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Surface Chemistry Of Application Specific Pads And Copper Chemical Mechanical PlanarizationDeshpande, Sameer Arun 01 January 2004 (has links)
Advances in the interconnection technology have played a key role in the continued improvement of the integrated circuit (IC) density, performance and cost. Copper (Cu) metallization, dual damascenes processing and integration of copper with low dielectric constant material are key issues in the IC industries. Chemical mechanical planarization of copper (CuCMP) has emerged as an important process for the manufacturing of ICs. Usually, Cu-CMP process consists of several steps such as the removal of surface layer by mechanical action of the pad and the abrasive particles, the dissolution of the abraded particles in the CMP solution, and the protection of the recess areas. The CMP process occurs at the atomic level at the pad/slurry/wafer interface, and hence, slurries and polishing pads play critical role in its successful implementation. The slurry for the Cu-CMP contains chemical components to facilitate the oxidation and removal of excess Cu as well as passivation of the polished surface. During the process, these slurry chemicals also react with the pad. In the present study, investigations were carried out to understand the effect of hydrogen peroxide (H2O2) as an oxidant and benzotriazole (BTA) as an inhibitor on the CMP of Cu. Interaction of these slurry components on copper has been investigated using electrochemical studies, x-ray photoelectron spectroscopy (XPS) and secondary ion mass spectroscopy (SIMS). In the presence of 0.1M glycine, Cu removal rate was found to be high in the solution containing 5% H2O2 at pH 2 because of the Cu-glycine complexation reaction. The dissolution rate of the Cu was found to increase due to the formation of highly soluble Cu-glycine complex in the presence of H2O2. Addition of 0.01M BTA in the solution containing 0.1M glycine and 5% H2O2 at pH 2 exhibited a reduction in the Cu removal rate due to the formation of Cu-BTA complex on the surface of the Cu further inhibiting the dissolution. XPS and SIMS investigations revealed the formation of such Cu-glycine complex, which help understand the mechanism of the Cu-oxidant-inhibitor interaction during polishing. Along with the slurry, pads used in the Cu-CMP process have direct influence an overall process. To overcome problems associated with the current pads, new application specific pad (ASP) have been developed in collaboration with PsiloQuest Inc. Using plasma enhanced chemical vapor deposition (PECVD) process; surface of such ASP pads were modified. Plasma treatment of a polymer surface results in the formation of various functional groups and radicals. Post plasma treatment such as chemical reduction or oxidation imparts a more uniform distribution of such functional groups on the surface of the polymer resulting in unique surface properties. The mechanical properties of such coated pad have been investigated using nanoindentation technique in collaboration with Dr. Vaidyanathan’s research group. The surface morphology and the chemistry of the ASP are studied using scanning electron microcopy (SEM), x-ray photoelectron spectroscopy (XPS), and fourier transform infrared spectroscopy (FTIR) to understand the formation of different chemical species on the surface. It is observed that the mechanical and the chemical properties of the pad top surface are a function of the PECVD coating time. Such PECVD treated pads are found to be hydrophilic and do not require being stored in aqueous medium during the not-in-use period. The metal removal rate using such surface modified polishing pad is found to increase linearly with the PECVD coating time. Overall, this thesis is an attempt to optimize the two most important parameters of the Cu-CMP process viz. slurry and pads for enhanced performance and ultimately reduce the cost of ownership (CoO).
