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Combined magnetron sputtering and ECR-CVD deposition of diamond-like carbon filmsChang, Jen-Fung 09 July 2002 (has links)
DLC exhibits an extreme hardness, chemical stability and optical transparency properties, which are, to a certain extent, similar to those of diamond and thus of technological importance. In the case of amorphous hydrogenated carbon (a-C:H) films they can be interpreted as intermediate between diamond, graphite, and polymer-like carbon sites. The most important intrinsic hardness is protection of tools or machine parts against wear. Most modifications have been used on DLC to enhanced mechanical properties, such as reducing its internal compressive stress (N, Si, and metal incorporation), or to reduce its surface energy for further lowering of its already low friction coefficient with 0.1. Among various deposition techniques, microwave generated discharges, especially electron cyclotron resonance (ECR) plasmas, develop excellent a high degree of ionization, high ions densities.
In this work, a novel hybrid technique for diamond-like carbon (DLC) film deposition has been developed, which combines the microwave ECR plasma discharging C2H2 and metallic magnetron sputtering. The effects of negative bias voltage and hydrocarbon flow rate for the deposition of a-C:H films on high speed steel were examined by Raman spectra, and their hardness was investigated by the Rockwell method. The Raman spectra show that at different hydrocarbon flow rate, the variation of the G line peak and width, and the integrated intensity ratio ID/IG of DLC and graphic, correlate well with the film hardness. Consequently, we suggest a deposition mechanism of DLC for this combined method.
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Tecnologia LOCOS utilizando nitretos de silicio depositados por ECR-CVD / LOCOS technology using silicon nitride deposited by ECR-CVDPereira, Marcus Anibal 12 May 2005 (has links)
Orientador: Ioshiaki Doi / Dissertação (mestrado) - Universidade Estadual de Campinas, Faculdade de Engenharia Eletrica e de Computação / Made available in DSpace on 2018-08-08T12:57:52Z (GMT). No. of bitstreams: 1
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Previous issue date: 2005 / Resumo: Isolantes de nitreto de silício (SiNx) para aplicação na tecnologia de isolação LOCOS foram depositados por ECR-CVD a temperatura ambiente e RP/RTCVD, a baixa pressão (5mTorr), com fluxos de gás de N2 de 2.5, 5, 10 e 20sccm, com fluxos de gases de SiH4/Ar fixos de 200sccm/20sccm, e potência de microondas de 1000W em substratos de SiO2-Pad/Si e Si. As estruturas de SiNx/SiO2-Pad/Si e SiNx/Si obtidas foram utilizadas para analisar as características físicas do nitreto de silício. Análises de espectroscopia de infravermelho (FTIR) revelaram a presença de trocas de posição do pico principal das ligações Si-N, das ligações N-H e das ligações Si-N (modo de vibração stretching) nos filmes de nitreto de silício, que está relacionado aos fluxos de N2 na mistura de gases. Os índices de refração entre 1.88 e 2.48 e as espessuras entre 120nm e 139nm foram determinados através de elipsometria. Com estes valores de espessura e com os tempos de ataque em Buffer de HF, foram determinadas as taxas de deposição de 9,6 a 11,1nm/min e taxas de corrosão de 2 a 86nm/min. O processo LOCOS, com etapas seqüenciais de fotolitografia e oxidação térmica, foi executado nas estruturas de SiNx/SiO2-Pad/Si e também de SiNx/Si (sem a presença de óxido "almofada"), com a espessura de cada tipo de nitreto entre 110nm a 215nm e espessura do óxido ?almofada? de 0 a 124nm. Análises de microscópio óptico e de microscopia eletrônica de varredura (SEM) foram utilizadas respectivamente para investigar a resistência dos nitretos de silício à oxidação térmica, executada sob altas temperaturas (1000ºC) e o efeito ?bico de pássaro? formado nas estruturas LOCOS. O nitreto depositado com fluxo de N2 de 10sccm (N10) foi o que apresentou a menor invasão lateral por parte do óxido de campo dentre os nitretos estudados, tanto com quanto sem a camada de óxido de ?almofada? sob o nitreto. O efeito "bico de pássaro" formado nas estruturas LOCOS teve comprimento de avanço lateral variando de 330nm a 2160nm tomando como base a oxidação local executada em temperatura de 1000ºC durante 180 minutos / Abstract: Silicon nitride (SiNx) insulators for LOCOS applications have been deposited by RP/RTCVD and ECR-CVD at room temperature, at low pressure (5mTorr), with N2 flows of 2.5, 5, 10 and 20sccm with fixed SiH4/Ar flows of 200/20sccm with a microwave power of 1000W on SiO2-Pad/Si and Si substrates. SiNx/Si structures were obtained to analyze the physical characteristics of silicon nitride. Fourier transform infrared (FTIR) spectrometry analyses revealed the main peak position shifts of Si-N, N-H and Si-N (stretching mode) bonds for each silicon nitride films, which is related to N2 flows in gas mixture. The refractive indexes between 1.88 and 2.48 and the thickness between 120nm and 139nm were determined by ellipsometry. With these thickness values and with buffered HF etching times, it was also determined the deposition rates of 9,6 - 11,1nm/min and etch rates of 2 -86nm/min. On the SiNx(110 -215nm)/SiO2-Pad(0 - 124nm)/Si and SiNx/Si (without pad oxide) structures, the LOCOS process, with sequential photolithography and thermal wet oxidation steps, was performed. Optical and scanning electron microscopy (SEM) analysis were used to investigate the silicon nitride to thermal oxidation accomplishement at high temperature of 1000 ºC, and bird's beak in the obtained LOCOS structures. On both structures (with and without pad oxide), the smallest lateral extension of the field oxide (bird's beak) was observed for the nitride films obtained with N2 flows of 10sccm (N10). The lengths of the bird's beak, in the obtained LOCOS structure, have resulted between 330nm and 2160nm / Mestrado / Eletrônica, Microeletrônica e Optoeletrônica / Mestre em Engenharia Elétrica
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