Cette étude concerne les isolants support, utilisés dans l'appareillage haute tension blindé sous pression gazeuse. La réduction de la taille du matériel est une demande constante pour des questions de coût. Elle impacte directement les isolants et l'optimisation diélectrique est rendue nécessaire. On peut considérer que les points qui nécessitent une attention particulière sont : La zone de point triple : point de jonction entre un isolant, le gaz et le métal, zone sensible aux décharges partielles et aux particules qui peuvent s'y accumuler. Les particules métalliques qui peuvent se trouver à l'intérieur du système haute-tension et les problèmes d'accumulation de la charge sur la surface de l'isolant qui peuvent réduire sa tenue diélectrique lors de l'application d'une surtension. Ces trois points représentent la base de départ de cette étude qui caractérise la multitude de phénomènes complexes qui apparaissent en présence de haute tension.

Cette étude concerne les isolants support, utilisés dans l'appareillage haute tension blindé sous pression gazeuse. La réduction de la taille du matériel est une demande constante pour des questions de coût. Elle impacte directement les isolants et l'optimisation diélectrique est rendue nécessaire. On peut considérer que les points qui nécessitent une attention particulière sont : La zone de point triple : point de jonction entre un isolant, le gaz et le métal, zone sensible aux décharges partielles et aux particules qui peuvent s'y accumuler. Les particules métalliques qui peuvent se trouver à l'intérieur du système haute-tension et les problèmes d'accumulation de la charge sur la surface de l'isolant qui peuvent réduire sa tenue diélectrique lors de l'application d'une surtension. Ces trois points représentent la base de départ de cette étude qui caractérise la multitude de phénomènes complexes qui apparaissent en présence de haute tension.

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The effects of octadecylamine-functionalized reduced graphene oxide (FRGO) on the frictional and wear properties of diglycidylether of bisphenol-A (DGEBA) epoxy are studied using a pin-on-disk tribometer. It was observed that the addition of FRGO significantly improves the tribological, mechanical, and thermal properties of epoxy matrix. Graphene oxide (GO) was functionalized with octadecylamine (ODA), and then reduction of oxygen-containing functional groups was carried out using hydrazine monohydrate. The Raman and x-ray photoelectron spectroscopy studies confirm significant reduction in oxygen-containing functional groups and formation of ODA functionalized reduced GO. The nanocomposites are prepared by adding 0.1, 0.2, 0.5 and 1.0 wt % of FRGO to the epoxy. The addition of FRGO increases by more than an order of magnitude the sliding distance during which the dynamic friction is ≤ 0.1. After this distance, the friction sharply increases to the range of 0.4 - 0.5. We explain the increase in sliding distance during which the friction is low by formation of a transfer film from the nanocomposite to the counterface. The wear rates in the low and high friction regimes are approximately 1.5 x 10-4 mm3/N·m and 5.5 x 10-4 mm3/N·m, respectively. The nanocomposites exhibit a 74 % increase in Young’s modulus with 0.5 wt. % of FRGO, and an increase in glass transition and thermal degradation temperatures.

Master of Science / Department of Chemical Engineering / Keith Hohn / The study will utilize a probabilistic reaction modeling method for ring-opening reactions of epoxide. In particular, to elucidate the reaction mechanism by the methods presented, focus will be placed on the nucleophillic attack of ethylene oxide by ammonia and its anion. This focus was chosen because of the potential to gain significant advantage in computational intensity required to model the epoxy-amino macromolecular curing reactions and resulting thermochemical and physical properties of the cured resin. The method employed utilizes the combinatorial probability that 1. Two molecules will approach a transition state with sufficient energy to drive reaction 2. Any reaction will occur for a given penetration into the potential energy surface. The concept of a transition state is relaxed to allow a dynamic probability that any reaction will proceed given a position on the intrinsic reaction coordinate (IRC) rather than searching for a specific transition state of theoretical reaction probability. 3. The reaction that occurs yields a desired stable or semi-stable molecular complex This study will focus on identifying possible stable and semi-stable products and corresponding rate constants. The technique developed here is novel in that it provides an unsupervised method to identify all structures corresponding to minima on the potential energy surface. The technique provides a pragmatic and efficient approach to sample a molecular system for different reaction mechanisms and provides a relative energy requirement to achieve these mechanisms with no presupposition of the mechanism, product, or transition state. It is possible from this data to derive rate constants for a reacting system, however, the rate constant derived for the EO/NH2 molecular system yielded significantly understated reaction probabilities and therefore rate constants.

