To reduce electronics packaging lead time and potentially to reduce manufacturing cost, an innovative packaging process targeting rapid package prototyping (RPP) has been developed. The developed RPP process, which is based on a data-driven chip-first approach, provides electrical functionality as well as form factors for micro-systems packages. The key component of the RPP process is the nano-particle silver (NPS) interconnect. However, NPS has not yet been adequately proven for use in electronics packaging applications. Moreover, its adhesion to electronics packaging materials such as polyimide, benzocyclobutene (BCB), copper, and aluminum is found to be weak. Thus, improving the adhesion strength of NPS will be a key issue for reliable package prototypes with NPS interconnects. In this research, the adhesion of NPS to substrate materials is found to be attributed to particle adhesion and more specifically, van der Waals forces. An adhesion model based on the van der Waals force is suggested in order to predict NPS adhesion strength to packaging materials. A new adhesion test method that is based on a die shear test and a button shear test is developed to validate the NPS adhesion prediction model. The newly developed adhesion test method is generic in nature and can be extended to other thin films' adhesion tests. The NPS adhesion model provides a general and explicit relation between NPS tensile bond strength and adhesion factors such as substrate hardness, adhesion distance, van der Waals constant, and particle diameter. The NPS adhesion model is verified as a first order adhesion model using experimental data from seventeen packaging materials. Substrate hardness is identified as a primary factor in NPS adhesion. Adhesion distance and van der Waals constant are also significant in organic and inorganic materials. Diffusion or other interfacial reaction between NPS and metal substrates such as copper and silver seems to exist. Finally, guidelines to improve the adhesion strength of NPS are suggested based on the adhesion model and on external adhesion factors such as Silane coupling agents and plasma treatment.

La nouvelle génération de revêtement métallique à base de zinc, aluminium et magnésium (ZM) développée par ArcelorMittal permet une meilleure résistance à la corrosion pour une épaisseur plus faible que les aciers galvanisés standard du type GI. Toutefois, leur homologation pour l’utilisation dans des assemblages collés dans le secteur automobile pose problème car, contrairement au système adhésif crash/GI, des ruptures adhésives sont observées lors du test de traction-cisaillement d’un assemblage adhésif crash/ZM. Ce travail a visé à comprendre la ou les raison(s) de ces ruptures adhésives afin de proposer des solutions industrielles pour y remédier. Pour cela, une stratégie multi-technique et multi-échelle (XPS, IRRAS, Raman, AFM, …) a été mise au point afin de caractériser la surface métallique et ses oxydes, les interactions de ces derniers et les composants réactifs de l’adhésif à savoir la résine (DGEBA) et le durcisseur (DDA), et le système complet adhésif/ZM. Nous avons montré que la chimie de surface du ZM est bien plus complexe que celle du GI et est dominée par des phases riches en magnésium et très peu par des oxydes/hydroxydes de zinc contrairement au GI d’où une réactivité différente vis-à-vis de la DGEBA et la DDA. En particulier le piégeage de la DDA par interaction avec le magnésium perturbe la réticulation dans une interphase chimique ainsi que l’interaction du réseau polymérique avec la silice colloïdale et les charges à base de calcium dans une interphase mécanique affaiblissant la mécanique d’ancrage de l’adhésif. Divers solutions telles que l’application d’un traitement de surface sont proposées pour remédier à cet effet négatif du magnésium / New generation of metallic coatings based on zinc, aluminum and magnesium chemistry (ZM) developed by ArcelorMittal allows a higher corrosion resistance with a thinner layer than standard galvanized steel GI. However, its homologation for bonding structure application in automobile sector is a problem because of observation of adhesive failure after lap shear test with crash adhesive unlike GI coatings. This work’s aim is to understand the reason(s) behind the adhesive failure in order to resolve this problem by proposing industrial solutions. Thus, a multi-technical and multi-scale strategy (XPS, IRRAS, Raman, AFM,… ) was developed to characterize the metallic surface and its oxides, interactions between these oxides and the reactive components of the adhesive, namely the epoxide resin (DGEBA) and the hardener (DDA) and finally the whole system, i.e. ZM/adhesive. It was demonstrated that ZM surface chemistry is far more complex than GI surface chemistry and is dominated by rich magnesium phases and low in zinc oxides/hydroxides unlike GI leading to a different reactivity towards DGEBA and DDA. In particular, the DDA trapping by interaction with magnesium disrupts reticulation process in a chemical interphase and interaction of the polymeric network with colloidal silica and mineral fillers (calcium types) in a mechanical interphase which is weakening the adhesive mechanical anchoring. Several solutions like application of surface treatments can be proposed to solve the negative effect of magnesium