A Resistência Térmica de Contato entre a ferramenta de forjamento e a peça é um parâmetro importante para a otimização, por simulação computacional, do comportamento do material forjado. Os procedimentos atuais destinados à determinação da Resistência Térmica de Contato apresentam discrepância significativa nos resultados. A falta de valores confiáveis deste parâmetro afeta a precisão da simulação. Visando a importância das ferramentas computacionais para a otimização do processo de forjamento, no presente trabalho foi desenvolvida uma nova técnica para determinar a Resistência Térmica de Contato. A técnica inovadora inclui o método de medição de temperaturas interfaciais desconhecido anteriormente, a montagem para realizá-lo e o sistema de medição de temperaturas volumétricas. Esta técnica é destinada ao uso sob condições de altas e moderadas temperatura e pressão muito grande, o que é característico da zona de contato material forjado–ferramenta. A inovação foi testada com sucesso para alguns materiais típicos (aço, liga de alumínio e liga de titânio) utilizados no forjamento a quente ou a morno. Os valores da Resistência Térmica de Contato, obtidos nos testes, são recomendados para uso em programas de simulação computacional. / The Thermal Contact Resistance between a die and a blank is an important parameter in the computer simulation used for the optimization of the blank plastic deformation. The known procedures intended for the determination of the Thermal Contact Resistance show significant discrepancy in results. The lack of reliable values of this parameter affects the precision of the simulation. Taking in account the importance of computer tools for the optimization of the forging process, a new technique for the determination of the Thermal Contact Resistance has been developed in the present study. The developed technique includes a method for the measurement of the interface temperatures, which was unknown before, and the equipment for the realization of this method as well as the system for the measurement of the volumetric temperatures. This technique is intended for use under moderate and high temperature / high pressure conditions at the die–workpiece interface. The innovation has been tested successfully on some typical materials (steel, aluminium alloy e titanium alloy) used in warm and hot forging. Values of the Thermal Contact Resistance obtained by these tests are recommended for use in computer simulations.

Measurements of in situ planetary thermal conductivity are typically made using long needle-like probes inserted in a planet's surface, which measure effective thermal conductivity (ETC) in radial direction (parallel to surface). The desired vertical (perpendicular to surface) ETC is assumed to be the same as the horizontal. However, ETC of particle beds in vertical and horizontal directions is known to be an anisotropic property under low compressive pressures. This study further examines the anisotropy of bed ETC under low and high compressive pressures in both vacuum and air environments. The ratio of vertical to horizontal stress, K0, is measured for the particles used in these experiments. A resistance network heat transfer model has been developed in predicting the vertical and the horizontal ETC as a function of applied compressive pressure. The model predicts vertical ETC by using only macro-contact thermal resistances for both high and low applied compressive pressure regimes. It is proposed that the vertical and horizontal ETC of particle beds under uniaxial compression is related by compressive pressures in each direction. The horizontal compressive pressure, which is perpendicular to the applied compressive pressure, can be calculated with the use of at-rest pressure coefficient and subsequently used in macro-contact thermal resistance to predict the horizontal ETC. The vertical ETC is obtained using the same model by substituting vertical compressive pressure into macro-contact thermal resistance. A two-dimensional axisymmetric finite element model in the COMSOL Multiphysics software package has been developed to simulate heat transfer coupled with structural deformation of spheres under compressive pressures in a simple cubic (SC) packing arrangement. The numerical model is used as a tool to predict the lower limit of bed ETC as well as validating thermal contact resistance used in the theoretical model. The predictions from the numerical model can be extended to particle beds with different packing arrangements.