A dissertation submitted to the Faculty of Engineering and the Built Environment, University of the Witwatersrand, in fulfilment of the requirements for the degree of Master of Science in Engineering 25 May 2017 / Two of the main contributors to high voltage insulation failure are thermal and electrical stresses. The failures may be mitigated by using nanodielectrics. The enhanced effect of nanoparticles in nanodielectrics is attributed to an interaction zone/interphase around each individual nanoparticle between the nanoparticle and host polymer. However, particle clumping or agglomerates are a major challenge in nanodielectric technology. In this work mitigation of the clumping challenges was explored through Rheology in determining optimal particle loading levels. The nanodielectrics studies were Boron Nitride and Carbon Nanospheres in Araldite Epoxy. The rheology results indicated an optimal loading level of 1.09 vol % to 1.35 vol% for Boron Nitride in Epoxy and 0.33 vol% for Carbon Nanospheres in Epoxy. Microscopy, dielectric spectroscopy, electrical tree characterisation, thermal expansion and laser flash analysis were used to validate the efficacy of the rheology results. The results indicated improved properties of the resultant dielectric such as; increased mechanical stiffness, increased electrical resistance and the percolation threshold, partial discharge suppression and increased thermal conductivity at the glass transition temperature. This study has established a rheology-based technique incorporated in the manufacturing process to determine the optimal filler loading of C/Epoxy and BN/Epoxy nanodielectrics. Future work is recommended as investigating either new particle types such as Sulphur hexafluoride in Carbon Nanospheres or mixtures of Carbon Nanospheres and Boron Nitiride. / MT 2017

In this investigation, polymer precursor of syntactic foam has been reinforced with SiC nanoparticles to enhance mechanical and fracture properties. Derakane 8084 vinyl ester resin was first dispersed with 1.0 wt% of SiC particles using a sonic cavitation technique. In the next step, 30.0 wt% of microspheres (3M hollow glass borosilicate, S-series) were mechanically mixed with the nanophased vinyl ester resin, and cast into rectangular molds. A small amount of styrene was used as dilutant to facilitate mixing of microspheres. The size of microspheres and SiC nanoparticles were 20-30 um and 30-50 nm, respectively. Tension, compression, and flexure tests were conducted following ASTM standards and a consistent improvement in strength and modulus within 20-35% range was observed. Fracture toughness parameters such as KIC and GIC were also determined using ASTM E-399. An improvement of about 11-15% was observed. Samples were also subjected to various environmental conditions and degradation in material properties is reported. / by Debdutta Das. / Thesis (M.S.C.S.)--Florida Atlantic University, 2009. / Includes bibliography. / Electronic reproduction. Boca Raton, Fla., 2009. Mode of access: World Wide Web.

Thermal management in electronic devices is one of the biggest challenges faced by the semiconductor industry. Thermal Interface Materials (TIMs) are used in electronics to fill air gaps between the surfaces of integrated circuit (IC) chips to dissipate heat. Polymer-graphene composites, a very promising choice as TIMs also have a drawback of high interfacial thermal resistance and a low thermal conductivity of polymer. It is known from the theoretical models that application of pressure may affect the thermal conductivity in a desirable manner, but quantitative simulations were not available. In this paper, the pressure dependence of thermal conductivity of epoxy and interfacial resistance at epoxy-graphene interface is studied using non-equilibrium molecular dynamics (NEMD) simulations. The results show that the thermal conductivity of epoxy increases with increase in pressure, and they compare well with the predictions using a theoretical model. The interfacial thermal resistance at epoxy-graphene interface reduces with increase in pressure. The reduction is sharp in the beginning and slowly reaches saturation as pressure increases. At 10 GPa compressive pressure, a 90-95% decrease in interfacial thermal resistance is observed.

