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  • About
  • The Global ETD Search service is a free service for researchers to find electronic theses and dissertations. This service is provided by the Networked Digital Library of Theses and Dissertations.
    Our metadata is collected from universities around the world. If you manage a university/consortium/country archive and want to be added, details can be found on the NDLTD website.
111

Crevice corrosion in aluminum alloys

Green, Leon Clifton 08 1900 (has links)
No description available.
112

The effect of mesoscopic spatial heterogeneity on the plastic deformation of Al-Cu alloys /

Conlon, Kelly Timothy. January 1998 (has links)
Thesis (Ph.D.) -- McMaster University, 1998. / Includes bibliographical references. Also available via World Wide Web.
113

Paramètres contrôlant la précipitation et la dissolution de la phase CuAl2 du cuivre dans les alliages d'aluminium de type 319 et leurs influences sur la performance /

Li, Zheng, January 2003 (has links)
Thèse (M.Eng.) -- Université du Québec à Chicoutimi, 2003. / Bibliogr.: f. [176]-185. Document électronique également accessible en format PDF. CaQCU
114

Effect of trace elements on the microstructure and porosity formation in 319 type Al-Si-Cu alloys /

Elhadad, Shimaa, January 2003 (has links)
Thèse (M.Eng.) -- Université du Québec à Chicoutimi, 2003. / Bibliogr.: f. [141]-150. Document électronique également accessible en format PDF. CaQCU
115

Les effets des paramètres métallurgiques sur les caractéristiques des intermétalliques de fer et sur la phase silicium eutectique dans les alliages Al-Si-Cu (319) /

Tahiri, Hicham, January 2003 (has links)
Thèse (M.Eng.) -- Université du Québec à Chicoutimi, 2003. / Bibliogr.: f. [177]-183. Document électronique également accessible en format PDF. CaQCU
116

Development of tin-bronze and copper based journal bearing materials with Tribaloy alloy additives /

Tavakoli, Arash. January 1900 (has links)
Thesis (M.App.Sc.) - Carleton University, 2007. / Includes bibliographical references (p. 66-71). Also available in electronic format on the Internet.
117

Thermal processes and solidification kinetics of evolution of the microstructure of Sn-xAg-yCu solder alloys

Kinyanjui, Robert. January 2005 (has links)
Thesis (Ph. D.)--State University of New York at Binghamton, Thomas J. Watson School of Engineering and Applied Science, Multidisciplinary Program in Materials Science and Engineering, 2005. / Includes bibliographical references.
118

Elaboracao de ligas Ag-Sn-Cu para amalgama dentario por moagem de alta energia

ISHII, HENRIQUE A. 09 October 2014 (has links)
Made available in DSpace on 2014-10-09T12:48:21Z (GMT). No. of bitstreams: 0 / Made available in DSpace on 2014-10-09T13:57:22Z (GMT). No. of bitstreams: 1 08713.pdf: 6496941 bytes, checksum: 5803cb14028b4639afbb59fbc4cfa0d0 (MD5) / Tese (Doutoramento) / IPEN/T / Instituto de Pesquisas Energeticas e Nucleares - IPEN/CNEN-SP
119

"Estudos do desenvolvimento e caracterização das ligas Cu-Ni-Pt e Cu-Ni-Sn para fins eletro-eletrônicos" / STUDIES OF THE DEVELOPMENT AND CHARACTERIZATION OF THE Cu-Ni-Pt AND Cu-Ni-Sn ALLOYS FOR ELETRO-ELECTRONIC USES

Luis Carlos Elias da Silva 04 October 2006 (has links)
O Cu e suas ligas têm diferentes aplicações na sociedade moderna devido as excelentes propriedades elétricas, condutividade térmica, resistência à corrosão dentre outras propriedades. Estas aplicações podem ser em válvulas, tubulações, panelas para absorção de energia solar, radiadores para automóveis, condutores de corrente e eletrônico, elementos de termostatos e partes estruturais de reatores nucleares, como, por exemplo, bobinas para campo toroidal para um reator de fusão nuclear. Dentre as ligas utilizadas em reatores nucleares, podemos destacar Cu-Be, Cu-Sn e Cu-Pt. O Ni e o Co, freqüentemente são adicionados às ligas de Cu para que a solubilidade seja deslocada para temperaturas mais elevadas com relação aos sistemas binários de Cu-Sn e Cu-Pt. A adição de Ni-Pt ou Ni-Sn ao Cu em porcentagens iguais ou inferiores a 1,5 % aliado a tratamentos termos-mecânico alteram as propriedades do Cu. Estudamos neste trabalho sete diferentes ligas: três ligas de Cu-Ni-Pt 1 (97,99 % Cu - 1,55 % Ni - 0,46 % Pt), 2 (99,33 % Cu - 0,23 % Ni -0,43 % Pt) 3 (98,01 % Cu - 0,48 % Ni - 1,51 % Pt); três ligas de Cu-Ni-Sn 4 (98,31% Cu - 1,12 % Ni - 0,58 % Sn), 5 (98,79 % Cu – 0,57 % Ni - 0,65 % Sn), 6 (98,39% Cu – 0,46 % Ni – 1,16 % Sn) e Cu eletrolítico 0 (0,0058 % Pb - 0,0007 % Fe - 0,0036 % Ni - 0,0024 % Ag). As referentes ligas foram desenvolvidas a partir de um forno a arco voltaico e passaram por tratamentos termo-mecânicos pré-determinados. As microestruturas foram analisadas diretamente por microscopia óptica e microscopia eletrônica de varredura / EDS e indiretamente por medidas de dureza Vickers e condutividade elétrica. O objetivo deste trabalho, portanto, foi observar e constatar os efeitos da mudança da microestrutura em relação às propriedades dureza e condutividade elétrica. / The Cu and its alloys have different applications in the owed modern society the excellent electric properties, thermal conductivity, resistance to the corrosion and other properties. These applications can be in valves, pipes, pots for absorption of solar energy, radiators for automobiles, current driver, electronic driver, thermostats elements and structural parts of nuclear reactors, as, for example, reels for field toroidal for a reactor of nuclear coalition. The alloys used in nuclear reactors, we can highlight Cu-Be, Cu-Sn and Cu-Pt. Ni and Co frequently are added to the Cu alloys so that the solubility is moved for temperatures more elevated with relationship to the binary systems of Cu-Sn and Cu-Pt. The addition of Ni-Pt or Ni-Sn to the Cu in the same or inferior percentages to 1,5% plus thermomechanical treatments changes the properties of the copper. We studied the electric conductivity and hardness Vickers of the Cu-Ni-Pt and Cu-Ni-Sn and compared with the electrolytic Cu. In the proposed flowcharts, breaking of the obtaining of the ingot, we proceeded with thermo mechanical treatments.
120

Estudos do desenvolvimento e caracterização das ligas Cu-Ni-Pt e Cu-Ni-Sn para fins eletro-eletrônicos

SILVA, LUIS C.E. da 09 October 2014 (has links)
Made available in DSpace on 2014-10-09T12:52:22Z (GMT). No. of bitstreams: 0 / Made available in DSpace on 2014-10-09T14:00:47Z (GMT). No. of bitstreams: 0 / Dissertacao (Mestrado) / IPEN/D / Instituto de Pesquisas Energeticas e Nucleares - IPEN/CNEN-SP

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