Thin-film solar cells are widely recognised to have the potential to compete with fossil fuels in the electricity market due to their low cost per peak Watt. The Thin-Film Group at the University of New South Wales (UNSW) is engaged in developing polycrystalline silicon (poly-Si) thin-film solar cells on glass using e-beam evaporation technology. We believe our solar cells have the potential of significantly lowering the manufacturing cost compared to conventional, PECVD-fabricated thin-film solar cells. After years of materials research, the focus of the Group??s work is now moving to the metallisation of evaporated solar cells. Minimising various kinds of losses is the main challenge of the cell metallisation procedure, within which the contact resistance is always a big issue. In this thesis, the contact resistance of aluminium contacts on poly-Si thin-film solar cells on glass is investigated. To the best of the author??s knowledge, this is the first ever contact resistance investigation of Al contacts on evaporated poly-Si material for photovoltaic applications. Various transmission line models (TLM) are employed to measure the contact resistance. An improved TLM model is developed to increase the measurement precision and, simultaneously, to simplify the TLM pattern fabrication process. In order to accommodate the particular requirements of poly-Si coated glass substrates, a TLM pattern fabrication process using photolithography is established. Furthermore, a Kelvin sense tester is set up to ensure an accurate measurement of the contact resistance. After establishment of the TLM technique at UNSW, it is successfully tested on singlecrystalline silicon wafer samples. The thermal annealing process of the contacts is also optimised. Then, the general behaviour of Al contacts on uniformly doped poly-Si films (i.e., no p-n junction) is investigated using the verified TLM technique. The long-term stability of the contacts is also studied. This is followed by an investigation of the contact resistance of the back surface field and emitter layers of different types of poly-Si thin-film solar cells. Finally, a novel contact resistance measurement model is proposed that is believed to be able to overcome the measurement bottleneck of the transmission line models.

The complexity of electronic systems in vehicles is rapidly increasing, and as a consequence, the long-term reliability of automotive connectors has become an important issue. The aims of this thesis have been: 1. to characterize the friction, wear and electrical properties of tin coatings, 2. to achieve an improved fundamental understanding of the deterioration processes caused by wear and fretting corrosion, 3. to propose improvements of tin coatings systems for electrical connectors. The required insertion force has a significant impact on the design and the cost of a connector. A reduced insertion force can be achieved by reduced contact load and/or reduced tin coating thickness, but this will increase the risk of fretting corrosion. Wear during the insertion stroke is essential in order to wipe off the non-conductive oxide layer. However, a thin tin layer may become worn off after only a few insertion strokes. The rider will then partly slide on the hard intermetallic compound formed between the substrate and the residual tin. Due to the restricted wear when sliding on the intermetallic compound more oxide will be formed during sliding than is removed and consequently the electrical contact resistance will increase. Two semi-empirical models are proposed, the first describing the contact resistance when the rider plows the free tin layer, and the second describing the contact resistance increase due to oxidation when the rider slides on the intermetallic compound. Two novel methods to improve the performance of pre-tinned material were evaluated. The first involves the use of a lubricant in combination with a textured surface, to improve the supply of lubricant into the contact spot. The second involves the addition of small amounts of a preferential oxidation additive to the tin. This increases the possibility of achieving a cold-welded contact spot, which results in an ultimately stable connection.

Thermoelectric devices are capable of providing both localized active cooling and waste heat power generation. This work will explore the possibility of embedding thermoelectric devices within electronic packaging in order to achieve better system performance. Intel and Nextreme, Inc. have produced thin-film superlattice thermoelectric devices that have above average performance for thermoelectrics and are much thinner than most devices on the market currently. This allows them to be packaged inside of the electronic package where the thermoelectric devices can take advantage of the increased temperatures and decreased thermal lag as compared to the devices being planted on the outside of the package. This work uses the numerical CFD solver FLUENT and the analog electronic circuit simulator SPICE to simulate activity of thermoelectric devices within an electronics package.

Electrical conductive adhesives (ECAs) containing silver filler and polyaniline co-filler were characterized for their electro-mechanical properties. Polyaniline is a conductive polymer and has a moderate conductivity in between those of the silver and epoxy. Incorporation of polyaniline (μm sized) in silver-epoxy facilitated the electrical conduction in ECAs and reduced the percolation threshold- a minimum volume of filler necessary to initiate the conduction. It also prevented the localization of charge carriers due to aggregation of silver filler particles. ‘Bridging effect’ was observed due to addition polyaniline in which the polyaniline enhanced the tunneling of electrons over the silver filler particles. We have investigated the polyaniline co-fillers as a promising alternative way to tune the mechanical and electrical properties of the ECAs and have provided a detailed analysis of the electro-mechanical properties of silver-epoxy (Ag-epoxy) and silver-polyaniline-epoxy (Ag-PANI-epoxy) system in both partially-cured/ viscoelastic and fully-cured states. Analysis of electro-mechanical properties of silver-epoxy and silver-polyaniline-epoxy also provided the insights into electrical contact resistance of ECAs under compressive force. Electro-mechanical properties of ECAs were measured ‘in-situ’ using micro-indentation technique. We also synthesized the electrically conductive and highly crystalline nanotubes of polyaniline by mini-emulsion polymerization of aniline. The motivation behind the synthesis of polyaniline was to propose a potential filler/co-filler for replacement of metallic filler in ECAs. Electrical conductivity of polyaniline nanotubes was tuned by in-situ doping using hydrochloric acid as a dopant. Increase in dopant caused the polyaniline crystallite to grow along (400) plane. Optical, structural, electrical and thermal properties of polyaniline nanotubes are reported with varying amount of dopant. We fabricated the flexible electrically conductive coating of polyaniline tubes with uniform dispersion of polyaniline. Electrical performance of as-synthesized flexible coating is also revealed.