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The chemical and mechanical effects of binding chitosan to implant quality titaniumMartin, Holly Joy 09 December 2006 (has links)
Biomedical implants are commonly made from commercially pure titanium and other metal alloys, which are chosen for their strength and density. To improve the stability and promote bone cell growth into the implant, efforts to bond coatings to metal have been extensively studied. Many coatings used are considered bioactive, which promote the adhesion and growth of the bone cells surrounding the implant [A.1]. Of these, the most commonly investigated coating is a ceramic called hydroxyapatite, which is brittle, leading to flaking and inadequate bone cell growth [A.2]. Alternate bioactive coatings are being examined, including chitosan, the deacetylated form of chitin. Chitin is the second most abundant polymer in nature [A.3] and is found in the exoskeletons of insects and shellfish [A.4]. Chitosan has been proven to have excellent biocompatibility [A.5], be non-toxic [A.3], and promote the adhesion and growth of bone cells [A.6 ? A.7]. In this research, four treatment combinations were developed and tested in an attempt to improve film bonding. These treatment combinations were created using one of two silane molecules, aminopropyltriethoxysilane and triethoxsilylbutyraldehyde, and one of two metal treatments, passivation and piranha treatment. XPS was used to characterize the reaction steps for each of the treatment combinations. A significant decrease in TiO, along with significant increases in SiOx groups, C ? N ? H, and C = O, indicated that the reactions were proceeding as expected. XPS also indicated that, chemically, the chitosan films were not significantly different and were unchanged by the treatment combinations. Following chemical analysis, mechanical testing was performed on the four treatment combinations. No changes to the bulk properties were seen as demonstrated by nano-indentation, further indicating that the four treatment combinations did not change the chemical properties of chitosan. The bulk adhesion of the films was greatly improved for all four treatment combinations, as demonstrated by tensile testing. The highest value from this research, 19.50 ± 1.63 MPa, was significantly higher than the previously published results of 1.6 ? 1.8 MPa [A.10]. Overall, the treatments developed in this study significantly improved the adhesion of the chitosan film on the titanium substrate, without modifying the chemical or structural properties of chitosan. [A.1] Ratner, B. D. and A. S. Hoffman. Biomaterials Science: An Introduction to Materials in Medicine. California: Academic Press, Inc., 1996, Foreword, 1-8. [A.2] S.D. Cook, K.A. Thomas, J.F. Kay. ?Experimental Coating Defect in Hydroxylapatite-Coated Implants.? Clinical Orthopaedics and Related Research, 1992, 265, 280-290. [A.3] A.K. Singla, M. Chawla. ?Chitosan: some pharmaceutical and biological aspects- an update.? Journal of Pharmacy and Pharmacology, 2001, 53, 1047-1067. [A.4] Q. Li, E.T. Dunn, E.W. Grandmaison, M.F.A. Goosen. ?Application and Properties of Chitosan.? Journal of Bioactive and Compatible Polymers, 1992, 7, 370-397. [A.5] M. Prasitsilp, R. Jenwithisuk, K. Kongsuwan, N. Damrongchai, P. Watts. ?Cellular responses to chitosan in vitro: The importance of deacetylation.? Journal of Materials Science: Materials in Medicine, 2000, 11, 773-778. [A.6] R.A.A. Muzzarelli, M. Mattioli-Belmonte, A. Pugnaloni, G. Biagini. ?Biochemistry, histology, and clinical uses of chitins and chitosans in wound healing.? Chitin and Chitinases, ed. P. Jolles, R.A.A. Muzzarelli, Switzerland: Birkhauser Verlag Basel, 1990. [A.7] P. Klokkevold, L. Vandemark, E.B. Kenney, G.W. Bernard. ?Osteogenesis Enhanced by Chitosan (Poly-N-Acetyl Glucosaminoglycan) In Vitro.? Journal of Periodontology, 1996, 67, 1170-1775. [A.8] J.D. Bumgardner, R. Wiser, P.D. Gerard, P. Bergin, B. Chestnutt, M. Marini, V. Ramsey, S.H. Elder, J.A. Gilbert. ?Chitosan: potential use as a bioactive coating for orthopaedic and craniofacial/dental implants.? Journal of Biomaterials Science, Polymer Edition, 2003, 14 (5), 423-438.
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SURFACE CHEMISTRY OF METAL CATALYST UNDER CARBON NANOTUBE GROWTH CONDITIONSBack, Tyson Cody 05 May 2010 (has links)
No description available.
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MOLECULAR STRUCTURE OF INTERFACES FORMED WITH PLASMA POLYMERIZED SILICA-LIKE PRIMER FILMSTURNER, ROBERT HAINES 11 October 2001 (has links)
No description available.
