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The Global ETD Search service is a free service for researchers
to find electronic theses and dissertations. This service is
provided by the
Networked Digital Library of Theses and Dissertations.
Our metadata is collected from universities around the world. If you manage a university/consortium/country archive and want to be added, details can be found on the NDLTD website.
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SAMs (self-assembled monolayers) passivation of cobalt microbumps for 3D stacking of Si chipsHou, Lin, Derakhshandeh, Jaber, Armini, Silvia, Gerets, Carine, De Preter, Inge, June Rebibis, Kenneth, Miller, Andy, De wolf, Ingrid, Beyne, Eric 22 July 2016 (has links) (PDF)
In this paper SAM (self-assembled monolayers) is used to passivate cobalt microbumps for 3D-stacking of Si chips. The SAM deposition process is optimized, using input from characterization techniques such as water contact angle measurement, ATR, AFM and XPS analysis in order to form a monolayer of Thiols-SAM on cobalt microbumps. A 3D stacked Si chips test vehicle was used to demonstrate the effectiveness of the SAM coating on cobalt bumps by measuring the electrical continuity of daisy chains.
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SAMs (self-assembled monolayers) passivation of cobalt microbumps for 3D stacking of Si chipsHou, Lin, Derakhshandeh, Jaber, Armini, Silvia, Gerets, Carine, De Preter, Inge, June Rebibis, Kenneth, Miller, Andy, De wolf, Ingrid, Beyne, Eric 22 July 2016 (has links)
In this paper SAM (self-assembled monolayers) is used to passivate cobalt microbumps for 3D-stacking of Si chips. The SAM deposition process is optimized, using input from characterization techniques such as water contact angle measurement, ATR, AFM and XPS analysis in order to form a monolayer of Thiols-SAM on cobalt microbumps. A 3D stacked Si chips test vehicle was used to demonstrate the effectiveness of the SAM coating on cobalt bumps by measuring the electrical continuity of daisy chains.
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