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The Global ETD Search service is a free service for researchers
to find electronic theses and dissertations. This service is
provided by the
Networked Digital Library of Theses and Dissertations.
Our metadata is collected from universities around the world. If you manage a university/consortium/country archive and want to be added, details can be found on the NDLTD website.
Search results
Showing 121 to 130 of 208 (0.061 seconds)Spelling suggestions: "subject:"6electronic packaging"" "subject:"ielectronic packaging""
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High temperature high power SiC devices packaging processes and materials developmentWang, Cai, Johnson, R. Wayne, January 2006 (has links) (PDF)
Dissertation (Ph.D.)--Auburn University, 2006. / Abstract. Vita. Includes bibliographic references (p.138-143).
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| 122 |
Development of convective reflow-projection moire warpage measurement system and prediction of solder bump reliability on board assemblies affected by warpageTan, Wei. January 2008 (has links)
Thesis (Ph. D.)--Mechanical Engineering, Georgia Institute of Technology, 2008. / Committee Chair: Dr. Ume, I. Charles; Committee Member: Dr. Book, Wayne; Committee Member: Dr. Kim, Yeong; Committee Member: Dr. Pan, Jiahui; Committee Member: Dr. Sitaraman, Suresh; Committee Member: Dr. Wu, C. F. Jeff.
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| 123 |
Prognostics health management and damage relationships of lead-free components in thermal cycling harsh environmentsMadhura Hande, Handattu, Lall, Pradeep, January 2008 (has links)
Thesis--Auburn University, 2008. / Abstract. Vita. Includes bibliographical references (leaves 159-167).
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| 124 |
Non-linear thermal modeling using neural networks /Das, Aditi. January 1900 (has links)
Thesis (M.App.Sc.) - Carleton University, 2006. / Includes bibliographical references (p. 167-170). Also available in electronic format on the Internet.
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| 125 |
Evaluation and improvement of the robustness of a PCB pad in a lead-free environmentLi, Jing. January 2007 (has links)
Thesis (M.S.)--State University of New York at Binghamton, Thomas J. Watson School of Engineering and Applied Science, Department of Systems Science and Industrial Engineering, 2007. / Includes bibliographical references.
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| 126 |
Investigations on damage mechanics and life prediction of fine-pitch electronics in harsh environmentsIslam, Mohd Nokibul, LAll, Pradeep. January 2005 (has links) (PDF)
Dissertation (Ph.D.)--Auburn University, 2005. / Abstract. Vita. Includes bibliographic references.
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| 127 |
Die stress characterization and interface delamination study in flip chip on laminate assembliesRahim, Md. Sayed Kaysar, Jaeger, Richard C. Suhling, J. C. January 2005 (has links) (PDF)
Dissertation (Ph.D.)--Auburn University, 2005. / Abstract. Vita. Includes bibliographic references.
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| 128 |
Thermal performance of ball grid arrays and thin interface materialsElkady, Yasser Ahmed, Suhling, J. C. Knight, Roy Ward. January 2005 (has links) (PDF)
Dissertation (Ph.D.)--Auburn University, 2005. / Abstract. Vita. Includes bibliographic references.
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| 129 |
Kinetic investigations of thermal degradation of poly(vinyl butyral) using TG/FT-IR /Liau, Leo Chau-Kuang, January 1997 (has links)
Thesis (Ph. D.)--University of Missouri-Columbia, 1997. / Typescript. Vita. Includes bibliographical references (leaves 117-124). Also available on the Internet.
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| 130 |
Kinetic investigations of thermal degradation of poly(vinyl butyral) using TG/FT-IRLiau, Leo Chau-Kuang, January 1997 (has links)
Thesis (Ph. D.)--University of Missouri-Columbia, 1997. / Typescript. Vita. Includes bibliographical references (leaves 117-124). Also available on the Internet.
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