Electrical conductive adhesives (ECAs) containing silver filler and polyaniline co-filler were characterized for their electro-mechanical properties. Polyaniline is a conductive polymer and has a moderate conductivity in between those of the silver and epoxy. Incorporation of polyaniline (μm sized) in silver-epoxy facilitated the electrical conduction in ECAs and reduced the percolation threshold- a minimum volume of filler necessary to initiate the conduction. It also prevented the localization of charge carriers due to aggregation of silver filler particles. ‘Bridging effect’ was observed due to addition polyaniline in which the polyaniline enhanced the tunneling of electrons over the silver filler particles. We have investigated the polyaniline co-fillers as a promising alternative way to tune the mechanical and electrical properties of the ECAs and have provided a detailed analysis of the electro-mechanical properties of silver-epoxy (Ag-epoxy) and silver-polyaniline-epoxy (Ag-PANI-epoxy) system in both partially-cured/ viscoelastic and fully-cured states. Analysis of electro-mechanical properties of silver-epoxy and silver-polyaniline-epoxy also provided the insights into electrical contact resistance of ECAs under compressive force. Electro-mechanical properties of ECAs were measured ‘in-situ’ using micro-indentation technique. We also synthesized the electrically conductive and highly crystalline nanotubes of polyaniline by mini-emulsion polymerization of aniline. The motivation behind the synthesis of polyaniline was to propose a potential filler/co-filler for replacement of metallic filler in ECAs. Electrical conductivity of polyaniline nanotubes was tuned by in-situ doping using hydrochloric acid as a dopant. Increase in dopant caused the polyaniline crystallite to grow along (400) plane. Optical, structural, electrical and thermal properties of polyaniline nanotubes are reported with varying amount of dopant. We fabricated the flexible electrically conductive coating of polyaniline tubes with uniform dispersion of polyaniline. Electrical performance of as-synthesized flexible coating is also revealed.

Electrical conductive adhesives (ECAs) containing silver filler and polyaniline co-filler were characterized for their electro-mechanical properties. Polyaniline is a conductive polymer and has a moderate conductivity in between those of the silver and epoxy. Incorporation of polyaniline (μm sized) in silver-epoxy facilitated the electrical conduction in ECAs and reduced the percolation threshold- a minimum volume of filler necessary to initiate the conduction. It also prevented the localization of charge carriers due to aggregation of silver filler particles. ‘Bridging effect’ was observed due to addition polyaniline in which the polyaniline enhanced the tunneling of electrons over the silver filler particles. We have investigated the polyaniline co-fillers as a promising alternative way to tune the mechanical and electrical properties of the ECAs and have provided a detailed analysis of the electro-mechanical properties of silver-epoxy (Ag-epoxy) and silver-polyaniline-epoxy (Ag-PANI-epoxy) system in both partially-cured/ viscoelastic and fully-cured states. Analysis of electro-mechanical properties of silver-epoxy and silver-polyaniline-epoxy also provided the insights into electrical contact resistance of ECAs under compressive force. Electro-mechanical properties of ECAs were measured ‘in-situ’ using micro-indentation technique. We also synthesized the electrically conductive and highly crystalline nanotubes of polyaniline by mini-emulsion polymerization of aniline. The motivation behind the synthesis of polyaniline was to propose a potential filler/co-filler for replacement of metallic filler in ECAs. Electrical conductivity of polyaniline nanotubes was tuned by in-situ doping using hydrochloric acid as a dopant. Increase in dopant caused the polyaniline crystallite to grow along (400) plane. Optical, structural, electrical and thermal properties of polyaniline nanotubes are reported with varying amount of dopant. We fabricated the flexible electrically conductive coating of polyaniline tubes with uniform dispersion of polyaniline. Electrical performance of as-synthesized flexible coating is also revealed.

