Thesis (Ph.D.)--State University of New York at Binghamton, 2002. / Adviser: Eric J. Cotts. Includes bibliographical references.

Thesis (Ph.D.)--Auburn University, 2005. / Abstract. Vita. Includes bibliographic references (ℓ. 156-170)

Thesis (M.S.)--Rochester Institute of Technology, 2008. / Typescript. Includes bibliographical references (leaves 96-98).

Thesis (Ph. D.)--Oregon State University, 2006. / Printout. Includes bibliographical references. Also available on the World Wide Web.

Thesis (PhD (Chemistry and Polymer Science))—University of Stellenbosch, 2006. / This study describes the exploitation of numerous donor ligand possibilities presented by selected nitrogen-rich heterocyclic ligands towards gold(I). The preparation and structural characterisation of novel gold(I) complexes, apart from conventional gold(I) bonding possibilities, also encompassed a study of bi- and polytopic bonding modes within a range of multifunctional ligands.

"More Than Moore's Law" is the driving principle for the electronic packaging industry. This principle focuses on system integration instead of transistor density in order to achieve faster, thinner, and smarter electronic devices at a low cost. A core area of electronics packaging is interconnection technology, which enables ultra-miniaturization and high functional density. Solder bump technology is one of the original, and most common interconnection methods for flip chips. With growing demand for finer pitch and higher number of I/Os, solder bumps have been forced to smaller dimensions and therefore, are subjected to higher current densities. However, the technology is now reaching its fundamental limitations in terms of pitch, processability, and current-handling due to electromigration. Electromigration in solder bumps is one of the major causes of device failures. It is accelerated by many factors, one of which is current crowding. Current crowding is the non-uniform distribution of current at the interface of the solder bump and under-bump metallurgy, resulting in an increase in local current density and temperature. These factors, along with the formation of intermetallic compounds, can lead to voiding and ultimately failure. Electromigration in solder bumps has prevented pitch-scaling below 180-210 microns, producing a shift in the packaging industry to other interconnection approaches, specifically copper pillars with solder. This research aims to explore the electromigration resistance of an adhesive-based copper-to-copper (Cu-Cu) interconnection method without solder, which is thermo-compression bonded at a low temperature of 180C. While solder bumps are more susceptible to electromigration, Cu is capable of handling two orders of magnitude higher current density. This makes it an ideal candidate for next generation flip chip interconnections. Using finite element analysis, the current crowding and joule heating effects were evaluated for a 30 micron diameter Cu-Cu interconnection in comparison with two existing flip chip interconnection techniques, Cu pillar with solder and Pb-free solder. A test vehicle (TV) was fabricated for experimental analysis with 760 bumps arranged in an area-array format with a bump diameter of 30 micron. Thermo-mechanical reliability of the test vehicle was validated under thermal cycling from -55C to 125C. The Cu-Cu interconnections were then subjected to high current and temperature stress from 1E4 to 1E6 amps per square centimeter at a temperature of 130C. The results establish the high thermo-mechanical reliability and high electromigration resistance of the proposed Cu-Cu interconnection technology.

Thesis (Ph. D.)--Delft University of Technology, 1999. / Includes bibliographical references.

Spark plasma sintering (SPS), also known as direct current sintering (DCS) is an advanced sintering technique that and uses a continuous pulsed direct current to rapidly process materials through Joule heating and offers significant advantages and versatility over conventional sintering methods. The technique features in energy saving owing to high heating rates and is very suitable for consolidation as well as diffusion bonding of electrical conductive advanced ceramic materials such as ultra high temperature ceramics (UHTCs). However, cooling rate in SPS also plays an important role as it directly influences the generation of residual stress especially for specimens consist of dissimilar phases such as composites and laminates primarily due to CTE mismatch. Therefore, in order to produce high quality materials, a zirconium diboride with addition of silicon carbide (ZrB2-SiC) ultra high temperature ceramic composite is selected to investigate the effect of cooling rate in SPS on microstructure and mechanical properties. After being densified at the target temperature, ZrB2-25vol%SiC specimens are cooled from 1800°C using controlled cooling rates of 10 °C/minute to ~225.5 °C/minute (free cooling). A time dependent finite element analysis (FEA) model is used to simulate the temperature gradients across the specimens at dwell times and during the cooling processes. The residual stress within the specimens are experimentally verified using X-ray diffraction (XRD) and Raman spectrometry, and found maximum residual stress within the specimen cooled at 225.5 °C/minute. Peak Hardness and moderate elastic modulus is found for specimen sintered at 1800 °C and cooled at 100 °C/minute, which make this temperature and cooling rate appropriate conditions for future fabrication of UHTCs with similar thermal and electrical properties. These materials are of great interest for their excellent high-temperature capabilities, wear and corrosion resistance, and are regarded as material candidates for engineering applications in extreme environments. Therefore, development of an effective joining technique is important since near-net shape fabrication is challenging, and joints formed by brazing or conventional solid-state diffusion bonding limit the mechanical strength and high temperature applications of the base materials. Using SPS we have rapidly and successfully joined ZrB2 to hafnium diboride (HfB2) at 1750 and 1800 °C within a minute through electric current assisted solid-state diffusion bonding. The electric current enables localized Joule heating as well as plastic deformation of the mating surface asperities, and enhances the elemental interdiffusion process at the HfB2/ZrB2 interfaces owing to electromigration, which leads to the formation of ZrxHf1-xB2 solid solution. A series of characterization and analytical techniques including scanning electron microscopy (SEM), wavelength dispersive spectroscopy (WDS), electron backscatter diffraction (EBSD), and scanning transmission electron microscopy (S/TEM) are employed to study the microstructure and chemical composition at of the HfB2/ZrB2 interfaces. Apart from enhanced diffusion as a result of electromigration, the applied electric current can also be use to promote plastic deformation in ZrB2, which does not go through gross plastic deformation due to its extremely high melting point and brittle nature even when elevated temperature and pressure are applied. Through “electroplastic effect” (an effect based on electromigration) the mobility and multiplication of the existing dislocations in ZrB2 is enhanced, and a “metal-like” primary recrystallization phenomenon in the ZrB2 is observed meaning the material has experienced a sufficient amount of plastic deformation and reached the critical dislocation density and configuration for nucleation of “strain-free” grains. The average grain size of the recrystallized grain is only ½ of its original value. These findings suggest great potentials in microstructural tailoring and grain refinement of conductive advanced ceramics using SPS, and provide promising ideas for future fabrications and applications.

