Advancements in the semiconductor industry have lead to the miniaturization of components and increased power densities, resulting in thermal management issues. In response to this shift, finding multifunctional materials with excellent thermal conductivity and tailored electrical properties are becoming increasingly important. For this research thesis, three different studies were conducted to develop and characterize thermally conductive polymer composites. In the first study, a PPS matrix was combined with different types of carbon-based fillers to determine the effects of filler’s size, shape, and orientation on thermal conductivity. In the second study, effects of adding ceramic- and carbon- based fillers on the tailored thermal and electrical properties of composites were investigated. Lastly, the possibility of improving the thermal conductivity by introducing and aligning polymer fibers in the composites was investigated. The composites were characterized with respect to their physical, thermal, and electrical properties to propose possibilities of application in the electronic packaging industries.

Advancements in the semiconductor industry have lead to the miniaturization of components and increased power densities, resulting in thermal management issues. In response to this shift, finding multifunctional materials with excellent thermal conductivity and tailored electrical properties are becoming increasingly important. For this research thesis, three different studies were conducted to develop and characterize thermally conductive polymer composites. In the first study, a PPS matrix was combined with different types of carbon-based fillers to determine the effects of filler’s size, shape, and orientation on thermal conductivity. In the second study, effects of adding ceramic- and carbon- based fillers on the tailored thermal and electrical properties of composites were investigated. Lastly, the possibility of improving the thermal conductivity by introducing and aligning polymer fibers in the composites was investigated. The composites were characterized with respect to their physical, thermal, and electrical properties to propose possibilities of application in the electronic packaging industries.

Consumer demands are driving the current trend in the microelectronics industry to make electronic products that are miniature, fast, compact, high-density, reliable and low-cost. The use of surface mount devices (SMDs) has helped to decrease the size of electronic packages through the use of solder bump interconnections between the devices and the substrates/printed wiring boards (PWBs). Solder bumps act as not only mechanical, but also electrical interconnections between the device and the substrate/PWB. Common manufacturing defects ¨C such as open, cracked, missing, and misaligned solder bumps ¨C are difficult to detect because solder bumps are hidden between the device and the substrate/PWB after assembly. The reliability of packaged electronic devices in storage and usage is a major concern in the microelectronics industry. Therefore, quality inspection of solder bumps has become a critical process in the microelectronics industry to help ensure product quality and reliability. In this thesis, a methodology for quality evaluation and reliability study of solder bumps in electronic packages has been developed using the non-destructive and non-contact laser ultrasound-interferometric technique, finite element and statistical methods in this research work. This methodology includes the following aspects: 1) inspection pattern ¨C specific inspection patterns are created according to inspection purpose and package formats, 2) laser pulse energy density calibration ¨C specific laser pulse power and excitation laser spot size are selected in terms of package formats, 3) processing and analysis methods, including integrated analytical, finite element and experimental modal analyses approach, advanced signal processing methods and statistical analysis method, 4) approach combining modal analysis and advanced signal processing to improve measurement sensitivity of laser ultrasound-interferometric inspection technique, and 5) calibration curve using energy based simulation method and laser ultrasound inspection technique to predict thermomechanical reliability of solder bumps in electronic packages. Because of the successful completion of the research objectives, the system has been used to evaluate a broad range of solder bump defects in a variety of packaged electronic devices. The development of this system will help tremendously to improve the quality and reliability of electronic packages.

Thesis (Ph.D.)--Auburn University, 2007. / Abstract. Vita. Includes bibliographic references (ℓ. 175-)

Thesis (M.S.)--State University of New York at Binghamton, Thomas J. Watson School of Engineering and Applied Science, Department of Mechanical Engineering, 2008. / Includes bibliographical references.

Thesis (M. App. Sc.)--Carleton University, 2004. / Includes bibliographical references (p. 104-105). Also available in electronic format on the Internet.

Thesis (M.S.)--State University of New York at Binghamton, Thomas J. Watson School of Engineering and Applied Science, Department of Systems Science and Industrial Engineering, 2007. / Includes bibliographical references.

Thesis (M.S.)--State University of New York at Binghamton, Thomas J. Watson School of Engineering and Applied Science, Department of Mechanical Engineering, 2007. / Includes bibliographical references.

Thesis (M.S.)--Auburn University, 2008. / Abstract. Vita. Includes bibliographical references (p. 100-111).

Thesis (M.S.)--State University of New York at Binghamton, Department of Systems Science and Industrial Engineering, Thomas J. Watson School of Engineering and Applied Science, 2008. / Includes bibliographical references.