L’utilisation des ultrasons pour l’imagerie présente plusieurs avantages : elle est extrêmement sure car ellen'utilise pas de radiations ionisantes et ne présente pas d'effets néfastes sur la santé. D’autre part, elle donne desrésultats d’excellente qualité avec un coût relativement faible. Historiquement, les matériaux piézoélectriques et leurscomposites ont été très tôt utilisés pour la génération d’ultrasons. Les transducteurs fabriqués à partir de ces matériauxdominent actuellement le marché des sondes ultrasonores. Cependant, pour certaines applications, ils ne peuvent pasêtre utilisés pour des raisons de dimensionnement et de limitations dues aux propriétés des matériaux. Une solutionpeut être apportée par l’utilisation des transducteurs ultrasonores capacitifs micro-usinés dits CMUTs. Ces dernierssuscitent un intérêt croissant dans le milieu de l’imagerie ultrasonore et sont considérés comme une alternativepotentielle et viable aux transducteurs piézoélectriques. Cette nouvelle technologie CMUTs est caractérisée par uneplus large bande passante, une sensibilité élevée, une facilité de fabrication et une réduction des coûts de production.Cette thèse est consacrée à la mise en place d’un certain nombre d’outils théoriques et expérimentaux permettant lamodélisation/conception, la fabrication et la caractérisation de transducteurs CMUTs à membrane circulaire pourl’émission des ultrasons. Nous commençons par développer des outils de simulation à base de calculs par élémentsfinis, permettant la compréhension et la modélisation du comportement électromécanique des CMUTs pour laconception et le dimensionnement des cellules élémentaires et des réseaux. Nous proposons par la suite un nouveauprocédé de fabrication de transducteurs CMUTs basé sur le collage anodique d’une couche de silicium monocristallind’épaisseur fixe d’une plaquette de SOI sur un substrat de verre. L’évolution du procédé de fabrication est détailléepour chaque étape technologique en soulignant à chaque fois les améliorations/modifications apportées pour unefiabilité et une répétitivité accrue associées à une connaissance des limites de faisabilité. Dans la dernière partie de cetravail, on s’intéresse à la mise en œuvre de plusieurs plateformes expérimentales permettant différentescaractérisations électromécaniques statiques et dynamiques des dispositifs CMUTs fabriqués / The use of ultrasound imaging has several advantages: it is extremely safe because it does not use ionizingradiation and has no adverse effects on health. It gives excellent quality results with a relatively low cost. Historically,piezoelectric materials and their composites have been early used for ultrasound generation. Transducers made fromthese materials dominate currently the ultrasonic probes market. However, for some applications, they can’t bebecause of design and limitation reasons due to material properties. A solution can be provided by the use ofcapacitive micromachined ultrasonic transducers CMUTs. A growing interest in the field of the ultrasound imaging isshown to this technology considered as a potential and viable alternative to piezoelectric transducers andcharacterized by a wide bandwidth, high sensitivity, ease of manufacture and reduce production costs. This thesis isdevoted to the establishment of a number of experimental and theoretical tools for the modeling/design, fabricationand characterization of circular membrane CMUTs transducers for ultrasound transmission. We begin by developingsimulation tools based on finite elements method in order to understand/model the CMUTs electromechanicalbehavior for the design and dimensioning of elementary cells and networks. Thereafter, we introduce a new CMUTtransducers fabrication process based on the anodic bonding a fixed thickness single crystal silicon layer of a SOIwafer on a glass substrate. The process evolution is detailed for each technological step highlighting everyimprovements/changes introduced for increased reliability and repeatability associated with an increased knowledgeof feasibility limits. In the last part of this work, we focus on the implementation of several experimental platformsallowing different static and dynamic electromechanical characterizations of the fabricated CMUTs devices.