As a result of manufacturing processes, real surfaces have roughness and surface curvature. The real contact occurs only over microscopic contacts, which are typically only a few percent of the apparent contact area. Because of the surface curvature of contacting bodies, the macrocontact area is formed, the area where microcontacts are distributed randomly. The heat flow must pass through the macrocontact and then microcontacts to transfer from one body to another. This phenomenon leads to a relatively high temperature drop across the interface. Thermal contact resistance (TCR) is a complex interdisciplinary problem, which includes geometrical, mechanical, and thermal analyses. Each part includes a micro and a macro scale sub-problem. Analytical, experimental, and numerical models have been developed to predict TCR since the 1930's. Through comparison with more than 400 experimental data points, it is shown that the existing models are applicable only to the limiting cases and none of them covers the general non-conforming rough contact. The objective of this study is to develop a compact analytical model for predicting TCR for the entire range of non-conforming contacts, i. e. , from conforming rough to smooth sphere-flat in a vacuum. The contact mechanics of the joint must be known prior to solving the thermal problem. A new mechanical model is developed for spherical rough contacts. The deformation modes of the surface asperities and the bulk material of contacting bodies are assumed to be plastic and elastic, respectively. A closed set of governing relationships is derived. An algorithm and a computer code are developed to solve the relationships numerically. Applying Buckingham Pi theorem, the independent non-dimensional parameters that describe the contact problem are specified. A general pressure distribution is proposed that covers the entire spherical rough contacts, including the Hertzian smooth contact. Simple correlations are proposed for the general pressure distribution and the radius of the macrocontact area, as functions of the non-dimensional parameters. These correlations are compared with experimental data collected by others and good agreement is observed. Also a criterion is proposed to identify the flat surface, where the influence of surface curvature on the contact pressure is negligible. Thermal contact resistance is considered as the superposition of macro and micro thermal components. The flux tube geometry is chosen as the basic element in the thermal analysis of microcontacts. Simple expressions for determining TCR of non-conforming rough joints are derived which cover the entire range of TCR by using the general pressure distribution and the flux tube solution. A complete parametric study is performed; it is seen that there is a value of surface roughness that minimizes TCR. The thermal model is verified with more than 600 data points, collected by many researchers during the last 40 years, and good agreement is observed. A new approach is taken to study the thermal joint resistance. A novel model is developed for predicting the TCR of conforming rough contacts employing scale analysis methods. It is shown that the microcontacts can be modeled as heat sources on a half-space for engineering applications. The scale analysis model is extended to predict TCR over the entire range of non-conforming rough contacts by using the general pressure distribution developed in the mechanical model. It is shown that the surface curvature and contact pressure distribution have no effect on the effective micro thermal resistance. A new non-dimensional parameter is introduced as a criterion to identify the three regions of TCR, i. e. , the conforming rough, the smooth spherical, and the transition regions. An experimental program is designed and data points are collected for spherical rough contacts in a vacuum. The radius of curvature of the tested specimens are relatively large (in the order of m) and can not be seen by the naked eye. However, even at relatively large applied loads the measured joint resistance (the macro thermal component) is still large which shows the importance of surface out-of-flatness/curvature. Collected data are compared with the scale analysis model and excellent agreement is observed. The maximum relative difference between the model and the collected data is 6. 8 percent and the relative RMS difference is approximately 4 percent. Additionally, the proposed scale analysis model is compared/verified with more than 880 TCR data points collected by many researchers. These data cover a wide range of materials, surface characteristics, thermal and mechanical properties, mean joint temperature, directional heat transfer effect, and contact between dissimilar metals. The RMS difference between the model and all data is less than 13. 8 percent.

