Spelling suggestions: "subject:"electronics manufacturing"" "subject:"delectronics manufacturing""
11 |
Analysis and Actions for Robust ElectronicsProduction at Haldex Brake Products LtdAndersson, Philip, Eklund, Tommy January 2008 (has links)
This master thesis report contains information about a project carried out at Haldex Brake Products that is situated in Redditch England. The Redditch site is part of the “Commercial Vehicle Systems” division within the Haldex group. Haldex Brake Products is designing and producing electronic anti lock brake systems. The latest product is called GEN2 and the project goal was to increase productivity and achieve more stability within the production processes of this product. The goal was achieved trough implementation suggestions affecting the three categories in overall equipment efficiency (OEE). Nine of the biggest implementations are presented in this report. Some of the suggestions are already implemented and some are under progress to be implemented. These implementations will result in an increase in productivity with additionally 953 products per week. The expected results are based on calculations on an average product. The report also contains suggestions for future actions to even more increase the efficiency of the production processes at Haldex Brake Products in Redditch.
|
12 |
Analysis and Actions for Robust ElectronicsProduction at Haldex Brake Products LtdAndersson, Philip, Eklund, Tommy January 2008 (has links)
<p>This master thesis report contains information about a project carried out at Haldex Brake Products that is situated in Redditch England. The Redditch site is part of the “Commercial Vehicle Systems” division within the Haldex group. Haldex Brake Products is designing and producing electronic anti lock brake systems. The latest product is called GEN2 and the project goal was to increase productivity and achieve more stability within the production processes of this product. The goal was achieved trough implementation suggestions affecting the three categories in overall equipment efficiency (OEE). Nine of the biggest implementations are presented in this report. Some of the suggestions are already implemented and some are under progress to be implemented. These implementations will result in an increase in productivity with additionally 953 products per week. The expected results are based on calculations on an average product. The report also contains suggestions for future actions to even more increase the efficiency of the production processes at Haldex Brake Products in Redditch.</p>
|
13 |
Quantitative assessment of long term aging effects on the mechanical properties of lead free solder jointsVenkatadri, Vikram. January 2009 (has links)
Thesis (M.S.)--State University of New York at Binghamton, Thomas J. Watson School of Engineering and Applied Science, Department of Systems Science and Industrial Engineering, 2009. / Includes bibliographical references.
|
14 |
Synthesis of tin, silver and their alloy nanoparticles for lead-free interconnect applicationsJiang, Hongjin. January 2008 (has links)
Thesis (Ph. D.)--Chemistry and Biochemistry, Georgia Institute of Technology, 2008. / Committee Chair: Dr. C. P. Wong; Committee Member: Dr. Boris Mizaikoff; Committee Member: Dr. Rigoberto Hernandez; Committee Member: Dr. Z. John Zhang; Committee Member: Dr. Z.L. Wang.
|
15 |
Investigation of the impact response of Pb-free electronic assemblies and comparison of drop with cyclic 4-point bend testMirza, Fahad. January 2007 (has links)
Thesis (M.S.)--State University of New York at Binghamton, Thomas J. Watson School of Engineering and Applied Science, Department of Mechanical Engineering, 2007. / Includes bibliographical references.
|
16 |
Initialization and progression of damage in lead free electronics under drop impactIyengar, Deepti Raju, Lall, Pradeep, January 2008 (has links) (PDF)
Thesis (M.S.)--Auburn University, 2008. / Abstract. Vita. Includes bibliographical references (p. 100-111).
|
17 |
Flip chip and heat spreader attachment developmentLi, Yuquan. Johnson, Robert Wayne, January 2009 (has links)
Thesis (Ph. D.)--Auburn University. / Abstract. Includes bibliographical references (p. 91-100).
|
18 |
Explicit finite element modeling in conjunction with digital image correlation based life prediction of lead-free electronics under shock-impactShantaram, Sandeep. Lall, Pradeep, January 2009 (has links)
Thesis--Auburn University, 2009. / Abstract. Includes bibliographical references (p. 111-121).
|
19 |
Reliability of lead-free and advanced interconnects in fine pitch and high I/O electronics subjected to harsh thermo-mechanical environmentsHinshaw, Robert Bruce. Lall, Pradeep, January 2009 (has links)
Thesis--Auburn University, 2009. / Abstract. Includes bibliographical references (p. 170-177).
|
20 |
Evaluation of the effects of processing conditions on shear strength in Pb-free surface mount assemblyBukhari, Sarfaraz. January 2004 (has links)
Thesis (M.S.)--State University of New York at Binghamton, Department of Systems Science and Industrial Engineering, 2004. / Includes bibliographical references.
|
Page generated in 0.1078 seconds