Submitted by Kilvya Braga (kilvyabraga@hotmail.com) on 2018-04-23T13:32:14Z No. of bitstreams: 1 ROANA D'ÁVILA SOUZA MONTEIRO - DISSERTAÇÃO (PPGEM) 2015.pdf: 3977570 bytes, checksum: e1760f7cd8bdc07cce68f5b1aedd33a2 (MD5) / Made available in DSpace on 2018-04-23T13:32:14Z (GMT). No. of bitstreams: 1 ROANA D'ÁVILA SOUZA MONTEIRO - DISSERTAÇÃO (PPGEM) 2015.pdf: 3977570 bytes, checksum: e1760f7cd8bdc07cce68f5b1aedd33a2 (MD5) Previous issue date: 2015-08-31 / Capes / As Ligas com Memória de Forma (LMF) constituem uma classe de materiais metálicos que possuem a capacidade de recuperar uma deformação pseudo plástica, introduzida por aplicação de carga mecânica, e retornar à sua forma original através de um simples aquecimento. O principal interesse nos atuadores de LMF utilizados no formato de molas helicoidais reside no grande deslocamento proporcionado pelo fenômeno de Efeito Memória de Forma (EMF), que permite a realização de trabalho mecânico quando este componente é submetido a diferentes condições de temperatura e cargas mecânica. No caso de elementos de LMF em estado de superelasticidade (SE) na temperatura ambiente, quando a carga mecânica é aplicada e mantida sob o material, a deformação originada pela formação de martensita induzida por tensão poderá também ser revertida por meio de um aquecimento. Nesse caso, tem-se um EMF em um elemento de LMF originalmente superelástico. Nesse contexto, o objetivo deste trabalho é realizar a caracterização eletromecânica de uma mini mola superelástica de LMF NiTi (Nitinol) quando submetida a um carregamento mecânico constante, avaliando a influência da taxa de variação da corrente elétrica e do aumento da carga mecânica nas temperaturas de transformação, além de determinar o comportamento do deslocamento com a variação de resistência elétrica. Para isso, foi desenvolvida uma plataforma experimental capaz de submeter a mini mola a carregamento mecânico constante (peso) e sinais de corrente elétrica variáveis com o tempo. Verificou-se que, para todas as cargas mecânicas e níveis de corrente elétrica, os resultados para a taxa de variação da corrente elétrica mais lenta (6 mA/s) apresentou uma melhor resposta em deslocamento e na variação da resistência elétrica quando comparados com a taxa mais rápida (12 mA/s), embora esta última resulte em um comportamento histerético mais estreito (resistência elétrica versus deslocamento). Também foi observado um aumento das temperaturas de transformação com o aumento da carga mecânica, como esperado pela lei de Clausius-Clayperon para LMF. Finalmente, foi verificada uma relação praticamente linear entre a variação do deslocamento e a variação de resistência elétrica, no aquecimento e no resfriamento. / The Shape Memory Alloys (SMA) are a class of metallic materials that have the ability to recover pseudo plastic deformation introduced by the application of mechanical load, and return to original shape by heating. The main interest in the SMA actuators used in the form of coil springs lies in the large displacement provided by the shape memory effect (SME) phenomenon, which allows performing mechanical work when the component is subjected to varying conditions of temperatures and mechanical loads. In the case of SMA elements in a state of superelasticity (SE) at room temperature, when mechanical load is applied and maintained on the material, the deformation caused by the formation of stress induced martensite can be reversed by heating. In this case, we have a SME in a SMA element originally superelastic. In this context, the objective of this work is to realize the electromechanical characterization of a superelastic mini coil spring of Ni-Ti SMA (Nitinol), when subjected to a constant mechanical loading, evaluating the influence of the electric current rate, the influence of mechanical load on the phase transformation temperatures, and determining the displacement behavior to the variation of electrical resistance. For this, an experimental platform was developed to submit the mini spring under constant load (dead weight) to electric current signals varying with time. It was found that for all mechanical loads and electrical current levels, the results for the slower rate of change electrical current (6 mA/s) showed a better response in displacement and the variation in the electrical resistance when compared to faster rate (12 mA/s), although the faster rate present a narrower hysteretic behavior (electrical resistance vs displacement). There was also verified an increase in phase transformation temperatures with increased mechanical load, as expected by the Clausius-Clayperon law for SMA. Finally, a practically linear relationship was found between the change in displacement with the variation in electrical resistance, during heating and cooling.

