Ultraviolet-Assisted Direct Ink Write (UV-DIW) is a material extrusion additive manufacturing (AM) technology in which a viscous ink, often at room temperature, is selectively extruded through a translating nozzle to selectively deposit material. The extruded ink is solidified via UV irradiation (photocuring) and three-dimensional parts are created by repeating the process in a layer-by-layer fashion. UV-DIW is an attractive AM technology due to its ability to (1) extrude highly viscous inks (i.e. >10,000 Pa·s if ink exhibits shearthinning behavior) (2) the promise of leveraging the broad photopolymer material library and chemistries established for other AM technologies capable of processing photopolymers and (3) the promise of processing a wide range of inks, which enables the fabrication of metal, ceramic, polymer, bio-based, and multi-material parts. Currently, the technology faces a few shortcomings including (1) limited material selection for UV-DIW due to requirement for inks to be photocurable and limited mechanical properties of photocurable materials (2) lack of feature resolution and topological complexity of printed parts and (3) lack of material screening models providing robust definition of the material requirements (e.g., viscosity, cure time, strength) for successful UV-DIW printing. To address these shortcomings, the goal of this work is to gain a fundamental understanding of the rheological and reactive properties required for successful Ultraviolet-Assisted Direct Ink Write (UV-DIW). The first approach to answering the fundamental research question is establishing the existing rheology experiments used to characterize DIW inks and the relationships between rheology and printability. An in-depth literature review of the techniques and relationships was compiled to better understand ink requirements for successful printing (Chapter 2). This broad survey is not limited to only UV-DIW, but includes all variations of DIW. The first part of the review provides a summary of the rheological experiments that have been used to characterize a wide variety of DIW inks. The second part of this review focuses on the connections between rheology and printability. This survey helps identify the required rheological properties for successful printing that is then used throughout the rest of this work. Additionally, this review identifies shortcomings in current work and proposes areas for future work. From this exhaustive literature review, a systematic roadmap was developed that investigators can follow to quickly characterize the printability of new inks, independent of that ink's specific attributes (Chapter 3). The roadmap simplifies the trends identified in literature into a brief and intuitive guide to the rheology experiments relevant to DIW printing and the relationship between those experiment and printing results. The roadmap was demonstrated by evaluating the printability of two inks: (1) a silicone ink with both yield-stress and reactive curing behavior and (2) urethane acrylate inks with photocuring behavior. Experimental printing studies were used to support the conclusions on printability made in the roadmap. The second main approach focuses on the development of three novel UV-DIW inks to address the current limited material selection for UV-DIW and help better understand the rheological and reactive properties required for successful printing. For the three novel UVDIW inks, the iterative process of ink synthesis, analysis of ink rheology, and printability evaluation was detailed. Data from the development process contributed to gaining a fundamental understanding of how rheology and reactivity affect printability. The three inks each had novel rheological properties that impacted their printing behavior: (1) photocuring (2) yield-stress behavior + photocuring and (3) photocuring + thermal curing. Additionally, each ink had unique properties that expands material selection for UV-DIW including (1) an all-aromatic polyimide possessing a storage modulus above 1 GP a up to 400 °C (Chapter 4), (2) a styrene butadiene rubber (SBR) nanocomposite with elongation at break exceeding 300 % (Chapter 5), and (3) a dual-cure ink enabling the printing of inks containing over 60 vol% highly opaque solids (Chapter 6). The third approach details the development of two UV-DIW process models to better understand the process physics of the UV-DIW process and give insight to the properties of a successful ink. The first process model uses data from photorheology experiments to model how a photocurable ink spreads upon deposition from the nozzle, accounting for transient UV curing behavior (Chapter 7). This model allows for the rapid evaluation of an ink's behavior during the solidification sub-function of UV-DIW solely based on its rheology, without the time-consuming process of trial-and-error printing or complex computer simulations. The second process model combines modeling with a novel experimental method that uses a UV photorheometer to accurately characterize the relationship between cure depth and UV exposure for a wide range of photopolymers (Chapter 8). This model helps understand an inks photocuring behavior and ensure a sufficient cure depth is produced