Submitted by Automa??o e Estat?stica (sst@bczm.ufrn.br) on 2018-04-03T14:24:41Z No. of bitstreams: 1 FernandaDeMeloFernandes_DISSERT.pdf: 2913111 bytes, checksum: dcf264c0d70fe0bcde8d2a01549b8221 (MD5) / Approved for entry into archive by Arlan Eloi Leite Silva (eloihistoriador@yahoo.com.br) on 2018-04-10T19:05:53Z (GMT) No. of bitstreams: 1 FernandaDeMeloFernandes_DISSERT.pdf: 2913111 bytes, checksum: dcf264c0d70fe0bcde8d2a01549b8221 (MD5) / Made available in DSpace on 2018-04-10T19:05:54Z (GMT). No. of bitstreams: 1 FernandaDeMeloFernandes_DISSERT.pdf: 2913111 bytes, checksum: dcf264c0d70fe0bcde8d2a01549b8221 (MD5) Previous issue date: 2018-01-22 / A deposi??o de filmes finos por plasma melhora v?rias propriedades f?sicas, qu?micas e biol?gicas de superf?cies que contribuem para o enobrecimento dos materiais. O objetivo do trabalho ? estudar a cin?tica de deposi??o de filmes finos de cobre em substratos de vidro e tecido, utilizando a t?cnica da gaiola cat?dica, alterando a espessura da tampa da gaiola e sua rela??o com a varia??o da pot?ncia do tratamento. Devido ? alta temperatura no interior da gaiola, as amostras de tecidos, foram fixadas no flange superior do reator, j? o vidro foi posicionado tanto dentro quanto fora da gaiola, sendo assim, ser? analisado a deposi??o do jato interno e externo da gaiola cat?dica. Filmes finos de cobre caracterizam-se como bom condutor el?trico e t?rmico, o que justifica seu uso em microeletr?nica, e segundo a U.S. Environmental Agency (EPA) existem 282 tipos de ligas de cobre bactericidas, habilitando sua utiliza??o em ambientes est?ril. Assim, realizou-se deposi??es de filmes finos de cobre sobre amostras de vidro, poliamida e poli?ster, variando os par?metros do processo e a espessura da tampa da gaiola. Realizou-se a caracteriza??o por difra??o de Raio-X (DRX), Espectroscopia de Fluoresc?ncia Raios X (FRX), Microscopia Eletr?nica de Varredura com Emiss?o de Campo (MEV - FEG) com Microan?lise por Espectroscopia por Energia Dispersiva (EDS), Transmit?ncia e Espectroscopia de Fotoel?trons Excitados por Raios-X (XPS). Os resultados mostraram que, ap?s o tratamento, todas as amostras, tanto vidro como tecido, obtiveram cobre em sua estrutura, ou seja, foi poss?vel realizar deposi??o nos substratos independentemente da localiza??o do mesmo, em rela??o a gaiola. No entanto, as amostras internas obtiveram maior taxa de deposi??o. / The deposition of thin films by plasma improves various physical, chemical and biological properties of surfaces that contribute to the ennoblement of the materials. The objective of this work is to study the deposition kinetics of thin films of copper on glass and fabric substrates using the cathodic cage technique, changing the thickness of the cage lid and its relation with the variation of the power of the treatment. Owing to the high temperature inside the cage, the tissue samples were fixed to the upper flange of the reactor, and the glass was positioned both inside and outside the cage, thus analyzing the deposition of the internal jet and external the cathodic cage. Copper thin films are characterized as good electrical and thermal conductors, which justify their use in microelectronics, and according to the U.S. Environmental Agency (EPA) there are 282 types of bactericidal copper alloys, enabling their use in sterile environments. Thus, depositions of thin films of copper were carried out on glass, polyamide and polyester samples, varying the process parameters and the thickness of the cage lid. The characterization was performed by X-ray diffraction (XRD), X-Ray Fluorescence Spectroscopy (FRX), Field-Scanning Scanning Electron Microscopy (SEM) with Microanalysis by Dispersive Energy Spectroscopy (EDS), Transmittance and Spectroscopy of X-Ray Excited Photoelectrons (XPS). The results showed that, after treatment, all samples, both glass and fabric, obtained copper in their structure, that is, it was possible to perform deposition on the substrates regardless of the location of the same, relative to the cage. However, the internal samples obtained a higher rate of deposition.