Dans le cadre de cette thèse de doctorat, nous présentons la conception et la réalisation d’un banc dédié à l’étude de la fiabilité de structures piézoélectriques et plus précisément des micro-dispositifs de récupération d'énergie destinés aux implants médicaux autonomes actifs (stimulateurs cardiaques de nouvelle génération). Les structure étudiées se présentent sous la forme d’un bimorphe piézoélectrique encastré-libre comportant une masse sismique à leur extrémité. Une bonne compréhension du vieillissement des matériaux et des modes de défaillance mécanique et électrique est essentielle pour ce type de système où la vie du patient au sein duquel est implanté le dispositif est directement mise en jeu. Pour étudier la fiabilité et la durabilité de la partie active du récupérateur, nous proposons d'établir une nouvelle méthodologie de vieillissement accélérée via un banc d'essai dédié où l'environnement et les stimuli peuvent être contrôlés avec précision sur une large période de temps. Une caractérisation électromécanique des structures est périodiquement réalisée via l’extraction d’une série d’indicateurs (force de blocage, raideur, tension en régime harmonique) au sein même du banc tout au long du vieillissement. Il est donc ainsi possible d'identifier les différents modes de défaillance potentiels et d’étudier leurs impacts sur le bon fonctionnement du système. / Within the framework of this PhD we present the design and realization of a bench dedicated to the study of the reliability of piezoelectric structures and more precisely micro-devices of energy harvesting for the new generation of active and autonomous medical implants. The structures studied are in the form of a free-clamped piezoelectric bimorph having a seismic mass at their tip. A good understanding of the aging of the materials and of the mechanical and electrical failure modes is essential for this type of system where the life of the patient implanted by this device is directly involved. To study the reliability and durability of the active part of the harvester, we propose to establish a new accelerated aging methodology via a dedicated test bench where the environment and stimuli can be controlled accurately over a large period of time. An electromechanical characterization of the structures is periodically carried out by the extraction of a series of indicators (blocking force, stiffness, tension in harmonic regime) within the bench throughout the aging process. Therefore it is possible to identify the different potential failure modes and to study their impact on the proper functioning of the system.

L’électronique de puissance a un rôle de plus en plus grandissant dans les systèmes de transports : voitures électriques et hybrides, trains et avions. Pour ces applications, la sécurité est un point critique et par conséquent la fiabilité du système de puissance doit être optimisée. La connaissance du temps de fonctionnement avant défaillance est une donnée recherchée par les concepteurs de ces systèmes. Dans cette optique, un indicateur de défaillance précoce permettrait de prédire la défaillance des systèmes avant que celle-ci soit effective. Dans cette thèse, nous nous sommes intéressés à la caractérisation électromécanique des puces de puissance IGBT et MOSFET. L’exploitation de cette caractérisation devrait permettre, à plus long terme, de mettre en évidence un indicateur de l’état mécanique des assemblages de puissance à des fins de fiabilité prédictive. / Power electronics has a role increasingly growing up in transport:electric and hybrid vehicles, trains and aircraft. For these applications, security is a critical point, thus the reliability of the power assembly must be optimized. The knowledge of time to failure is very important information for the designers of these systems. Inthis context, an early failure indicator would predict system failuresbefore it becomes effective. In this thesis, we focused on the electromechanical characterization of power transistors: MOSFET and IGBT. Based on these results this electromechanical characterization should help us in the longer term, to highlight an early failure indicator of the power assembly.

<p>The miniaturization and thinning of wearable, soft robotics and medical devices are soon to require higher performance modeling as the physical flexibility causes direct impacts on the electrical characteristics of the circuit – changing its behavior. As a representative flexible electronic component, the organic field effect transistor (OFET) has attracted much attention in its manufacturing as well as applications. However, as the strain and stress effects are integrated into multiphysics modelers with deeper interactions, the computational complexity and accuracy of OFET modeling is resurfacing as a limiting bottleneck.</p><p>The dissertation was organized into three interrelated studies. In the first study, the Mass-Spring-Damper (MSD) model for an inverted staggered thin film transistor (TFT) was proposed to investigate the TFT’s internal stress/strain fields, and the strain effects on the overall characteristics of the TFT. A comparison study with the finite element analysis (FEA) model shows that the MSD model can reduce memory usage and raises the computational convergence speed for rendering the same results as the FEA. The second study developed the generalized solid-state model by incorporating the density of trap states in the band structure of organic semiconductors (OSCs). The introduction of trap states allows the generalized solid-state model to describe the electrical characteristics of both inorganic TFTs and organic field-effect transistors (OFETs). It is revealed through experimental verification that the generalized solid-state model can accurately characterize the bending induced electrical properties of an OFET in the linear and saturation regimes. The third study aims to model the transient and steady-state dynamics of an arbitrary organic semiconductor device under mechanical strain. In this study, the fractional drift-diffusion (Fr-DD) model and its computational scheme with high accuracy and high convergence rate were proposed. Based on simulation and experimental validation, the transconductance and output characteristics of a bendable OFET were found to be well determined by the Fr-DD model not only in the linear and saturation regimes, but also in the subthreshold regime.</p>