No description available.

Thesis (M.S.)--State University of New York at Binghamton, Thomas J. Watson School of Engineering and Applied Science, Department of Mechanical Engineering, 2008. / Includes bibliographical references.

During their production and normal use, electronic packages experience large temperature excursions, leading to high thermo-mechanical stress gradients that cause fatigue failure of the solder joints. In order to prevent premature failure and prolong the fatigue life of solder joints, there is a pressing need for the characterization of the solder, especially lead-free solder, at the micro-level (joint size). The characterization and modeling of solder behavior at the appropriate scale is a major issue. However, direct measurement techniques are not applicable to characterize the deformation response of solder joints because of their micro scale dimensions. Therefore, a non-contact measurement technique utilizing a Scanning Electron Microscope (SEM) in conjunction with Digital Image Correlation (DIC) has been developed. Validation was achieved by performing a four-point bending test in both an in-house optical system with DIC and inside the SEM. This non-contact measurement technique was then used to extract the stress-strain response of the solder. Mechanical tests were performed on solder joints that were created using the same type of solder balls used in the electronic industry and were representative of normal joint scales. The SEM-DIC technique has been proven to be applicable for the determining the stress-strain response of solder material at the micro-scale.This study resulted in a validated material characterization technique specifically designed for micro-scale material response. One of the main contributions of this study is that the method is a lot simpler and cheaper, yet highly effective, compared to the previous methods. This technique is also readily applicable to the measurement of the stress-strain response of any micro-scale specimen, such as other metals, polymers, etc. Also, the measured displacement field by obtained by DIC can be used as the base for calculating the strain field on the surface of a specimen.

A project report submitted to the Faculty of Engineering, University of the Witwatersrand, Johannesburg, in partial fulfillment of the requirements for the degree of Master of Science in Engineering. / The viability of introducing a Surface Mount production line is chiefly determined by the reliability characteristics of the components being used. Surface Mount Technology (SMT) is entirely new and although related to traditional through-hole processes, requires different components, assembly techniques and design methods. The purpose of the literature survey is primarily to determine whether surface mount components meet today's industrial requirements with respect to their manufacturing reliability and availability. A brief review of the evolution of SMT is also presented. This study finds that the implementation of SMT should be given highest priority by manufacturing companies in order to maintain their share of the marketplace. Surface Mount Technology embodies a totally new automated circuit assembly process, using a new generation of electronic comporents: surface mounted devices (SMDs). Smaller than conventional components, SMDs are placed onto the surface of the substrate. From this, the fundamental difference between SMD assembly and convencional through-hole component assembly arises; SMD component positioning is relative, not absolute. When a through-hole component is inserted into a pcb, either the leads go through the hales or they don't. An SMD, however, is placed onto the substrate surface, it's position only relative to the solder lands, and placement accuracy is therefore influenced by variations in the substrate track pattern, component size, and placement machine accuracy. Other factors influence the layout of SMD substrates. For example, will the board be a mixed-print ( a combination of through-hole components and SMDs) or an all-SMD design? Will SMDs be placed on one side of the substrate or both? And there are process considerations like what type of machine will place the components and how will they be soldered? This project describes in detail the processes involved in setting up an SMT facility. A simulation program was developed to verify the viability of these processes. The simulation program was also applied to an existing SMT facility and together with developed optimization software, attempted to identify and resolve some of the major problems. All this was achieved, and the extent to which simulation could be used as an efficient production tool, was highlighted. / AC2017

Thesis (Ph.D.)--Hong Kong University of Science and Technology, 2007. / Includes bibliographical references (leaves 134-144). Also available in electronic version.

Thesis (Ph. D.)--OGI School of Science and Engineering at OHSU, 2001.

Thesis (M. Phil.)--Hong Kong University of Science and Technology, 2003. / Includes bibliographical references (leaves 129-132). Also available in electronic version. Access restricted to campus users.

Thesis (Ph. D.)--University of Texas at Austin, 2002. / Vita. Includes bibliographical references. Available also from UMI Company.

No description available.

No description available.