High performance inductors are playing an increasing role in modern communication systems. Despite the superior performance offered by discrete components, parasitic capacitances from bond pads, board traces and packaging leads reduce the high frequency performance and contribute to the urgency of an integrated solution. Embedded inductors have the potential for significant increase in reliability and performance of the IC. Due to the driving force of CMOS integration and low costs of silicon-based IC fabrication, these inductors lie on a low resistivity silicon substrate, which is a major source of energy loss and limits the frequency response. Therefore, the quality factor of inductors fabricated on silicon continues to be low. The research presented in this thesis investigates amorphous Si and porous Si to improve the resistivity of Si substrates and explores amorphous Si as a structural material for low temperature MEMS fabrication. Planar inductors are built-on undoped amorphous Si in a novel application and a 56% increase in quality factor was measured. Planar inductors are also built-on a porous Si and amorphous Si bilayer and showed 47% improvement. Amorphous Si is also proposed as a low temperature alternative to polysilicon for MEMS devices. Tunable RF MEMS inductors and transformers are fabricated based on an amorphous Si and aluminum bimorph coil that is suspended and warps in a controllable manner. The 3-D displacement is accurately predicted by thermomechanical simulations. The tuning of the devices is achieved by applying a DC voltage and due to joule heating the air gap can be adjusted. A tunable inductor with a 32% tuning range from 5.6 to 8.2 nH and a peak Q of 15 was measured. A transformer with a suspended coil demonstrated a 24% tuning range of the mutual coupling between two stacked windings. The main limitation posed by post-CMOS integration is a strict thermal budget which cannot exceed a critical temperature where impurities can diffuse and materials properties can change. The research carried out in this work accommodates this temperature restriction by limiting the RF fabrication processes to 150°C to facilitate system integration on silicon.

This thesis presents consolidated research results of a low-cost, high efficiency, high throughput detection system for fluorescence-based bio-assays. Such high throughput screening process is an invaluable tool for the multifaceted field of Systems Biology, where it is widely used in genomics and proteomics for drug and gene discovery applications. The thesis is divided into three parts: addressing the feasibility of using hydrogenated amorphous silicon photodiodes as the sensor, the development of an associated compact model suitable for circuit-level simulations, and integration of the sensors and switches to realize the array. Requirements of fluorescent bio-assays demand low sensor dark current densities in the order of 10¯¹¹A/cm² at room temperature. Fabrication of high quality segmented a–Si:H n–i–p photodiodes with such specification is achieved by tailoring defects at photodiode junction sidewalls, where both the dry etching and passivation conditions play important roles. Measurements of the fabricated photodiodes at different temperatures allowed the extraction of reverse current components, which are necessary in modeling such sensors in Verilog-A. Two prototype array designs are fabricated with pixel dimensions matching ANSI standard microwell plates. The functionalities of the small arrays are demonstrated with green LEDs to simulate fluorescent dyes that are commonly used in the high throughput bio-assay processes.

High performance inductors are playing an increasing role in modern communication systems. Despite the superior performance offered by discrete components, parasitic capacitances from bond pads, board traces and packaging leads reduce the high frequency performance and contribute to the urgency of an integrated solution. Embedded inductors have the potential for significant increase in reliability and performance of the IC. Due to the driving force of CMOS integration and low costs of silicon-based IC fabrication, these inductors lie on a low resistivity silicon substrate, which is a major source of energy loss and limits the frequency response. Therefore, the quality factor of inductors fabricated on silicon continues to be low. The research presented in this thesis investigates amorphous Si and porous Si to improve the resistivity of Si substrates and explores amorphous Si as a structural material for low temperature MEMS fabrication. Planar inductors are built-on undoped amorphous Si in a novel application and a 56% increase in quality factor was measured. Planar inductors are also built-on a porous Si and amorphous Si bilayer and showed 47% improvement. Amorphous Si is also proposed as a low temperature alternative to polysilicon for MEMS devices. Tunable RF MEMS inductors and transformers are fabricated based on an amorphous Si and aluminum bimorph coil that is suspended and warps in a controllable manner. The 3-D displacement is accurately predicted by thermomechanical simulations. The tuning of the devices is achieved by applying a DC voltage and due to joule heating the air gap can be adjusted. A tunable inductor with a 32% tuning range from 5.6 to 8.2 nH and a peak Q of 15 was measured. A transformer with a suspended coil demonstrated a 24% tuning range of the mutual coupling between two stacked windings. The main limitation posed by post-CMOS integration is a strict thermal budget which cannot exceed a critical temperature where impurities can diffuse and materials properties can change. The research carried out in this work accommodates this temperature restriction by limiting the RF fabrication processes to 150°C to facilitate system integration on silicon.

This thesis presents consolidated research results of a low-cost, high efficiency, high throughput detection system for fluorescence-based bio-assays. Such high throughput screening process is an invaluable tool for the multifaceted field of Systems Biology, where it is widely used in genomics and proteomics for drug and gene discovery applications. The thesis is divided into three parts: addressing the feasibility of using hydrogenated amorphous silicon photodiodes as the sensor, the development of an associated compact model suitable for circuit-level simulations, and integration of the sensors and switches to realize the array. Requirements of fluorescent bio-assays demand low sensor dark current densities in the order of 10¯¹¹A/cm² at room temperature. Fabrication of high quality segmented a–Si:H n–i–p photodiodes with such specification is achieved by tailoring defects at photodiode junction sidewalls, where both the dry etching and passivation conditions play important roles. Measurements of the fabricated photodiodes at different temperatures allowed the extraction of reverse current components, which are necessary in modeling such sensors in Verilog-A. Two prototype array designs are fabricated with pixel dimensions matching ANSI standard microwell plates. The functionalities of the small arrays are demonstrated with green LEDs to simulate fluorescent dyes that are commonly used in the high throughput bio-assay processes.

