NDLTD Global ETD Search
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  • About
  • The Global ETD Search service is a free service for researchers to find electronic theses and dissertations. This service is provided by the Networked Digital Library of Theses and Dissertations.
    Our metadata is collected from universities around the world. If you manage a university/consortium/country archive and want to be added, details can be found on the NDLTD website.

Search results

Showing 11 to 20 of 208 (0.087 seconds)

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11

Modeling and process optimization of solder paste stencil printing for micro-BGA and fine pitch surface mount assembly /

Pan, Jianbiao, January 2000 (has links)
Thesis (Ph. D.)--Lehigh University, 2000. / Includes vita. Includes bibliographical references (leaves 101-106).
12

Electroplating bonding technology for chip interconnect, wafer level packaging and interconnect layer structures

Joung, Yeun-Ho, January 2003 (has links) (PDF)
Thesis (Ph. D.)--School of Electrical and Computer Engineering, Georgia Institute of Technology, 2004. Directed by Mark G. Allen. / Vita. Includes bibliographical references (leaves 271-284).
13

Development of a polymer-metal nanocomposite dielectric by in situ reduction for embedded capacitor application

Pothukuchi, Suresh V., January 2003 (has links) (PDF)
Thesis (M.S. in M.S.E.)--School of Materials Science and Engineering, Georgia Institute of Technology, 2004. Directed by C.P. Wong. / Includes bibliographical references (leaves 94-102).
14

MEMS packaging with stereolithography

Tse, Laam Angela 05 1900 (has links)
No description available.
Microelectromechanical systems
Electronic packaging
15

Palletization and design-of-simulations for large area processing and assembly in electronic packaging

Variyam, Manjula N. 08 1900 (has links)
No description available.
Electronic packaging
Microelectronic packaging
16

Thermo-mechanical behavior and reliability of High Density Interconnect (HDI) vias

Smith, Kyle Edward 08 1900 (has links)
No description available.
Electronic packaging Reliability
17

Study on thermally reworkable underfills for flip chip, BGA, and CSP applications

Wang, Lejun 05 1900 (has links)
No description available.
Integrated circuits
Electronic packaging
18

Study of high K polymers for integral capacitor applications

Yue, Jireh Jon-Kai 12 1900 (has links)
No description available.
Capacitors
Electronic packaging
19

No-flow underfill materials for environment sensitive flip-chip process

Zhang, Zhuqing 08 1900 (has links)
No description available.
20

Steam driven delamination in electronics packages /

Chong, Iok Tong. January 2002 (has links)
Thesis (M. Phil.)--Hong Kong University of Science and Technology, 2002. / Includes bibliographical references. Also available in electronic version. Access restricted to campus users.
Electronic packaging Laminated materials

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