to adhere to the previous layer in UV-DIW printing. Lastly, two UV-DIW process modifications are introduced to address research gaps of printing high resolution features and limited material selection. A hybrid DIW + Vat Photopolymerization system is presented to improve the feature size and topographical complexities of parts, while still retaining UV-DIW's ability to print with very high viscosity photoresins (Chapter 9). A high temperature Heated-DIW system is presented to heat inks to over 300 °C and ultimately enable printing of poly(phenylene sulfide) aerogels (Chapter 10). In enabling the DIW of poly(phenylene sulfide) aerogels, the production of ultra-lightweight thermally insulating components for applications in harsh environments is enabled. With the use of additive manufacturing, hierarchical porosity on the macroscale is enabled in addition to the meso-scale porosity inherent to the aerogels. / Doctor of Philosophy / Direct Ink Write (DIW) is a type of three-dimensional (3D) printing that is used to automatically produce a range of 3D geometries. Specifically, the DIW process selectively extrudes a viscous ink, similar in consistency to peanut butter or toothpaste, through a small moving nozzle to create the features of each layer. This process is like using a frosting bag to decorate a cake with icing. Three-dimensional parts are created by repeating this process and depositing layer on top of layer. While seemingly a straightforward process, it remains relatively unclear what properties an ink needs to produce quality parts. To produce quality parts, the ink first needs to be extruded from the nozzle to form homogenous beads with a constant width and free from breaks. Second, the extruded ink needs to retain the shape that it was deposited in. If the ink spreads excessively, the as-deposited features will be lost and a part resembling a blob will be produced. Lastly, the ink deposited on the first layers needs to have enough strength to support the weight of the part. Otherwise, the part will collapse akin to the Leaning Tower of Pisa. To achieve all three steps and produce a quality part, a successful ink needs to be able to flow through the nozzle and then solidify upon deposition. This work focuses on a specific process called Ultraviolet-Assisted Direct Ink Write (UV-DIW) where materials that solidify when exposed to UV light, called photopolymers, are printed. Currently, the properties of the inks, especially how they cure when exposed to UV light, that produce successful printing remains unclear. This work focuses on understanding how the properties of the photopolymer inks affect the printing behavior of the ink. The ultimate goal of this work is to develop guidelines for the properties of successful inks which will help others develop the next generation of materials printed via UV-DIW. Specifically, experiments are used study how inks behave when they flow through the nozzle (rheology) and then solidify when exposed to UV light (reactivity). This behavior is then connected to the inks printing behavior (printability). In working to better understand the connection between rheology, reactivity, and printability multiple approaches were used. These approaches include the development of new materials for printing via UV-DIW, development of a modified UV-DIW printing process that reduces the size of the printed features, and development of models to predict how inks will behave during printing. The new plastic materials that were developed and successfully printed via UV-DIW have outstanding properties including remaining strong up to 400 °C, being extremely flexible, and a plastic containing a large fraction of a solid filler. With each new material, the formulation was varied to change the inks rheological and reactive properties until successful UV-DIW was enabled. Each new formulation introduced material capabilities not previously available to DIW 3D printing. Then, A modified UV-DIW process was developed that takes advantage of the reactivity of the photopolymers to enable the printing of high-resolution features and shapes not previously possible via DIW 3D printing. In this novel process, a projector is used to project patterned UV light at the material and selectively cure small portions of the deposited material, instead of curing all the deposited material. After printing, the uncured ink is washed away resulting in features much smaller than what can be produced when directly extruding them. Finally, the developed process models use the relatively simple rheology and reactivity experiments, to predict how an ink behaves during the UV-DIW process. Using the results of these experiments and the developed models, the inks behavior during the printing process is predicted. These models allow for the properties of new inks to be quickly measured and their printing behavior predicted. New ink formulations can be quickly screened, and optimal process parameters predicted. Overall, this work produces guidelines for the rheological and reactive properties required of a photopolymer ink to produce successful UV-DIW printing. Future researchers can use these guidelines to develop the next generation of materials printed via UV-DIW more easily.

