ces composants par des neutrons thermalisés et avons observé une légère dégradation des performances électriques des transistors non stressés et stressés à canal ouvert ou pincé. En revanche, nous avons mis en lumière une légère amélioration pour les transistors ayant subi un stress NGB. Nous avons également irradié des MOS-HEMTs AlInN/GaN et conclu que ceux-ci étaient plus sensibles vis à vis des irradiations.Dans un deuxième temps, nous avons stressé de manière analogue des HEMTs AlGaN/GaN du commerce. Dans le cas du stress à canal ouvert, nous avons observé une diminution importante du courant de drain tandis que pour les stress à canal pincé et NGB le courant de drain augmente légèrement à cause d’une libération de pièges préexistants sous l’action du champ électrique vertical. Lors des irradiations avec des neutrons thermalisés, ces transistors, stressés ou non, subissent là encore des dégradations. / The GaN based HEMTs (High Electron Mobility Transistors) are excellent candidates for military and spatial applications. That’s why we have analysed the influence of three different types of bias stress: on-state stress, off-state stress and NGB (Negative Gate Bias), and the influence of thermalized neutrons with a fluence up to 1.7x1012 neutrons.cm-2, on their dc electrical performances.First, we have studied laboratory AlInN/GaN HEMTs. For the three conditions of stress, we have observed a degradation due to pre-existing traps and to the creation of acceptor and donor traps during the stress. Then, we have irradiated these components with thermalized neutrons and we have found a small degradation of the electrical performances of unstressed and on-state stressed and off-state stressed transistors. On the other hand, we have highlighted a slight improvement for NGB stressed components. We have also irradiated AlInN/GaN MOS-HEMTs and we have concluded that they are more sensible to irradiation.In a second time we have stressed in the same way commercial AlGaN/GaN HEMTs. For the on-state stress, we have observed an important increase in the drain current. However, the drain current increases for the on-state and NGB stressed components due to a release of electrons from pre-existing traps under vertical electrical field. During the irradiation with thermalized neutrons, the unstressed and stressed transistors are degraded and a small decrease in the drain current is visible.

Cette thèse porte sur l’étude de la stabilité et de la fiabilité de transistors organiques imprimés au CEA-Liten. Des OTFTs de type P ont été fabriqués sur plastique, avec un polymère semi-conducteur (SCO) de type P (SP400 de Merck) et un fluoropolymère en tant que diélectrique. Tout d’abord, un protocole expérimental pour la caractérisation électrique a été mis en place afin de s’affranchir de potentiels effets dus à l’environnement, la mesure ou le vieillissement des OTFTs. Puis un modèle basé sur l’expression de la charge d’accumulation dans le transistor a été développé. Ce modèle a permis l’extraction des paramètres des OTFTs lors de mesures à basses températures, qui ont mis en évidence un transport de charges en température dans le SCO. Enfin, l’impact du stress électrique de grille négatif sur les caractéristiques des transistors a été étudié. La stabilité électrique des P-OTFTs a été mesurée sur plusieurs empilements afin d’étudier l’influence du diélectrique ou de sa méthode de dépôt et l’influence de la grille (électrode en encre argent imprimée ou en or pulvérisée). / This thesis project is about the study of stability and reliability of organic transistors printed at CEA-Liten. P-Type OTFTs were manufactured on plastic substrate, with a p-type polymer semiconductor (SP400 from Merck) and a fluoropolymer as dielectric. First, an experimental protocol for electrical characterization was determined in order to overcome potential effects due to environment, measurements or aging of OTFTs. Then a model based on the expression of the accumulation charge in the transistor was developed. This model allowed the OTFT parameters’ extraction during low temperature measurements, which showed a temperature-activated charges transport in the OSC. Finally, the impact of negative gate bias stress on OTFTs’ characteristics was studied. The electrical stability of the P-OTFTs was measured on several stacks to study the influence of the dielectric material or its deposition method and the influence of the gate (printed silver ink or sputtered gold electrode).

by Tse Man Siu. / Thesis (M.Phil.)--Chinese University of Hong Kong, 1988. / Bibliography: leaves 203-210.