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Surface Characterization and Comparison of Contact vs. Non-Contact Printed Sol-Gel Derived Material MicroarraysHelka, Blake-Joseph 25 September 2014 (has links)
<p>Fabrication of microarrays using sol-gel immobilization has been utilized as an approach to develop high density biosensors. Microarray fabrication using various printing techniques including pin-printing and piezoelectric ink jet printing methods has been demonstrated. However, only limited characterization to understand the encapsulated biomolecule-material interface has been reported. Herein, Chemical characterization using X-ray photoelectron spectroscopy (XPS) and infrared spectroscopy (IR) on pin-printed microarrays of sol-gel derived acetylcholinesterase (AChE) microarrays is reported. Furthermore, the <em>in situ</em> fabrication of microarrays following the sol-gel process using piezoelectric ink jet printing methods was explored. Through techniques measuring solution viscosity, surface tension and particle size, important aspects of bio-ink formulation for piezoelectric ink jet printing were identified. Combined, a greater understanding towards the fabrication and characterization of sol-gel derived microarrays was achieved through this exploratory research.</p> / Master of Science (MSc)
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Interfacial Characterization of Chemical Vapor Deposition (Cvd) Grown Graphene and Electrodeposited Bismuth on Ruthenium SurfaceAbdelghani, Jafar 05 1900 (has links)
Graphene receives enormous attention owing to its distinctive physical and chemical prosperities. Growing and transferring graphene to different substrates have been investigated. The graphene growing on the copper substrate has an advantage of low solubility of carbon on the copper which allow us to grow mostly monolayer graphene. Graphene sheet of few centimeters can be transferred to 300nm silicon oxide and quartz crystal pre-deposited with metal like Cu and Ru. Characterization of the graphene has been done with Raman and contact angle measurement and recently quartz crystal microbalance (QCM) has been employed. The underpotential deposition (UPD) process of Bi on Ru metal surface is studied using electrochemical quartz crystal microbalance (EQCM) and XPS techniques. Both Bi UPD and Bi bulk deposition are clearly observed on Ru in 1mM Bi (NO3)3/0.5M H2SO4. Bi monolayer coverage calculated from mass (MLMass) and from charge (MLCharge) were compared with respect to the potential scanning rates, anions and ambient controls. EQCM results indicate that Bi UPD on Ru is mostly scan rate independent but exhibits interesting difference at the slower scan. Bi UPD monolayer coverage calculated from cathodic frequency change (ΔfCathodic) is significantly smaller than the monolayer coverage derived from integrated charge under the cathodic Bi UPD peak when scan rate is at least 5 mV/s. XPS is utilized to explore the detailed chemical composition of the observed interfacial process of Bi UPD on Ru.
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Development of Novel Semi-conducting Ortho-carborane Based Polymer Films: Enhanced Electronic and Chemical PropertiesPasquale, Frank L. 08 1900 (has links)
A novel class of semi-conducting ortho-carborane (B10C2H12) based polymer films with enhanced electronic and chemical properties has been developed. The novel films are formed from electron-beam cross-linking of condensed B10C2H12 and B10C2H12 co-condensed with aromatic linking units (Y) (Y=1,4-diaminobenzene (DAB), benzene (BNZ) and pyridine (PY)) at 110 K. The bonding and electronic properties of the novel films were investigated using X-ray photoelectron spectroscopy (XPS), UV photoelectron spectroscopy (UPS) and Mulliken charge analysis using density functional theory (DFT). These films exhibit site-specific cross-linking with bonding, in the pure B10C2HX films, occurring at B sites non-adjacent to C in the B10C2H12 icosahedra. The B10C2H12:Y films exhibit the same phenomena, with cross-linking that creates bonds primarily between B sites non-adjacent to C in the B10C2H12 icosahedra to C sites in the Y linking units. These novel B10C2HX: Y linked films exhibit significantly different electron structure when compared to pure B10C2HX films as seen in the UPS spectra. The valence band maxima (VBM) shift from - 4.3 eV below the Fermi level for pure B10C2HX to -2.6, -2.2, and -1.7 for B10C2HX:BNZ, B10C2HX:PY, and B10C2HX:DAB, respectively. The top of the valence band is composed of states derived primarily from the Y linking units, suggesting that the bottom of the conduction band is composed of states primarily from B10C2H12. Consequently these B10C2HX:Y films may exhibit longer electron-hole separation lifetimes as compared to pure B10C2HX films. This research should lead to an enhancement of boron carbide based neutron detectors, and is of potential significance for microelectronics, spintronics and photo-catalysis.