A cyber manufacturing system (CMS) is a concept generated from the cyber-physical system (CPS), providing adequate data and computation resources to support efficient and optimal decision making. Examples of these decisions include production control, variation reduction, and cost optimization. A CMS integrates the physical manufacturing equipment and computation resources via Industrial Internet, which provides low-cost Internet connections and control capability in the manufacturing networks. Traditional quality engineering methodologies, however, typically focus on statistical process control or run-to-run quality control through modeling and optimization of an individual process, which makes it less effective in a CMS with many manufacturing systems connected. In addition, more personalization in manufacturing generates limited samples for the same kind of product designs, materials, and specifications, which prohibits the use of many effective data-driven modeling methods. Motivated by Additive Manufacturing (AM) with the potential to manufacture products with a one-of-a-kind design, material, and specification, this dissertation will address the following three research questions: (1) how can in situ data be used to model multiple similar AM processes connected in a CMS (Chapter 3)? (2) How to improve the accuracy of the low-fidelity first-principle simulation (e.g., finite element analysis, FEA) for personalized AM products to validate the product and process designs (Chapter 4) in time? (3) And how to predict the void defect (i.e., unmeasurable quality variables) based on the in situ quality variables. By answering the above three research questions, the proposed methodology will effectively generate in situ process and quality data for modeling multiple connected AM processes in a CMS. The research to quantify the uncertainty of the simulated in situ process data and their impact on the overall AM modeling is out of the scope of this research. The proposed methodologies will be validated based on fused deposition modeling (FDM) processes and selective laser melting processes (SLM). Moreover, by comparing with the corresponding benchmark methods, the merits of the proposed methods are demonstrated in this dissertation. In addition, the proposed methods are inherently developed with a general data-driven framework. Therefore, they can also potentially be extended to other applications and manufacturing processes. / Doctor of Philosophy / Additive manufacturing (AM) is a promising advanced manufacturing process that can realize the personalized products in complex shapes with unprecedented materials. However, there are many quality issues that can restrict the wide deployment of AM in practice, such as voids, porosity, cracking, etc. To effectively model and further mitigate these quality issues, the cyber manufacturing system (CMS) is adopted. The CMS can provide the data acquisition functionality to collect the real-time process data which directly or indirectly related to the product quality in AM. Moreover, the CMS can provide the computation capability to analyze the AM data and support the decision-making to optimize the AM process. However, due to the characteristics of AM process, there are several challenges effectively and efficiently model the AM data. First, there are many one-of-a-kind products in AM, and leads to limited observations for each product that can support to estimate an accurate model. Therefore, in Chapter 3, I would like to discuss how to jointly model personalized products by sharing the information among these similar-but-non-identical AM processes with limited observations. Second, for personalized product realization in AM, it is essential to validate the product and process designs before fabrication quickly. Usually, finite element analysis (FEA) is employed to simulate the manufacturing process based on the first-principal model. However, due to the complexity, the high-fidelity simulation is very time-consuming and will delay the product realization in AM. Therefore, in Chapter 4, I would like to study how to predict the high-fidelity simulation result based on the low-fidelity simulation with fast computation speed and limited capability. Thirdly, the defects of AM are usually inside the product, and can be identified by the X-ray computed tomography (CT) images after the build of the AM products. However, limited by the sensor technology, CT image is difficult to obtain for online (i.e., layer-wise) defect detection to mitigate the defects. Therefore, as an alternative, I would like to investigate how to predict the CT image based on the optical layer-wise image, which can be obtained during the AM process in Chapter 5. The proposed methodologies will be validated based on two types of AM processes: fused deposition modeling (FDM) processes and selective laser melting processes (SLM).

The overall goal of this work is to expand the materials library for the fused filament fabrication (FFF) material extrusion additive manufacturing (AM) process through innovations in the FFF process, post-process, and polymer composition. This research was conducted at two opposing ends of the FFF-processing temperature: low processing temperature (<100 °C) for pharmaceutical applications and high processing temperatures (>300 °C) for high-performance structural polymer applications. Both applications lie outside the typical range for FFF (190-260 °C). To achieve these goals, both the material and process were modified. Due to the low processing temperature requirements for pharmaceutical active ingredients, a water-soluble, low melting temperature material (sulfonated poly(ethylene glycol)) series was used to explore how different counterions affect FFF processing. The strong ionic interaction within poly(PEG8k-co-CaSIP) resulted in the best print quality due to the higher viscosity (105 Pa∙s) allowing the material to hold shape in the melt and the high-nucleation producing small spherulites mitigating the layer warping. Fillers were then explored to observe if an ionic filler would produce a similar effect. The ionic filler (calcium chloride) in poly(PEG8k-co-NaSIP) altered the crystallization kinetics, by increasing the nucleation density and viscosity, resulting in improved printability of the