Utilizing bulk micromachining technology, this thesis aimed to develop a flexural plate-wave(FPW) device with novel groove reflection microstructure for high-sensitivity and low insertion-loss biomedical microsystem applications. The influences of the amount and depth of the groove and the distance between the groove and the boundary of ZnO piezoelectric thin-film (DGB) on the reduction of insertion-loss and the enhancement of quality factor (Q) and electromechanical coupling coefficient (K2) were investigated. Three critical technology modules established in this thesis are including the development of (1) a sputtering deposition process of high C-axis (002) orientation ZnO piezoelectric thin-film, (2) an electrochemical etch-stop technique of silicon anisotropic etching and (3) an integration process of FPW device. Firstly, under the optimized conditions of the sputtering deposition process (300¢J substrate temperature, 200 W radio-frequency (RF) power and 30/70 Ar/O2 gas flow ratio), a high C-axis (002) orientated ZnO piezoelectric thin-film with a high X-ray diffraction (XRD) intensity (50,799 a.u.) and narrow full width at half maximum (FWHM = 0.383¢X) can be demonstrated. The peak of XRD intensity of the standard ZnO film occurs at diffraction angle 2£c = 34.422¢X, which matches well with our results (2£c = 34.357¢X). Secondary, an electrochemical etch-stop system with three electrode configuration has been established in this research and the etching accuracy can be controlled to less than 1%. Thirdly, this thesis has successfully integrated the main fabrication processes for developing the FPW device which are including six thin-film deposition processes and six photolithography processes. The implemented FPW device with RIE etched groove reflection microstructure presents a low insertion-loss of -12.646 dB, center frequency of 114.7 MHz, Q factor of 12.76 and K2 value of 0.1876%.

This thesis presents the development of electrochemical etch-stop techniques (ECES) to achieve high precision 3-dimensional integrated MEMS sensors with wet anisotropic etching by applying proper voltages to various regions in silicon. The anisotropic etchant is selected as tetra methyl ammonium hydroxide, TMAH, considering its high silicon etch rate, selectivity towards SiO2, and CMOS compatibility, especially during front-side etching of the chip/wafer. A number of parameters affecting the etching are investigated, including the effect of temperature, illumination, and concentration of the etchant over the etch rate of silicon, surface roughness, and biasing voltages. The biasing voltages for passivating the n-well and enhancing the etching reactions on p-substrate are determined as -0.5V and -1.6V, respectively, after a series of current-voltage characteristic experiments. The surface roughness due to TMAH etching is prevented with the addition of ammonium peroxodisulfate, AP. A proper etching process is achieved using a 10wt.% TMAH at 85&deg / C with 10gr/lt. AP. Different silicon etch samples are produced in METU-MET facilities to understand and optimize ECES parameters that can be used for CMOS microbolometers. The etch samples are fabricated using various processes, including thermal oxidation, boron and phosphorus diffusions, aluminum and silicon nitride layer deposition processes. Etching with the prepared samples shows the dependency of the depletion layer between p-substrate and n&amp / #8209 / well, explaining the reason of the previous failures during post-CMOS etching of CMOS microbolometers from the front side. Succesfully etched CMOS microbolometers are achieved with back side etching in 6M KOH at 90 &deg / C, where &amp / #8209 / 3.5V and 1.5V are applied to the p-substrate and n-well. In summary, this study provides an extensive understanding of the ECES process for successful implementations of integrated MEMS sensors.

<blockquote><div><div>Methods and techniques for tailoring the surface morphology of metallic surfaces are determined in part by the complex behavior of elemental interactions in conjunction with electrochemical reactions. In this work, we show how the surface morphology can be predicted based on experimental data resulting from polarization curves and compositional differences of Fe- and Ni-based superalloys. Electrochemical treatments utilizing NaCl as the electrolyte were adapted using parameters such as the pitting resistance equivalent (PRE) number and polarization curves to obtain both rough and smooth surfaces. Utilizing these metrics, we electrochemically etched Inconel 600, SS304, Inconel 718 and Inconel 625 obtaining average surface roughness values that ranged from 0.05 to 57.4 μm indicating the success of tailoring the technique to obtaining rough and smooth surfaces. The effect of current density, current pulsing, and temperature were varied to elucidate roughness and pitting behavior, and strong correlations to the PRE number and polarization curve properties of the alloy were observed. Heat treatments and subsequent evolution to the microstructure in the form of grain growth and precipitation altered the etching behavior. These techniques can be used in preventing corrosion failure and enhancing electrochemical machining</div></div></blockquote>