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Bipolar electrochemistry for high throughput screening applicationsMunktell, Sara January 2016 (has links)
Bipolar electrochemistry is an interesting concept for high throughput screening techniques due to the ability to induce gradients in a range of materials and their properties, such as composition, particle size, or dopant levels, among many others. One of the key advantages of the method is the ability to test, create or modify materials without the need for a direct electrical connection. In this thesis, the viability of this method has been explored for a range of possible applications, such as metal recycling, nanoparticle modification and corrosion analysis. In the initial part of the work a process to electrodeposit gradients in metal composition was evaluated, with a view to applying the technique to the extraction and recycling of metals from fly ash. Compositional gradients in the metals under study could be readily obtained from controlled reference solutions, although the spatial resolution of the metals was not sufficient to perform separation. Only copper could be easily deposited from the fly ash solution. Bipolar electrodeposition was also successfully used to modify the particle size across substrates decorated with gold nanoparticles. The approach was demonstrated both for surfaces possessing either a uniform particle density or a gradient in particle density. In the latter case samples with simultaneous, orthogonal gradients in both particle size and density were obtained. A combination of the bipolar approach with rapid image analysis was also evaluated as a method for corrosion screening, using quantitative analysis of gradients in pitting corrosion damage on stainless steels in HCl as a model system. The factors affecting gradient formation and the initiation of corrosion were thoroughly investigated by the use of a scanning droplet cell (SDC) technique and hard x-ray photoelectron spectroscopy (HAXPES). The ability to screen arrays of different materials for corrosion properties was also investigated, and demonstrated for stainless steel and Ti-Al alloys with pre-formed compositional gradients. The technique shows much promise for further studies and for high throughput corrosion screening applications.
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Electronic structure of TiO2-based photocatalysts active under visible lightOropeza Palacio, Freddy Enrique January 2011 (has links)
This thesis is concerned with furthering our understanding of the basis of visible region photocatalytic activity exhibited by doped TiO2-based materials. A range of experimental techniques including high resolution X-ray photoemission spectroscopy and diffuse reflectance spectroscopy are used to investigate electronic structure and an attempt is made to link these results to the observed photocatalytic activity. Both anionic (N) and cationic (Rh and Sn) dopants are investigated. [See pdf file for full abstract].
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FUNDAMENTAL INSIGHTS OF PLANAR AND SUPPORTED CATALYSTSCory A. Milligan (5930045) 10 June 2019 (has links)
<p>A fundamental understanding of
heterogeneous catalysis requires analysis of model catalytic surfaces in tandem
with complex technical catalysts. This work was divided in three areas, 1-
preparation and characterization of model surfaces synthesized by vapor
deposition techniques, 2- kinetic evaluation of model catalysts for formic acid
decomposition and dry methane reforming, 3- characterization and kinetic
evaluation of technical catalysts for the water gas shift reaction.</p>
<p>In the first project, model PdZn
intermetallic surfaces, a relevant catalyst for propane dehydrogenation, were
prepared using an ALD approach. In this work, model surfaces were synthesized
by exposing Pd(111) and Pd(100) surfaces to diethylzinc at ca. 10<sup>-6 </sup>mbar.
Several different surface structures were identified by careful control of the
deposition temperature of the substrate. Modifications in the adsorption
properties of these surfaces towards carbon monoxide and propylene coincided
with the structure of the PdZn surface layer. </p>
<p>In the second project, formic acid
decomposition kinetics were evaluated on model Pt catalysts. Formic acid
decomposition was found to be structure-insensitive on Pt(111), Pt(100), and a
polycrystalline foil under standard reaction conditions. CO selectivity
remained < 1% for conversions <10%. Additionally, inverse Pd-Zr model
catalysts were prepared by ALD of zirconium-t-butoxide (ZTB). Depending on
treatment conditions, either ZrO<sub>x</sub>H<sub>y</sub> or ZrO<sub>2</sub>
overlayers or Zr as sub-nanometer clusters could be obtained. The activity of
the model catalyst surface towards dry reforming of methane if the initial
state of the zirconium is metallic. </p>
<p>In the third project, Au/Fe<sub>3</sub>O<sub>4</sub>
heterodimer catalysts were characterized for their thermal stability. In-situ
TEM and XPS characterization demonstrates that the gold nanoparticles transform
into gold thin films that wet the Fe<sub>3</sub>O<sub>4</sub> surface as the
reduction of the oxide proceeds. DFT calculations show that the adhesion energy
between the Au film is increased on a partially reduced Fe<sub>3</sub>O<sub>4</sub>
surface. Additionally, Pt/Nb<sub>2</sub>CT<sub>x</sub> catalysts were
characterized and kinetics evaluated for the water gas shift reaction. XPS and
TEM characterization indicates that a Pt-Nb surface alloy is formed under
moderate reduction temperatures, 350<sup>O</sup>C. Water-gas shift reaction
kinetics reveal that the alloy-MXene interface exhibit high H<sub>2</sub>O
activation ability compared to a non-reducible support or bulk niobium carbide.
</p>
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