A MEMS-based micro-electro-discharge machining technique that is enabled by the actuation of micromachined planar electrodes defined on the surfaces of the workpiece is developed that eliminates the need of numerical control machines. First, the planar electrodes actuated by hydrodynamic force is developed. The electrode structures are defined by patterning l8-µm-thick copper foil laminated on the stainless steel workpiece through an intermediate photoresist layer and released by sacrificial etching of the resist layer. The planer electrodes are constructed to be single layer structures without particular features underneath. All the patterning and sacrificial etching steps are performed using dry-film photoresists towards achieving high scalability of the machining technique to large-area applications. A DC voltage of 80-140 V is applied between the electrode and the workpiece through a resistance-capacitance circuit that controls the pulse energy and timing of spark discharges. The parasitic capacitance of the electrode structure is used to form a resistance capacitance circuit for the generation of pulsed spark discharge between the electrode and the workpiece. The suspended electrodes are actuated towards the workpiece using the downflow of dielectric machining fluid, initiating and sustaining the machining process. Micromachining of stainless steel is experimentally demonstrated with the machining voltage of 90V and continuous flow of the fluid at the velocity of 3.4-3.9 m/s, providing removal depth of 20 µm. The experimental results of the electrode actuation match well with the theoretical estimations. Second, the planar electrodes are electrostatically actuated towards workpiece for machining. In addition to the single-layer, this effort uses double-layer structures defined on the bottom surface of the electrode to create custom designed patterns on the workpiece material. The suspended electrode is electrostatically actuated towards the wafer based on the pull-in, resulting in a breakdown, or spark discharge. This instantly lowers the gap voltage, releasing the electrode, and the gap value recovers as the capacitor is charged up through the resistor. Sequential pulses are produced through the self-regulated discharging-charging cycle. Micromachining of the stainless-steel wafer is demonstrated using the electrodes with single-layer and double-layer structures. The experimental results of the dynamic built-capacitance and mechanical behavior of the electrode devices are also analyzed.

A MEMS-based micro-electro-discharge machining technique that is enabled by the actuation of micromachined planar electrodes defined on the surfaces of the workpiece is developed that eliminates the need of numerical control machines. First, the planar electrodes actuated by hydrodynamic force is developed. The electrode structures are defined by patterning l8-µm-thick copper foil laminated on the stainless steel workpiece through an intermediate photoresist layer and released by sacrificial etching of the resist layer. The planer electrodes are constructed to be single layer structures without particular features underneath. All the patterning and sacrificial etching steps are performed using dry-film photoresists towards achieving high scalability of the machining technique to large-area applications. A DC voltage of 80-140 V is applied between the electrode and the workpiece through a resistance-capacitance circuit that controls the pulse energy and timing of spark discharges. The parasitic capacitance of the electrode structure is used to form a resistance capacitance circuit for the generation of pulsed spark discharge between the electrode and the workpiece. The suspended electrodes are actuated towards the workpiece using the downflow of dielectric machining fluid, initiating and sustaining the machining process. Micromachining of stainless steel is experimentally demonstrated with the machining voltage of 90V and continuous flow of the fluid at the velocity of 3.4-3.9 m/s, providing removal depth of 20 µm. The experimental results of the electrode actuation match well with the theoretical estimations. Second, the planar electrodes are electrostatically actuated towards workpiece for machining. In addition to the single-layer, this effort uses double-layer structures defined on the bottom surface of the electrode to create custom designed patterns on the workpiece material. The suspended electrode is electrostatically actuated towards the wafer based on the pull-in, resulting in a breakdown, or spark discharge. This instantly lowers the gap voltage, releasing the electrode, and the gap value recovers as the capacitor is charged up through the resistor. Sequential pulses are produced through the self-regulated discharging-charging cycle. Micromachining of the stainless-steel wafer is demonstrated using the electrodes with single-layer and double-layer structures. The experimental results of the dynamic built-capacitance and mechanical behavior of the electrode devices are also analyzed.