semi-crystalline polymer. A methodology for embedding liquids and powders into thin-walled capsules was developed for the incorporation of low-temperature active ingredients into water-soluble materials that uses a higher processing temperature than the actives are compatible with. By tuning the thickness of the printed walls, the time of internal liquid release was controlled during dissolution. This technique was used to enable the release of multiple liquids and powders at different times during dissolution. To enable the printing of high-temperature, high-performance polymers, an inverted desktop-scale heated chamber with the capability of reaching over 300 °C was developed for FFF. The design was integrated onto a FFF machine and was used to successfully print polyphenylsulfone which resulted in a 48% increase in tensile strength (at 200 °C) when compared to printing at room temperature. Finally, the effects of thermal processing conditions for printing ULTEM® 1010 were studied by independently varying the i) nozzle temperature, ii) environment temperature, and iii) post-processing conditions. The nozzle temperature primarily enables flow through the nozzle and needs to be set to at least 360 °C to prevent under extrusion. The environment temperature limits the part warping, as it approaches Tg (217 °C), and improves the layer bonding by decreasing the rate of cooling that allows more time for polymer chain entanglement. Post-processing for a longer time above Tg (18 hrs at 260 °C) promotes further entanglement, which increases the part strength (50% increase in yield strength); however, the part is susceptible to deformation. A post-processing technique was developed to preserve the parts' shape by packing solid parts into powdered salt. / Doctor of Philosophy / Fused filament fabrication (FFF) is the most widely used additive manufacturing (also referred to as 3D printing) process in industry, education, and for hobbyists. However, there is a limited number of materials available for FFF, which limits the potential of using FFF to solve engineering problems. This work focuses on material and machine modifications to enable FFF for use in both pharmaceutical and structural applications. Specifically, many pharmaceutical active ingredients require processing temperatures lower than what FFF typically uses. A low-temperature water-soluble material was altered by incorporating salt ions and ionic fillers separately. The differences in the printability were directly correlated to the measured variations in the viscosity and crystallization material properties. Alternatively, a technique is presented to embed liquids and powders into thin-walled, water-soluble printed parts that are processed using typical FFF temperatures, where the embedded material remains cool. The release time of the embedded material during dissolution is controlled by the thickness of the capsule structure. For structural applications, a machine was developed to allow for the processing of high-performance, high-temperature polymers on a desktop-scale system. This system uses an inverted heated chamber that uses natural convection to be able to heat the air around the part and not the electric components of the machine. The heated environment allows the part to remain at a higher temperature for a longer time, which enables a better bond between printed layers to achieve high-strength printed parts using high-performance materials. This machine was used to characterize the thermal processing effect for printing the high-performance polymer ULTEM® 1010. The nozzle temperature, environment temperature, and post-processing were tested where i) a higher nozzle temperature (360 °C) increases strength and prevents under extrusion, ii) a higher environment temperature (≥200 °C) increases the strength by slowing cooling and decreases warping by limiting the amount of shrinkage the occurs during printing, and iii) post-processing in powdered salt (18 hrs at 260 °C) increases part strength (50%) by allowing the printed roads to fuse.

Additive Manufacturing (AM) provides a unique opportunity for fabrication of personalized medicine, where each oral dosage could be tailored to satisfy specific needs of each individual patient. Binder jetting, an easily scalable AM technique that is capable of processing the powdered raw material used by tablet manufacturers, is an attractive means for producing individualized pharmaceutical tablets. However, due to the low density of the printed specimens and incompatible binder-powder combination, tablets fabricated by this AM technology suffer from poor strength. The research is introducing an additional composition in the binder jetting powder bed (e.g., powdered sugar) could significantly enhance the compressive strength of the as-fabricated tablets, as compared with those tablets fabricated without the additional powder binding agent. However, no previous research demonstrated comprehensive approaches to enhance the poor performance of the 3D printed tablets. Therefore, the goal of this work is to identify processing techniques for improving the strength of binder jetted tablets, including the use of (i) novel jettable polymeric binders (e.g., 4-arm star polyvinylpyrrolidone (PVP), DI water, and different i) weight percentage of sorbitol binder) and (ii) introducing an additional powder binding agent into the powder bed (e.g.., different wt% of powdered sugar). / M.S. / Three-dimensional printing is well-known as 3D printing. 3D printing pills are printed from the 3D printer. As of today, we now stand on the brink of a fourth industrial revolution. By the remarkable technological advancements of the twenty-first century, manufacturing is now becoming digitized. Instead of using a large batch process as traditional, customized printlets with a tailored dose, shape, size, and release characteristics could be produced on- demand. The goal of developing pharmaceutical printing is to reduce the cost of labor, shorten the time of manufacturing, and tailor the pills for patients. And have the potential to cause a paradigm shift in medicine design, manufacture, and use. This paper aims to discuss the current and future potential applications of 3D printing in healthcare and, ultimately, the power of 3D printing in pharmaceuticals.