Hydrogenated amorphous silicon thin-film transistors (a-Si:H TFTs) are used as charge switches in flat-panel X-ray detectors. The inherent noise in the TFTs contributes to the overall noise figure of the detectors and degrades the image quality. Measurements of the noise provide an important parameter for modeling the performance of the detectors and are a sensitive diagnostic tool for device quality. Furthermore, understanding the origins of the noise could lead to change a method of a-Si:H deposition resulting in a reduction of the noise level. This thesis contains measurements of the low-frequency noise in a-Si:H TFTs with an inverted staggered structure. The noise power density spectrum fits well to a power law with Ñ near one. The normalized noise power is inversely proportional to gate voltage and also inversely proportional to channel length in both the linear and saturation regions. The noise is nearly independent of the drain-source voltage and drain-source current. The noise is unaffected by degrading the amorphous silicon through gate-biasing stress. Hooge¡¦s parameter is in the range 1-2*E-3 or 2-4*E-4 depending on whether the parameter is calculated using the total number of charge carriers in the accumulation layer or just the number of free carriers. As an example, the signal to noise ratio is calculated for photodiode detector gated by a TFT using the results from the noise measurements.

In this study, SiO2-xFx films were deposited on Si and amorphous silicon, their physical and chemical properties were measured. An Al/ SiO2-xFx /Si and Al/ SiO2-xFx/a-Si/Si MOS structures were used for the electrical measurements. To improve the electrical properties, we investigated the characteristics of SiO2-xFx films after annealing in nitrogen and oxygen ambient. We can find the leakage current density can be reduced to about 1.09¡Ñ 10-6 A/cm2 and 1.03¡Ñ 10-7 at -1 MV/cm and at 1 MV/cm after annealing in oxygen ambient. Although the leakage current is improved one order but the dielectric constant is increase.

The probability of recombination of photogenerated electron hole pairs in crystalline silicon is governed by the density of surface defect states and the density of charge carriers. Depositions of intrinsic hydrogenated amorphous silicon (a-Si:H) in dc saddle field (DCSF) PECVD system and hydrogenated amorphous silicon nitride (SiNx) in rf PECVD system forms a dual layer stack on c-Si, which results in an excellent passivation of the surface and an anti-reflection coating. Response Surface Methodology is used in this work to optimize the deposition conditions of SiNx. Optimization of the response surface function yielded deposition conditions that materialized in a surface recombination velocity of less than 4cm/s. The BACH (Back Amorphous Crystalline silicon Heterojunction) cell concept makes use of this dual layer a-Si:H/SiNx stack to form a high efficiency photovoltaic device. The high quality passivating structure can result in the BACH solar cell device with more than 20% conversion efficiency.

Hydrogenated amorphous silicon carbide (a-SiC:H) can provide exceptional surface passivation essential for high-efficiency crystalline silicon solar cells. This thesis reports on the fundamental study of a-SiC:H films deposited using a novel deposition technique, DC saddle field PECVD, in contrast to the conventional industrial use of RF-PECVD. The growth conditions were optimized and correlated with passivating, structural, and optical characteristics. The lifetime has a strong dependency on deposition temperature and improves by over two orders of magnitude as the temperature increases; the maximum lifetime achieved in this work reached 0.5 ms. In addition, the Tauc optical gap can be increased from 1.7 eV to 2.3 eV by varying the precursor gas mixture ratio. Post-deposition annealing experiments demonstrate thermal stability of the samples deposited at 250 °C and in some instances shows improvement in passivation quality by a factor of two with a one-step annealing treatment at 300 °C for 15 minutes.

Abstract Silicon carbide is a versatile material amenable to variety of applications from electrical insulation to surface passivation, diffusion-barrier in optoelectronic and high-frequency devices. This research presents a fundamental study of a-SiC:H films with variable stoichiometries deposited using novel technique, DC saddle-field plasma-enhanced chemical-vapour deposition, a departure from conventional RF PECVD commonly used in industry. DCSF PECVD is an alternative technique for low temperature large area deposition. Stoichiometric a-SiC:H obtained by fine-tuning precursor gas mixture. Annealing up to 800oC showed no significant change in elemental composition; particularly indicating thermal stability at stoichiometry. Ellipsometry showed wide range of optical gaps whose maximum surpasses values reported in literature. Refractive index measured and change in values studied as function of increasing carbon content in the films. Also attainment of very smooth surface morphology for stoichiometric a-SiC:H films reported. Surface roughness of 1 nm rms demonstrated for films grown at temperature as low as 225oC.

The probability of recombination of photogenerated electron hole pairs in crystalline silicon is governed by the density of surface defect states and the density of charge carriers. Depositions of intrinsic hydrogenated amorphous silicon (a-Si:H) in dc saddle field (DCSF) PECVD system and hydrogenated amorphous silicon nitride (SiNx) in rf PECVD system forms a dual layer stack on c-Si, which results in an excellent passivation of the surface and an anti-reflection coating. Response Surface Methodology is used in this work to optimize the deposition conditions of SiNx. Optimization of the response surface function yielded deposition conditions that materialized in a surface recombination velocity of less than 4cm/s. The BACH (Back Amorphous Crystalline silicon Heterojunction) cell concept makes use of this dual layer a-Si:H/SiNx stack to form a high efficiency photovoltaic device. The high quality passivating structure can result in the BACH solar cell device with more than 20% conversion efficiency.