A MEMS-based micro-electro-discharge machining technique that is enabled by the actuation of micromachined planar electrodes defined on the surfaces of the workpiece is developed that eliminates the need of numerical control machines. First, the planar electrodes actuated by hydrodynamic force is developed. The electrode structures are defined by patterning l8-µm-thick copper foil laminated on the stainless steel workpiece through an intermediate photoresist layer and released by sacrificial etching of the resist layer. The planer electrodes are constructed to be single layer structures without particular features underneath. All the patterning and sacrificial etching steps are performed using dry-film photoresists towards achieving high scalability of the machining technique to large-area applications. A DC voltage of 80-140 V is applied between the electrode and the workpiece through a resistance-capacitance circuit that controls the pulse energy and timing of spark discharges. The parasitic capacitance of the electrode structure is used to form a resistance capacitance circuit for the generation of pulsed spark discharge between the electrode and the workpiece. The suspended electrodes are actuated towards the workpiece using the downflow of dielectric machining fluid, initiating and sustaining the machining process. Micromachining of stainless steel is experimentally demonstrated with the machining voltage of 90V and continuous flow of the fluid at the velocity of 3.4-3.9 m/s, providing removal depth of 20 µm. The experimental results of the electrode actuation match well with the theoretical estimations. Second, the planar electrodes are electrostatically actuated towards workpiece for machining. In addition to the single-layer, this effort uses double-layer structures defined on the bottom surface of the electrode to create custom designed patterns on the workpiece material. The suspended electrode is electrostatically actuated towards the wafer based on the pull-in, resulting in a breakdown, or spark discharge. This instantly lowers the gap voltage, releasing the electrode, and the gap value recovers as the capacitor is charged up through the resistor. Sequential pulses are produced through the self-regulated discharging-charging cycle. Micromachining of the stainless-steel wafer is demonstrated using the electrodes with single-layer and double-layer structures. The experimental results of the dynamic built-capacitance and mechanical behavior of the electrode devices are also analyzed. / Applied Science, Faculty of / Electrical and Computer Engineering, Department of / Graduate

Les puces microfluidiques sont des éléments clés pour la manipulation et l'analyse de solutions et d'échantillons biologiques. Elles facilitent les études aux échelles microscopiques et sont le fondement du concept de laboratoire sur puce, à la pointe des diagnostics médicaux. L'objectif de ces travaux de thèse a été d'explorer les possibilités fonctionnelles offertes par les architectures microfluidiques 3D, dans le cadre du développement d'outils diagnostiques reposant sur le tri, le marquage et la manipulation de cellules. Ces fonctions ont été validées sur des sous-populations de monocytes, qui sont des marqueurs de maladies inflammatoires. Afin de couvrir une chaîne cohérente d'étapes nécessaires au prétraitement des échantillons biologiques complexes, trois fonctions complémentaires ont été étudiées : le tri par taille par filtration hydrodynamique, le tri immunologique par séparation magnétique et le marquage sur puce par microparticules magnétiques. En vue d'effectuer des réactions de marquage (sondes fluorescentes ou microbilles magnétiques), un micro-mélangeur reposant sur la séparation et recombinaison de flux (transformation du boulanger) a été fabriqué et caractérisé. Des expériences de test des dispositifs pour les mélanges fluorescéine/eau et cellules/microbilles sont proposées, ainsi que les modèles analytiques et numériques associés. De nouvelles approches de tri par taille par filtration hydrodynamique ont été étudiées, en réalisant des structures 3D en "bypass", qui rendent possible une stratégie de mélange adaptée aux cellules et particules. Un modèle analytique des écoulements et de l'efficacité de tri et de mélange est proposé, ainsi qu'une caractérisation des dispositifs. Il a été de plus démontré que cette approche permettait également de réaliser la séparation d'espèces sub-micrométriques comme les microparticules sanguines. Tous les systèmes microfluidiques 3D ont été obtenus par une technique originale d'empilement (laminage) de films secs photosensibles, réduisant nettement le temps de micro-fabrication et compatibles avec les procédés standards. Cette technique de fabrication permet également l'intégration de micro-sources magnétiques dans les laboratoires sur puce par la réalisation de micro-bobines planaires sous des canaux microfluidiques. En couplant les effets des micro-bobines intégrées aux champs générés par des aimants extérieurs, nous apportons la preuve de concept de systèmes pour la séparation, la déviation et le piégeage de microbilles magnétiques. Les modèles (champs et force magnétiques) et la caractérisation des dispositifs seront présentés. Nous aborderons également la réalisation d'instrumentation spécifique (source de courant) pour l'actionnement des bobines, permettant le contrôle (temporel et en intensité) des champs magnétiques appliqués. / Microfluidic chips are key elements for solutions and biological samples handling and analysis. They are enablers for micro-scale studies and are the cornerstone of lab on chips, at the cutting edge of medical diagnostics. The aim of this thesis work was to explore functional possibilities offered by 3D microfluidic architectures for the development of diagnostic tools relying on cell sorting, tagging and handling. These functions were investigated on monocytes sub-populations, which are markers for many inflammatory diseases. In order to cover a consistent series of necessary steps for complex biological samples pretreatment, three additional functions were studied: size sorting