Hybridizing additive manufacturing (AM) structures and direct write (DW) deposition of conductive traces enables the design and physical creation of integrated, complex, and conformal electronics such as embedded electronics and complex routing on a fully AM structure. Although this hybridization has a promising outlook, there are several key AM substrate-related limitations that limit the final performance of these hybridized AM-DW electronic parts. These limitations include low-temperature processability (leading to high trace resistivity) and poor surface finish (leading to electronic shorts and disconnections). Recently discovered ultraviolet-assisted direct ink write (UV-DIW) all-aromatic polyimide (PI) provides an opportunity to address these previous shortcomings previously due to its high-temperature stability (450C) and superior surface finish (relative to other AM processes). The primary goal of this thesis is to characterize the integration of this UV-DIW PI with DW-printed conductive inks as a means for obtaining high-performance hybrid AM-DW electronics. This goal has been achieved through an investigation into the increased temperature stability of AM PI on the conductivity and adhesion of DW extrusion and aerosol jet (AJ) silver inks, determining the dielectric constant and dissipation factor of processed UV-DIW PI, and determining the achievable microwave application performance of UV-DIW PI. These performance measurements are compared to commercially-available PI film and relative to existing AM substrates, such as ULTEM 1010. The temperature stability of UV-DIW PI enabled higher-temperature post-processing for the printed silver traces, which decreased DIW trace resistivity from 14.94±0.55 times the value of bulk silver at 160 °C to 2.16±0.028 times the resistivity of bulk silver at 375 °C, and AJ silver trace resistivity from 5.27±0.013 times the resistivity of bulk silver at 200 °C to 1.95±0.15 times the resistivity of bulk silver at 350 °C. The adhesion of these traces was not negatively affected by higher processing temperatures, and the traces performed similarly on UV-DIW PI and commercial PI. Furthermore, at similar thicknesses, UV-DIW PI was found to have a similar dielectric constant and dissipation factor to commercial Dupont Kapton PI film from 1 kHz to 1 MHz, indicating its ability to perform highly as a dielectric electronics substrate. Finally, the decrease in resistivity was able to decrease the gap in microwave stripline transmission line performance when compared with ULTEM 1010 processed at 200°C, with peak 10 GHz S21 loss differences decreasing from 2.46 dB to 1.32 dB after increasing the UV-DIW processing temperature from 200 °C to 400°C. / Master of Science / Due to the extensive potential benefits and applications, researchers are looking to hybridize additive manufacturing (AM) processes with direct write (DW) techniques to directly print a 3D part with integrated electronics. Unfortunately, there are several key substrate-related limitations that hinder the overall performance of a part fabricated by hybrid AM-DW processes. Specifically, typical AM materials are not capable of providing an electronics substrate with combined sufficient surface resolution, surface finish, and high-temperature processing stability. However, the recent discovery of a novel AM-processable all-aromatic polyimide (PI) presents an opportunity for addressing these limitations as its printed form offers a high surface resolution, superior surface finish, and mechanical stability up to 400 °C. The primary goal of this thesis is to evaluate the benefits and drawbacks of this PI, processed via ultraviolet-assisted direct ink write (UV-DIW) AM, as an AM-DW electronics substrate. Specifically, the author characterized the effect of the increased temperature stability of the printed PI on the resultant conductivity and adhesion of silver inks printed via direct ink write (DIW) and aerosol jetting (AJ) DW processes. These results were also compared to the performance of the inks on commercial PI. Furthermore, the dielectric performance of printed PI was evaluated and compared to commercial PI. To demonstrate and evaluate the hybridized approach in a potential end-use application, the author also characterized the achievable microwave application performance of UV-DIW polyimide relative to the existing highest performance commercially available printed substrate material. The experiments in this thesis found an 83% and 66% decrease in resistivity from extrusion and AJ printed inks due to the ability of the printed PI to be processed at higher temperatures. Furthermore, UV-DIW PI was found to have similar dielectric properties to commercial PI film, which indicates that it can serve as a high-performance dielectric substrate. Finally, the high-temperature processing stability was able to decrease the performance gap in microwave application performance between the higher performing dielectric substrate, ULTEM 1010. These results show that UV-DIW could serve as a dielectric substrate for hybridized AM-DW electronic parts with higher performance and the ability to be deployed in harsher environments than previous AM-DW electronic parts explored in literature.