A high aspect ratio epoxy mask has been built with Taiyo PSR4000BN on chemical sensing array chip. Thickness up to 200 and #61549;m and aspect ratio up to 16:1 have been achieved with this material. It is demonstrated that this material satisfies the mechanical and chemical requirements. A three-electrode system has been designed and built for electrochemistry in micro-cell on chip. Tests with poly(phenylenesulfide-phenyleneamine) (PPSA) demonstrates that it is possible to precisely tune the properties (Work function and resistance) of conducting polymer that has been cast on chip surface. A new test platform GT03 has been fabricated and used to characterize the chemical effects on organic electronics. It is demonstrated that the chemical species in ambient environment can affect organic electronics properties on bulk, interface and electric contact. The contact resistance in organic field-effect transistors (OFETs) has been characterized with modified interdigitated structure (IDS). It is demonstrated that drain and source contact resistances can be calculated separately with modified four-point-probe measurements, and contact resistance and material bulk resistance are actually modulated by the gate electric field. Furthermore, the influence from oxygen doping in poly(3-hexylthiophene) (P3HT) based OFETs has been investigated. A new model of oxygen doping has been suggested and it is demonstrated that oxygen doping can affect all the resistance components in P3HT OFETs.

The effects of AC and DC on cooling rate, solute distribution and nugget shape after solidification, which are responsible for microstructure of the fusion zone, during resistance spot welding are realistically and extensively investigated. The finite difference method is used to predict transport variables in workpieces and electrodes during heating, melting, cooling and freezing periods. The model accounts for electromagnetic force, heat generations at the electrode-workpiece interface and faying surface between workpieces, and dynamic electrical resistance including bulk resistance and contact resistances at the faying surface and electrode-wokpiece interfaces, which are function of hardness, temperature, electrode force, and surface condition. The computed results show that in contrast to DC, using AC readily produces the nugget in an ellipse shape. Deficit and excess of solute content occur in a thin layer around the boundary and interior of the nugget, respectively. The effects of dynamic electrical resistance subject to AC (Alternative current) on transport variables, cooling rate, solute distribution and nugget shape after solidification during resistance spot welding are realistically and extensively investigated. The model accounts for electromagnetic force, heat generation and contact resistances at the faying surface and electrode-workpiece interfaces and bulk resistance in workpieces. Contact resistance are comprised of constriction and film resistances, which are functions of hardness, temperature, electrode force and surface condition. The computed results show that the weld nugget readily occurs by increasing constriction resistance and Curie temperature. High Curie temperature enhances convection and solute mixing, and readily melts through the workpiece surface near the electrode edge. Aside from finding the significant effect of Curie temperature on resistance spot welding, this study indicates that any mean (For example, adjusting solute content) to reduce Curie temperature can be a new way to control weld quality.

Abstract Dynamic electrical resistance during resistance spot welding has been quantitatively modeled and analyzed in this work. A determination of dynamic resistance is necessary for predicting the transport processes and monitoring the weld quality during resistance spot welding. In this study, dynamic resistance is obtained by taking the sum of temperature dependent bulk resistance of the workpieces and contact resistances at the faying surface and electrode-workpiece interface within an effective area corresponding to the electrode tip where welding current primarily flows. A contact resistance is composed of constriction and film resistances, which are functions of hardness, temperature, electrode force, electrical resistivity and surface condition. Unsteady, axisymmetric transport of mass, momentum, energy, species, and magnetic field intensity with a mushy-zone phase change in workpieces and temperature, and magnetic fields in electrodes during resistance spot welding, are systematically investigated. Electromagnetic force, joule heat, heat generation at the electrode-workpiece interface and faying surface between workpieces, different properties between phase, and geometries of electrodes are taken into account. The predicted nugget thickness and dynamic resistance versus time show quite good agreement with available experimental data. Excluding expulsion, the dynamic resistance curve can be divided into four stages. A rapid decrease of dynamic resistance in stage 1 is attributed to decreases in film resistances at the faying surface and electrode-workpiece interface. In stage 2, the increase in dynamic resistance results from the primary increase of bulk resistance in the workpieces and an increase of the sum of contact resistances at the faying surface and electrode-workpiece interface. Dynamic resistance in stage 3 decreases, because increasing rate of bulk resistance in the workpieces and contact resistances decrease. In stage 4 decrease of dynamic resistance is mainly due to the formation of the molten nugget at the faying surface. The molten nugget is found to occur in stage 4 rather than stage 2 or 3 as qualitatively proposed in the literature. The effects of different parameters on the dynamic resistence curve are also presented. Besides, electromagnetic force effect on velocity field of molten nugget was proven to be crucial. Higher current, smaller magnetic diffusivity and decreasing the radius of electrode tip will lead to high current density around the corner between electrode and workpiece. Sometimes the corner of electrode and surface of workpieces will be melted due to local high current density.