with hydrodynamic filtration, immuno-isolation by magnetic separation, and on-chip tagging with magnetic microparticles. To perform tagging reactions, a micromixer based on diffusion and flow split and recombination (baker's transform) was fabricated and characterized. Analytical (diffusion) and numerical (diffusion-advection) models are showed, together with test experiments on the devices for mixing reactions of fluorescein/water and cells/microbeads. New approaches of hydrodynamic filtration based size sorting were investigated by devising 3D bypass structures, that allow developing a mixing strategy (tagging reactions) suited to cells and particles. An analytical model for flows and sorting efficiency is introduced and compared to the devices characterization. Furthermore, it was shown that this approach also enables sorting of sub-micron particles (like blood microparticles). All 3D microfluidic systems were obtained thanks to an original dry film photoresist stacking (lamination) technique, dramatically reducing micro-fabrication time, even though compatible with standard process. This fabrication technique also enables magnetic micro-sources integration in lab on chips by realizing planar micro-coils underneath microfluidic channels. By coupling the effects of integrated micro-coils to the fields generated by external magnets, we brought the proof of concept of systems dedicated to trapping, focusing and separating (in flow) magnetic microbeads. Models (magnetic fields and forces) are described along with devices characterization. Conception of specific instrumentation (current source) for micro-coils actuation is also shown, as it allows time and intensity control over applied magnetic fields.

The recent developments in Low Temperature Co-fired Ceramic (LTCC) as a substrate material enable it to be used in the micro and millimetre wave range providing low dissipation factors at high frequencies, good dielectric properties and a high degree of integration for further miniaturised devices. The most common metallisation method used in LTCC technology is screen printing with high cost noble metals such as silver and gold that are compatible with the high sintering temperatures (850°C). However, these techniques require high capital cost and maintenance cost. As the commercial world requires convenient and low cost process technologies for mass production, alternative metallisation methods should be considered. As a result, electroless copper plating of fired LTCC was mainly investigated in this research. The main goals of this project were to carry out electroless plating of fired LTCC with sufficient adhesion and to extend the process to metallise closed LTCC channel structures to manufacture Substrate Integrated Waveguide (SIW) components. The objectives were focused on electroless copper deposition on fired LTCC with improved adhesion. Electroless deposits on the Sn/Pd activated LTCC surface showed poor adhesion without any surface pre-treatments. Hence, chemical etching of fired LTCC was carried out using concentrated NaOH solution. NaOH pre-treatment of LTCC led to the formation of flake like structures on the LTCC surface. A number of surface and chemical analysis techniques and weight measurements were used to investigate the mechanism of the modification of the LTCC surface. The results showed that the flake like structures were dispersed in the LTCC material and a material model for the LTCC structure was proposed. SEM EDX elemental mapping showed that the flake like structure consisted of aluminium, calcium, boron and oxygen. Further experiments showed that both the concentration of NaOH and the immersion time affect the surface morphology and the roughness of fired LTCC. The measured Ra values were 0.6 μm for untreated LTCC and 1.1 μm for the LTCC sample treated with 4M NaOH for 270 minutes. Adhesion tests including peel test and scratch test were carried out to examine the adhesion strength of the deposited copper and both tests indicated that the NaOH pre-treatment led to an improvement, with the best results achieved for samples treated with 4M NaOH. A second aspect of the research focused on the selective metallisation of fired LTCC. Excimer laser machining was used to pattern a resist film laminated on the LTCC surface. This process also roughened the substrate and created channels that were characterised with respect to the laser operating parameters. After patterning the resist layer, samples were activated using Sn/Pd catalyst solution followed by the electroless copper deposition. Electroless copper was selectively deposited only on the patterned LTCC surface. Laser parameters clearly affected the copper plating rate. Even with a similar number of shots per area, the tracks machined with higher repetition rate showed relatively more machining depth as well as good plating conditions with low resistance values. The process was further implemented to realize a complete working circuit on fired LTCC. Passive components including a capacitor and an inductor were also fabricated on LTCC using the mask projection technique of the excimer laser system. This was successful for many designs, but when the separation between conductor lines dropped below 18 μm, electroless copper started to deposit on the areas between them. Finally, a method to deposit copper films on the internal walls of closed channel structures was developed. The method was first demonstrated by flowing electroless copper solutions through silane treated glass capillaries. A thin layer (approx. 60 nm) of electroless copper was deposited only on the internal walls of the glass capillaries. The flow rate of the electroless copper solution had to be maintained at a low level as the copper deposits tended to wash away with higher flow rates. The structures were tested for transmission losses and showed low (<10dB) transmission losses in the terahertz region of the electromagnetic spectrum. The process was further applied to deposit electroless copper on the internal walls of the LTCC closed channel structures to manufacture a LTCC Substrate Integrated Waveguide (SIW).

