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  • About
  • The Global ETD Search service is a free service for researchers to find electronic theses and dissertations. This service is provided by the Networked Digital Library of Theses and Dissertations.
    Our metadata is collected from universities around the world. If you manage a university/consortium/country archive and want to be added, details can be found on the NDLTD website.

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Showing 1 to 4 of 4 (0.085 seconds)

Spelling suggestions: "subject:"chemischmechanische polieren"" "subject:"chemischmechanische volieren""

1

Reduktion und Oxidation von Ceroxiden /

Gathen, David, January 2008 (has links)
Zugl.: Aachen, Techn. Hochsch., Diss., 2007.
2

Reduktion und Oxidation von Ceroxiden

Gathen, David January 2007 (has links)
Zugl.: Aachen, Techn. Hochsch., Diss., 2007
3

Porous Ultra Low-k Material Integration Through An Extended Dual Damascene Approach: Pre-/ Post-CMP Curing Comparison

Calvo, Jesús, Koch, Johannes, Thrun, Xaver, Seidel, Robert, Uhlig, Benjamin 22 July 2016 (has links) (PDF)
Integration of dielectrics with increased porosity is required to reduce the capacitance of interconnects. However, the conventional dual damascene integration approach is causing negative effects to these materials avoiding their immediate implementation. A post-CMP curing approach could solve some of these issues. However, materials with porogens being stable at temperatures of the barrier-seed deposition process are not common, hindering this approach. Here, we report on an extended dual-damascene integration approach which permits post-CMP curing.
porous
low-k
integration
CMP
curing
ddc:620
Low-k-Dielektrikum
Integration
Chemisch-mechanisches Polieren
4

Porous Ultra Low-k Material Integration Through An Extended Dual Damascene Approach: Pre-/ Post-CMP Curing Comparison

Calvo, Jesús, Koch, Johannes, Thrun, Xaver, Seidel, Robert, Uhlig, Benjamin 22 July 2016 (has links)
Integration of dielectrics with increased porosity is required to reduce the capacitance of interconnects. However, the conventional dual damascene integration approach is causing negative effects to these materials avoiding their immediate implementation. A post-CMP curing approach could solve some of these issues. However, materials with porogens being stable at temperatures of the barrier-seed deposition process are not common, hindering this approach. Here, we report on an extended dual-damascene integration approach which permits post-CMP curing.
info:eu-repo/classification/ddc/620
ddc:620
porous, low-k, integration, CMP, curing

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