Multifunctional composites have gained significant interest as they enable the integration of sensing and communication capabilities into structural, lightweight composites. Researchers have explored additive manufacturing processes for creating these structures through selective patterning of electrically conductive materials onto composites. Thus far, multifunctional composite performance has been limited by the conductivity of functional materials used, and the methods of integration have resulted in compromises to both structural and functional performance. Integration methods have also imposed limitations on part geometry due to an inability to adequately deposit conductive material over concave surfaces. Proposed methods of integrating functional devices within composites have been shown to negatively affect their mechanical performance. This work presents a novel method for integrating printed electronics onto the interior surfaces of closed, complex continuous fiber composite structures via the transfer of selectively printed conductive inks from additively manufactured sacrificial tooling to the composite surface. The process is demonstrated by creating multifunctional composites via embossing printed electronics onto structural composites without negatively affecting the mechanical performance of the structure. Additionally, this process expands the ability to pattern devices onto complex surfaces and demonstrates that the transferred functionality is well integrated (adhered) with the composite surface. The process is further validated through the successful completion of two separate case studies. The first is the integration of a functioning strain gauge onto an S-glass/epoxy composite, while a second process demonstration shows a composite surface featuring a band stop filter at the X-band, otherwise known as a frequency selective surface (FSS), to show the process' suitability for high performance, aerospace grade multifunctional composites. / Master of Science / Significant interest has been given in the past few decades to strong, lightweight materials for structural purposes. Among these materials, specific interest has been paid to fiber-reinforced composites, which are made of strong fibers and advanced resins. Recently, researchers have tried to use electrically conductive inks and 3D printing techniques to put antennas and other devices onto composites. These composites could possess additional functions beyond their structural purpose and are therefore called multifunctional composites. So far, the performance of multifunctional composites has been limited by the methods used to add additional functions. These methods often result in a weaker composite material and poor performance of the added devices. In this work, a new method for integrating devices onto complex-shaped composite structures is demonstrated. This is done by printing a mold for a composite, then putting a conductive ink onto the mold and transferring the ink to the composite surface. This process is demonstrated without weakening the composite. Additionally, this process allows researchers to put devices onto complex surfaces and demonstrates that the devices are secured to the composite surface. The process is used to make two separate devices and combine them with a composites surface. The first demonstration is the integration of a functioning strain gauge (used to measure a change in material dimension) onto a structural composite, while a second process demonstration shows a composite surface featuring an electromagnetic filter, otherwise known as a frequency selective surface (FSS), to show the process' suitability for high performance, aerospace grade multifunctional composites.

In an effort to save weight, transportation and aerospace industries have increasing investigated magnesium alloys because of their high strength-to-weight ratio. Further efforts to save on material use and machining time have focused on the use of additive manufacturing. However, anisotropic properties can be caused by both the HCP structure of magnesium alloys as well as by layered effects left by typical additive manufacturing processes. Additive Friction Stir (AFS) is a relatively new additive manufacturing technology that yields wrought microstructure with isotropic properties. In this study, Additive Friction Stir (AFS) fabrication was used to fabricate WE43 magnesium alloy, with both atomized powder and rolled plate as filler material, into multilayered structures. It was found that the WE43 alloy made by AFS exhibited nearly isotropic tensile properties. With aging these properties exceeded the base material in the T5 condition. The toughness measured by Charpy impact testing also showed an increase over the base material. The relationships among tensile properties, Vickers microhardness, impact toughness, microstructure and thermal history are developed and discussed. / Master of Science

<p dir="ltr">Printed Circuit Boards have become a vital component in the connected world in which we live in today. They can be found in all electronic devices, but their shape and function has been limited by the manufacturing capabilities of PCBs. The methods for manufacturing PCBs are well researched and optimized but have pitfalls as they are only capable of producing two dimensional, planar devices. As the demand for more integrated circuitry and electronics in devices like wearable technologies increases so will the need for a more flexible method for producing PCBs.</p><p dir="ltr">The purpose of this study was to create and analyze a method of creating PCBs using multi-material 3D printing and an electroplating process. The analysis includes an experimental procedure that will conclude whether the specimens created can conduct electricity at the same level of traditionally manufactured PCBs. This research proposed a procedure for manufacturing the PCBs and a testing apparatus designed to inject current at a specified level into the specimens so that the voltage could be measured. This allowed for the resistance of the specimens to be calculated and compared to known values for common materials used in PCB manufacturing.</p><p><br></p>

