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  • About
  • The Global ETD Search service is a free service for researchers to find electronic theses and dissertations. This service is provided by the Networked Digital Library of Theses and Dissertations.
    Our metadata is collected from universities around the world. If you manage a university/consortium/country archive and want to be added, details can be found on the NDLTD website.
1

Impact of interconnect scaling on electromigration and stress migration reliability

Lu, Xia 28 August 2008 (has links)
Not available / text
2

A first report on electromigration studies at a model copper-aluminum railgun contact

Delaney, Luc D. January 2006 (has links) (PDF)
Thesis (M.S. in Mechanical Engineering)--Naval Postgraduate School, December 2006. / Thesis Advisor(s): Indranath Dutta. "December 2006." Includes bibliographical references (p. 51-53). Also available in print.
3

Impact of interconnect scaling on electromigration and stress migration reliability

Lu, Xia, January 1900 (has links) (PDF)
Thesis (Ph. D.)--University of Texas at Austin, 2005. / Vita. Includes bibliographical references.
4

Analysis of electromigration in single- and dual-inlaid Cu interconnects

Justison, Patrick Ryan. January 2003 (has links) (PDF)
Thesis (Ph. D.)--University of Texas at Austin, 2003. / Vita. Includes bibliographical references. Available also from UMI Company.
5

Use of non-specific and specific interactions in the analysis of testosterone and related compounds by capillary electromigration techniques /

Amundsen, Lotta K. January 1900 (has links) (PDF)
Thesis (doctoral)--University of Helsinki, 2008. / Includes bibliographical references. Also available on the World Wide Web.
6

Investigation of electromigration reliability in Al(Cu) interconnects /

Gall, Martin, January 1999 (has links)
Thesis (Ph. D.)--University of Texas at Austin, 1999. / Vita. Includes bibliographical references (leaves 227-230). Available also in a digital version from Dissertation Abstracts.
7

Analysis of electromigration in single- and dual-inlaid Cu interconnects

Justison, Patrick Ryan 28 August 2008 (has links)
Not available / text
8

Electromigration critical length effect and early failures in Cu/oxide and Cu/low k interconnects

Lee, Ki-don 28 August 2008 (has links)
Not available / text
9

Microstructural configuration influence on electromigration in Sn/Cu thin films

Xu, Yi 12 1900 (has links)
No description available.
10

The application of generalised Maxwell-Stefan equations to protein gels : a thesis submitted in partial fulfillment of the requirements for the degree of Master of Engineering, Department of Chemical and Process Engineering, University of Canterbury /

Lu, Kang. January 1900 (has links)
Thesis (M.E.)--University of Canterbury, 2007. / Typescript (photocopy). "September 2007." Includes bibliographical references (p. 83-85). Also available via the World Wide Web.

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