No description available.

Magnesium alloys are widely used in engineering applications, including aerospace and automobile industries, due to their desirable properties, such as lower density, high damping capacity, relatively high thermal conductivity, good machinability, and recyclability. Researchers have, therefore, been developing new magnesium materials. However, mechanical and corrosion properties are still limiting many commercial applications of magnesium alloys. In this Ph.D. thesis research, I developed Mg-Ti composite materials to offer some solutions to further improve the mechanical behavior of magnesium, such as titanium-magnesium (Ti-Mg) claddings, Mg-Ti multilayers, and Ti particle enforced Mg alloys. Low cost manufacturing processes, such as hot roll-bonding (RB) and accumulative roll-bonding (ARB) techniques, were used to produce Mg-Ti composites and sheets. The microstructural evolution and mechanical properties of composites were investigated using optical microscopy (OM), X-ray diffraction (XRD), scanning electron microscopy (SEM), energy dispersive spectroscopy (EDS), electron backscatter diffraction (EBSD), nanoindentation, and tensile tests. In the first part of this study, I investigated the bonding strength of the AZ31/Ti to understand the mechanical properties of Mg/Ti composites. Using a single pass RB process, I fabricated AZ31/Ti multilayers with the thickness reduction in a range of 25% to 55%. The hot-rolled AZ31/Ti multilayers were heat-treated at 400 °C for 6, 12, and 24 hours, respectively, in an argon atmosphere. Tensile-shear tests were designed to measure the bonding strength between AZ31/Ti multilayers. Furthermore, the experimental results revealed good bonding of the AZ31/Ti multilayers without forming any intermetallic compounds in the as-rolled and heat-treated AZ31/Ti multilayers. The good bonding between Ti and AZ31 is the result of diffusion bonding whose thickness increases with increasing heat-treatment time and thickness reduction. The shear strength of the Ti/AZ31 multilayer increases with increasing bonding layer thickness. In the second part of this study, I characterized the microstructure and texture of three-layered Ti/AZ31/Ti clad sheets which were produced by single-pass hot rolling with a reduction of thickness 38% (sheet I) and 50% (sheet II). The AZ31 layer in sheets I and II exhibited shear bands and tensile twins {1012}⟨1001⟩ . The shear bands acted as local strain concentration areas which led to failure of the clad sheets with limited elongation. Heat treatment caused changes in the microstructure and mechanical properties of clad sheets due to static recrystallization (SRX) on twins and shear bands in the AZ31 layer. Recrystallized grains usually randomize the texture which causes weaken the strong deformed (0001) basal texture. Twins served as nucleation sites for grain growth during SRX. Tensile tests at room temperature showed significantly improved ductility of the clad sheets after heat treatment at 400°C for 12h. The results showed that the mechanical properties of clad sheets II are better than clad sheet I: The clad sheet II shows elongation 13% and 35% along the rolling direction (RD) for as-rolled and annealed clad sheet, respectively whereas the clad sheet I shows elongation 10% and 22% along RD for as-rolled and annealed clad sheet, respectively. In the final part of this study, I examined the effects of dispersed pure titanium particles (150 mesh) with 0, 2.3, 3.5, 4.9, and 8.6 wt. % on the microstructure and mechanical properties of AZ31-Mg alloy matrix. Mg-Ti composites were processed through three accumulative roll bonding (ARB) steps using thickness reductions of 50% in each pass followed by heat treatment at 400 °C for 12 h in an argon atmosphere. ARB is an efficient process to fabricate Mg-Ti composites. Mechanical properties of Mg- 0Ti and Mg-2.3Ti composite were enhanced by ~ 8% and 13 % in yield strength and ~ 30% and 32 % in ultimate tensile strength, respectively. Meanwhile, the elongation of the composites were decreased by 63% and 70%, respectively. After heat treatment, the results showed a decrease in yield strength and increase in elongation to fracture. The mechanical properties of the Mg-0 and Mg-2.3Ti composite were enhanced: ultimate tensile strength by 9% and 7%, and elongation by 40% and 67%, while the yield strength was decreased by 28% and 36% compared with the initial AZ31. Enhancements of strength and ductility were the results of two mechanisms: a random matrix texture by ARB and ductile titanium particle dispersion.