Hiu Yung Wong. / Thesis (M.Phil.)--Chinese University of Hong Kong, 2001. / Includes bibliographical references (leaves 104-111). / Abstracts in English and Chinese. / Abstract --- p.i / Acknowledgments --- p.iii / List of Figures --- p.ix / List of Tables --- p.xiii / Chapter 1 --- Introduction --- p.1 / Chapter 1.1 --- Motivation and Objectives --- p.1 / Chapter 1.2 --- Contributions --- p.3 / Chapter 1.3 --- Organization of the Thesis --- p.4 / Chapter 2 --- Devices and Fabrication Processes --- p.5 / Chapter 2.1 --- Introduction --- p.5 / Chapter 2.2 --- BJTs --- p.6 / Chapter 2.2.1 --- Structure and Modeling of BJTs --- p.6 / Chapter 2.2.2 --- Standard BJT Process and BJT Characteristics --- p.7 / Chapter 2.3 --- MOSFETs and Complementary MOS (CMOS) --- p.8 / Chapter 2.3.1 --- Structure and Modeling of MOSFETs --- p.8 / Chapter 2.3.2 --- Standard n-well CMOS Process and MOSFETs Charac- teristics --- p.11 / Chapter 2.4 --- BiCMOS Technology --- p.13 / Chapter 2.5 --- Summary --- p.14 / Chapter 3 --- Matching Properties --- p.15 / Chapter 3.1 --- Introduction --- p.15 / Chapter 3.2 --- Importance of Matched Devices in IC Design --- p.15 / Chapter 3.2.1 --- What is Matching? --- p.15 / Chapter 3.2.2 --- Low-power Systems --- p.16 / Chapter 3.2.3 --- Device Size Downward Scaling --- p.16 / Chapter 3.2.4 --- Analog Circuits and Analog Computing --- p.17 / Chapter 3.3 --- Measurement of Mismatch --- p.18 / Chapter 3.3.1 --- Definitions and Statistics of Mismatch --- p.18 / Chapter 3.3.2 --- Types of Mismatches --- p.20 / Chapter 3.3.3 --- Matching Properties of MOSFETs --- p.23 / Chapter 3.3.4 --- Matching Properties of BJTs and CLBTs --- p.27 / Chapter 3.4 --- Summary --- p.30 / Chapter 4 --- CMOS Compatible Lateral Bipolar Transistors (CLBTs) --- p.31 / Chapter 4.1 --- Introduction --- p.31 / Chapter 4.2 --- Structure and Operation --- p.32 / Chapter 4.3 --- DC Model of CLBTs --- p.34 / Chapter 4.4 --- Residual Gate Effect in Accumulation --- p.35 / Chapter 4.5 --- Main Characteristics of CLBTs --- p.37 / Chapter 4.5.1 --- Low Early Voltage --- p.37 / Chapter 4.5.2 --- Low Lateral Current Gain at High Current Levels --- p.38 / Chapter 4.5.3 --- Other Issues --- p.39 / Chapter 4.6 --- Enhanced CLBTs with Cascode Circuit --- p.40 / Chapter 4.7 --- Applications --- p.41 / Chapter 4.8 --- Design and Layout of CLBTs --- p.42 / Chapter 4.9 --- Experimental Results of Single pnp CLBT； nMOSFET and pMOSFET --- p.44 / Chapter 4.9.1 --- CLBT Gains --- p.46 / Chapter 4.9.2 --- Gate Voltage Required for Pure Bipolar Action --- p.47 / Chapter 4.9.3 --- I ´ؤ V and Other Characteristics of Bare pnp CLBTs --- p.49 / Chapter 4.9.4 --- Transfer Characteristics of a Cascoded pnp CLBT --- p.50 / Chapter 4.9.5 --- Transfer Characteristics of an nMOSFET --- p.51 / Chapter 4.9.6 --- Transfer Characteristics of Cascoded and Bare CLBTs Operating as pMOSFETs --- p.52 / Chapter 4.10 --- Summary --- p.53 / Chapter 5 --- Experiments on Matching Properties --- p.54 / Chapter 5.1 --- Introduction --- p.54 / Chapter 5.2 --- Objectives --- p.55 / Chapter 5.3 --- Technology --- p.57 / Chapter 5.4 --- Design of Testing Arrays --- p.57 / Chapter 5.4.1 --- nMOSFET Array --- p.57 / Chapter 5.4.2 --- pnp CLBT Array --- p.59 / Chapter 5.5 --- Design of Input and Output Pads (I/O Pads) --- p.62 / Chapter 5.6 --- Shift Register --- p.62 / Chapter 5.7 --- Experimental Equipment --- p.63 / Chapter 5.8 --- Experimental Setup for Matching Properties Measurements --- p.65 / Chapter 5.8.1 --- Setup for Measuring the Mismatches of the Devices --- p.65 / Chapter 5.8.2 --- Testing Procedures --- p.68 / Chapter 5.8.3 --- Data Analysis --- p.68 / Chapter 5.9 --- Matching Properties --- p.69 / Chapter 5.9.1 --- Matching Properties of nMOSFETs --- p.69 / Chapter 5.9.2 --- Matching Properties of CLBTs --- p.71 / Chapter 5.9.3 --- Matching Properties of pMOSFETs --- p.73 / Chapter 5.9.4 --- "Comments on the Matching Properties of CLBT, nMOSFET, and pMOSFET" --- p.76 / Chapter 5.9.5 --- "Mismatch in CLBT, nMOSFET, and pMOSFET Cur- rent Mirrors" --- p.77 / Chapter 5.10 --- Summary --- p.79 / Chapter 6 --- Conclusion --- p.80 / Chapter A --- Floating Gate Technology --- p.82 / Chapter A.1 --- Floating Gate --- p.82 / Chapter A.2 --- Tunnelling --- p.83 / Chapter A.3 --- Hot Electron Effect --- p.85 / Chapter A.4 --- Summary --- p.86 / Chapter B --- A Trimmable Transconductance Amplifier --- p.87 / Chapter B.1 --- Introduction --- p.87 / Chapter B.2 --- Trimmable Transconductance Amplifier using Floating Gate Com- patible Lateral Bipolar Transistors (FG-CLBTs) --- p.87 / Chapter B.2.1 --- Residual Gate Effect and Collector Current Modulation --- p.89 / Chapter B.2.2 --- Floating Gate CLBTs --- p.92 / Chapter B.2.3 --- Electron Tunnelling --- p.93 / Chapter B.2.4 --- Hot Electron Injection --- p.94 / Chapter B.2.5 --- Experimental Results of the OTA --- p.94 / Chapter B.2.6 --- Experimental Results of the FGOTA --- p.96 / Chapter B.3 --- Summary --- p.97 / Chapter C --- AMI-ABN 1.5μm n-well Process Parameters (First Batch) --- p.98 / Chapter D --- AMI-ABN 1.5μm n-well Process Parameters (Second Batch) --- p.101 / Bibliography --- p.104