Globally distributed additive manufacturing is a relatively new frontier in the field of product lifecycle management. Designers are independent of additive manufacturing services, often thousands of miles apart. Manufacturing data must be transmitted electronically from designer to manufacturer to realize the benefits of such a system. Unalterable blockchain legers can record transactions between customers, designers, and manufacturers allowing each to trust the other two without needing to be familiar with each other. Although trust can be established, malicious printers or customers still have the incentive to produce unauthorized or pirated parts. To prevent this, machine instructions are encrypted and electronically transmitted to the printing service, where an authorized printer decrypts the data and prints an approved number of parts or products. The encrypted data may include G-Code machine instructions which contain every motion of every motor on a 3D printer. Once these instructions are decrypted, motor drivers send control signals along wires to the printer's stepper motors. The transmission along these wires is no longer encrypted. If the signals along the wires are read, the motion of the motor can be analyzed, and G-Code can be reverse engineered. This thesis demonstrates such a threat through a simulated attack on a G-Code controlled device. A computer running a numeric controller and G-Code interpreter is connected to standard stepper motors. As G-Code commands are delivered, the magnetic field generated by the transmitted signals is read by a Hall Effect sensor. The rapid oscillation of the magnetic field corresponds to the stepper motor control signals which rhythmically move the motor. The oscillating signals are recorded by a high speed analog to digital converter attached to a second computer. The two systems are completely electronically isolated. The recorded signals are saved as a string of voltage data with a matching time stamp. The voltage data is processed through a Matlab script which analyzes the direction the motor spins and the number of steps the motor takes. With these two pieces of data, the G-Code instructions which produced the motion can be recreated. The demonstration shows the exposure of previously encrypted data, allowing for the unauthorized production of parts, revealing a security flaw in a distributed additive manufacturing environment. / Master of Science / Developed at the end of the 20th century, additive manufacturing, sometimes known as 3D printing, is a relatively new method for the production of physical products. Typically, these have been limited to plastics and a small number of metals. Recently, advances in additive manufacturing technology have allowed an increasing number of industrial and consumer products to be produced on demand. A worldwide industry of additive manufacturing has opened up where product designers and 3D printer operators can work together to deliver products to customers faster and more efficiently. Designers and printers may be on opposite sides of the world, but a customer can go to a local printer and order a part designed by an engineer thousands of miles away. The customer receives a part in as little time as it takes to physically produce the object. To achieve this, the printer needs manufacturing information such as object dimensions, material parameters, and machine settings from the designer. The designer risks unauthorized use and the loss of intellectual property if the manufacturing information is exposed. Legal protections on intellectual property only go so far, especially across borders. Technical solutions can help protect valuable IP. In such an industry, essential data may be digitally encrypted for secure transmission around the world. This information may only be read by authorized printers and printing services and is never saved or read by an outside person or computer. The control computers which read the data also control the physical operation of the printer. Most commonly, electric motors are used to move the machine to produce the physical object. These are most often stepper motors which are connected by wires to the controlling computers and move in a predictable rhythmic fashion. The signals transmitted through the wires generate a magnetic field, which can be detected and recorded. The pattern of the magnetic field matches the steps of the motors. Each step can be counted, and the path of the motors can be precisely traced. The path reveals the shape of the object and the encrypted manufacturing instructions used by the printer. This thesis demonstrates the tracking of motors and creation of encrypted machine code in a simulated 3D printing environment, revealing a potential security flaw in a distributed manufacturing system.

Wire and Arc Additive Manufacturing is a novel Additive Manufacturing technology. As a result, the process for progressing from a solid model to manufacturing code, i.e. the Part Programming process, is undeveloped. In this report the Part Programming process, unique for Wire and Arc Additive Manufacturing, has been investigated to answer three questions; What is the Part Programming process for Wire and Arc Additive Manufacturing? What are the requirements on the Part Programming process? What software can be used for the Part Programming process? With a systematic review of publications on Wire and Arc Additive Manufacturing and related subjects, the steps of the Part Programming process and its requirements have been clarified. The Part Programming process has been used for evaluation of software solutions, resulting in multiple recommendations for implemented usage. Verification of assumptions, made by the systematic review, has been done by physical experiments to give further credibility to the results.