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Analysis of near fields and radiation of a printed circuit via holeWood, Matthew January 2008 (has links)
Electromagnetic compatibility remains an important topic in the design and manufacturing of printed circuit boards (PCBs). Compatibility of these devices with their surroundings is becoming increasingly difficult as a modern PCB can have hundreds or thousands of parts, operating on many layers, and all at high speed. One such part is a via and its clearance, or via hole, commonly required in multilayer circuits where vertical connections between layers are used. The via hole may be exposed to large electromagnetic fields within the PCB. Although electrically small, the via hole provides a pathway for the fields to excite the exterior, either directly or through coupling to adjacent structures. To quantify this process, the near fields and radiation of an excited via hole are analysed, and are the focus of this thesis. The near fields of the via hole are first decoupled into electric and magnetic fields of the 'static' type. In both cases a series solution for two regions, one outside, and one inside the layers is constructed. The coefficients of the terms of the series are chosen to best satisfy the boundary behaviour of the fields on the conducting surfaces and across the hole. The criteria for assessing quality of the solution is based on the least squares method (LSM). Linear equation systems for both models are derived, and as no numerical integration or discretisation is required, an efficient and robust implementation to find the near fields is developed. Transformation into the far field is then achieved through surface integration of relevant field quantities close to the via hole. The far fields are best viewed as that due to two dipoles, of the magnetic and electric type, with strength and orientation depending on how the via hole is excited. It is shown that the two dipole model is sufficient to find the radiation from a 1mm diameter via hole at a frequency up to 8 GHz. Of further interest is how the choice of via hole dimensions affects the dipole moments and the near fields solved earlier are a key to this understanding.
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A direct-conversion offset-cancellation mixer in 2.4 GHz CMOSLehne, Mark A. 16 May 2001 (has links)
We present a new circuit design for adaptive offset cancellation in a fully differential
2.4 GHz CMOS direct conversion mixer. Our circuit structure is a modification of a
Gilbert cell mixer in which offsets are cancelled by injecting cancellation currents
into the legs of the mixer by dynamically varying the bias on the active loads. We
present analysis and simulation results of our mixer with offsets present. Offsets
create non-linearities in any circuit by differentially shifting the small-signal bias
point of a matched pair; forcing once symmetrical transistors to operate in different
bias regions and create second order distortion. We focus our design to minimize
second order distortion while simultaneously canceling the large offsets found in
direct conversion receivers. Simulation results for the mixer canceling a wide range
of offsets are included. Our mixer has a gain of 6.4dB, an IIP3 of 17dBm and a noise
figure of 17dB as simulated in a .5��m HP Mosis CMOS process. / Graduation date: 2002
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Statistical design, analysis, and diagnosis of digital systems and embedded RF circuitsMatoglu, Erdem 11 1900 (has links)
No description available.
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Performance enhancement in column IV mobility, bandgap, and strain engineered MOSFETsOnsongo, David Masara, Banerjee, Sanjay, January 2003 (has links)
Thesis (Ph. D.)--University of Texas at Austin, 2003. / Supervisor: Sanjay K. Banerjee. Vita. Includes bibliographical references. Also available from UMI.
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Reducing power consumption during online and offline testingGhosh, Shalini 28 August 2008 (has links)
Not available / text
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EXTENSIONS OF AHPL AND OPTIMIZATION OF THE AHPL COMPILER FOR MSI/LSI DESIGNSwanson, Robert Earl, 1944- January 1978 (has links)
No description available.
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Performance enhancement in column IV mobility, bandgap, and strain engineered MOSFETsOnsongo, David Masara, 1972- 26 July 2011 (has links)
Not available / text
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Elektroninių schemų komponentų topologijos vaizdavimo trimačiuose paviršiuose algoritmų sudarymas, tyrimas ir taikymas / The development, analysis and implementation of algorithms for projection of electronic circuit components topology onto 3D surfacesLiutkus, Giedrius 22 July 2005 (has links)
Major goal of this work is to develop, test and deploy algorithms for projecting electronic components onto a mechanical 3D object.
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Printed circuit board (PCB) loss characterization up-to 20 GHz and modeling, analysis and validationRajagopal, Abhilash, January 2007 (has links) (PDF)
Thesis (M.S.)--University of Missouri--Rolla, 2007. / Vita. The entire thesis text is included in file. Title from title screen of thesis/dissertation PDF file (viewed November 26, 2007) Includes bibliographical references (p. 112-113).
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Design, construction and theory of a high-frequency aerial impedance measuring equipment.Crompton, James Woodhouse. January 1948 (has links) (PDF)
Thesis (in competition for the Angas Engineering Scholarship)--University of Adelaide, 1948. / Typewritten copy.
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