Water diffusion is widely believed to be a driving factor in the breakdown of corrosion protection by polymer coatings. However, in the epoxy-phenolic system examined, water absorption into more cured, electrically resistive coatings is shown to increase, contradicting the common perception that hydrophobic coatings yield improvements in corrosion protection. Water uptake into epoxy-phenolic coatings was estimated as a function of time using the dielectric and resistive properties of the coating measured using electrochemical impedance spectroscopy (EIS). Bulk water uptake through the coating surface and the localised nature of corrosive failure was then confirmed using localised electrochemical impedance (LEIS). This technique also allowed comparison of resistance for coatings with different curing degrees. The greater degree of water absorption into highly cured coatings was attributed to diffusion into the polymer free volume, which increases with prolonged crosslinking. Evidence for this mechanism was found in the decreasing density of epoxy-phenolic coatings as a function of cure time. The effect of coating volume was therefore evaluated with respect to the dry coating dielectric properties. Cathodic delamination of the epoxy-phenolic coatings was achieved on tinplated steel substrates, whereas this was not possible from tin-free steel (ECCS). The electrochemical behaviour of these two substrates was examined under the same NaCl concentration, their surfaces were analysed by XPS prior to immersion, and XRD after potentiostatic polarisations. The electrochemical behaviour of the bare substrates was found to be unchanged by heating to the coating cure temperature (within the accuracy of polarisation tests carried out). Nonetheless, the delamination rate of epoxy-phenolic coatings deposited on them was dependent on the coating crosslinking (cure time). The reason coating adhesion selectively failed on tinplate substrates is believed to be the lower concentration of hydroxides on its relatively flat surface, allowing less bonding to take place at the interface with the coating. The impact of the substrate on coating resistivity was further investigated by volume resistivity measurements in the presence and absence of a metallic substrate. The resistivity of free standing films was tested in permeation cells, and showed a direct correlation between the polymer resistivity and the resistivity of the solution in which it was immersed. In comparison, attached films remained highly resistive at all examined concentrations. To conclude, the results presented here demonstrate that water uptake is not as critical to the breakdown in the protection offered by epoxy-phenolics as bonding at the metal-polymer interface. These results suggest that the complex interaction between these two dissimilar materials determines the overall coating electrochemical behaviour.

As the semiconductor technology moves further into scaled down device structures, modern day complexities in the fabrication processes become more prevalent. This thesis focuses on the issues associated with mechaincal and adhesion failure in low dielectric constant (low-k) thin films. In this thesis the four point bend test and nanoscratch test method was used for evaluating adhesion of boro-phosphate-silicate glass (BPSG) and tetraethylorthosilicate (TEOS) low-k thin films to silicon subtrates. Nanoindation tests were also performed on the low-k films to evaluate material properties such as hardness and elastic modulus. The sample preparation and testing set up for the four point bend test and nanoscratch test were observed to be greatly disparate. Nanoscratch and nanoindentation sample preparation and sample testing were able to be carried out much quicker than in four point bending. It was observed that nanoscratch testing holds an immense potential for reducing the time needed to evaluate thin film adhesion then in FPB testing. Nanoindentation performed on the BPSG and TEOS dielectric thin films showed uniform mechinacal properties throughout the surface of the films. The adhesion energy for BPSG and TEOS using FPB testing ranged from 29.5390 J/m² - 3.0379 J/m². While the adhesion energy for BPSG and TEOS using nanoscratch testing ranged from 0.0012 J/m² - 0.0028 J/m². It was observed that the difference in adhesion energy for FPB and nanoscratch testing was due to differing failures modes.