No description available.

L’imagerie multispectrale permet d’améliorer la détection et la reconnaissance de cibles dans les applications de surveillance. Elle consiste à analyser des images de la même scène acquises simultanément dans plusieurs bandes spectrales grâce à un filtrage. Cette thèse étudie la possibilité de réaliser une matrice de 4 filtres Fabry Pérot (FP) intégrés 3D et ajustables par actionnement électrostatique dans le domaine visible-proche infrarouge. Les miroirs fixes des filtres FP sont des multicouches ZnS/YF₃ déposés sur un wafer de borosilicate, et les miroirs mobiles sont des membranes multicouches PECVD SiNH/SiOH encastrées sur une structure mobile très compacte micro-usinée dans un wafer en silicium. Les performances optiques des filtres FP ont été optimisées en prenant en compte la dissymétrie et le déphasage à la réflexion des miroirs. La structure mobile a été modélisée par éléments finis pour minimiser ses déformations lors de l’actionnement. Les étapes critiques des procédés de fabrication des miroirs mobiles en technologie Si ou SOI ont été mises au point : i) la fabrication et la libération par gravures profondes DRIE et XeF₂ des membranes multicouches avec une contrainte résiduelle ajustée par recuit et une réflectance voisine de 50% dans une large gamme spectrale, ii) le contrôle des vitesse de la gravure DRIE avec des motifs temporaires permettant la gravure simultanée de motifs de largeur et de profondeur variables, et iii) la délimitation de motifs sur surfaces fortement structurées à l’aide de pochoirs alignés mécaniquement ou de films secs photosensibles. Ces travaux ouvrent la voie vers une réalisation complète d’une matrice de filtres FP intégrés 3D. / Multispectral imaging is used to improve target detection and identification in monitoring applications. It consists in analyzing images of the same scene simultaneously recorded in several spectral bands owing to a filtering. This thesis investigates the possibility to realize, an array of four 3D integrated Fabry-Perot (FP) filters that are tunable in the visible-near infrared range by electrostatic actuation. The fixed mirrors of the FP filters are ZnS/YF₃ multilayers deposited on a borosilicate wafer, and the movable mirrors are PECVD SiNH/SiOH multilayer membranes clamped in a very compact movable structure micromachined in a Si wafer. A 3rd glass wafer is used for filters packaging. Optical performances of the FP filters have been optimized by taking into account the asymmetry and the reflection phase shift of the mirrors and the mobile structure has been modeled by finite elements analysis notably to minimize its deformation during actuation. The critical steps of the movable mirrors fabrication process in Si or SOI technology have been developed : i) the fabrication and the release by DRIE and XeF₂ etching of 8 or 12 layers membranes with a residual stress tunable by annealing and a reflectance close to 50% in broad wavelength range (570-900nm), ii) the control with temporary patterns of the simultaneous deep etching of patterns with different widths and depths, and iv) various patterning techniques on highly structured surfaces based on shadow masks (with mechanical alignment) or laminated photosensitive dry films. These results open the way towards the full realization of an array of 3D integrated FP filters.