GaInAsP and GaInAs epitaxial layers grown on Fe-doped InP substrates of {100} orientation have been studied using cross-sectional and plan-view transmission electron microscopy. Studies of the epilayer surface regions of LPE Ga[0.03]In[0.97] As[0.07]P[0.93] heavily doped with Mn or Mn and Ge have revealed at least seven precipitate types when classification is made according to precipitate morphology, configurations and associated strain fields. The origin of some of these second phase particles is shown to be iron-phosphide precipitation resulting from iron diffusion from the substrate. Furthermore, in a LPE Ga[0.47]In[0.53]As layer co-doped with Mn and Ge four distinct precipitate types were observed. Speckle and long wavelength microstructures in GalnAs grown by LPE, MOCVD and MBE have been studied. A long wavelength microstructure lying along directions which is observed in some MBE GalnAs layers is associated with reduced electron mobilities. In MOCVD GalnAs a long wavelength microstructure lying along directions was seen to vary as a function of distance from the interface. The presence and wavelength of the speckle contrast is shown to be independent of the growth technique employed. Some MBE GalnAs layers also reveal an island contrast along orthogonal directions. Undoped MOCVD GalnAs epilayers with large compositional fluctuations approximately half way through the thickness of the epilayer or small compositional fluctuations near the epilayer surface have been studied. These perturbations in composition are associated with a dislocation cell structure and a cross-hatch of dislocations along directions respectively. A variety of defects have been identified and the microstructure correlated with Sputter Auger profiles and depth-resolved Hall profiles. Cliff-Lorimer k-factors have been determined experimentally and theoretically for Ga, As and P relative to In and extinction distances for GalnAs and InP calculated.

L'illumination par la face arrière amincie des imageurs CMOS est une des voies étudiées pour accroître le rapport signal à bruit et ainsi la sensibilité de ce capteur. Or cette configuration est adaptée à la détection des électrons dans la gamme d'énergie [[1 ; 12 keV]. L'électron incident crée, par multiplication, plusieurs centaines d'électrons secondaires, proche de la surface. Une couche de passivation par surdopage P++ de la face arrière est nécessaire afin de réduire le nombre de recombinaisons de surface des électrons. Par effet de champ électrique, la couche de passivation augmente le nombre de charges collectées, et ainsi le gain de collection du capteur. L'objectif de cette thèse est de développer des moyens de caractérisation pour déterminer in situ les performances sur le gain de collection de six procédés de passivation. Préalablement, le profil de dépôt d'énergie de l'électron incident est étudié au moyen d'une simulation Monte-Carlo puis d'un modèle analytique. Un modèle associé du gain de collection indique qu'à forte énergie, l'effet miroir de la passivation est déterminant tandis qu'à faible énergie, l'épaisseur de la passivation est un facteur clef. Une première expérience d'irradiation de diodes étendues P++=N permet de dégager l'influence du procédé de passivation sur les recombinaisons de surface. Grâce à une seconde caractérisation de type < événement unique >, directement sur capteur CMOS aminci, les passivations sont discriminées quant à leur effet miroir et l'étalement de la charge qu'elles induisent. Le recuit laser d'activation des dopants peut s'avérer une source d'inhomogénéités du gain sur la surface de la matrice / Backside illuminated thinned CMOS imaging system is a technology developed to increase the signal to noise ratio and the sensibility of such sensors. This configuration is adapted to the electrons detection from the energy range of [1 - 12 keV]. The impinging electron creates by multiplication several hundreds of secondary electrons close to the surface. A P++ highly-doped passivation layer of the rear face is required to reduce the secondary electron surface recombination rate. Thanks to the potential barrier induced by the P++ layer, the passivation layer increases the collected charges number and so the sensor collection gain. The goal of this study is to develop some experimental methods in order to determine the effect of six different passivation processes on the collection gain. Beforehand, the energy profile deposited by an incident electron is studied with the combination of Monte-Carlo simulations and some analytical calculations. The final collection gain model shows that the mirror effect from the passivation layer is a key factor at high energies whereas the passivation layer has to be as thin as possible at low energies. A first experimental setup which consists in irradiating P++=N large diodes allows to study the passivation process impacts on the surface recombinations. Thanks to a second setup based on a single event upset directly on thinned CMOS sensor, passivation techniques are discriminated in term of mirror effect and the implied spreading charges. The doping atoms activation laser annealing is turn out to be a multiplication gain inhomogeneity source impacting directly the matrix uniformity

Dans l'objectif de développer des nouveaux capteurs d'image 3D pour des applications émergeantes, nous avons étudié un pixel de mesure de distance de type « temps de vol ». Nous avons proposé une nouvelle architecture de pixel basée sur la méthode « Continuous-Wave modulation » à trois échantillons par pixel. Cette méthode repose sur la mesure d'un déphasage entre la source lumineuse modulée en amplitude envoyée (source proche infrarouge) et le signal réfléchi par la scène à capturer. Le pixel de dimensions 6,2μm x 6,2μm intègre une photodiode pincée, trois chemins de transfert de charges pour l'échantillonnage successif du signal modulé reçu, et d'un quatrième chemin pour évacuer les charges excédentaires. Les différents chemins de transfert sont constitués d'une grille de transfert de charges de la photodiode vers une mémoire de stockage à canal enterré pour améliorer le rendement et la vitesse de transfert de charges; d'une mémoire à stockage en volume à base de tranchées capacitives profondes afin d'augmenter la dynamique; d'un substrat dont l'épaisseur et le profil de dopage ont été optimisés afin de collecter efficacement les charges photogénérées et ainsi augmenter les performances de démodulation. Un véhicule de test constitué d'une matrice de résolution de 464x197 pixels (QVGA) a été fabriqué, différentes variantes de pixels et différents essais technologiques ont été étudiées et analysées. La fonctionnalité du pixel a été vérifiée pour des fréquences de démodulation de 20MHz à 165MHz, utilisant une source laser de longueur d'onde 850nm ou 950nm. Une première image de profondeur acquise utilisant une matrice de test est une validation du pixel proposé / In order to develop new 3D image sensors for emerging applications, we studied “time of flight” pixel for distance measurement. We have proposed a new pixel architecture based on the "Continuous-Wave Modulation" method with three samples per pixel. This method is based on the measurement of a phase shift between the transmitted amplitude modulated light source (near-infrared source) and the signal reflected by the scene to be captured. The pixel of dimensions 6.2 μm x 6.2 μm integrates a pinned photodiode, three charge transfer paths for successive sampling of the received modulated signal, and a fourth path for anti-blooming purpose. The different paths are controlled by a buried-channel transfer gate for charges transfer from the photodiode to memory in order to improve the efficiency and speed of the charge transfer; A fully depleted memory based on capacitive deep trenches is used to increase the memory storage capacitance; thickness and doping profile of the substrate have been optimized to efficiently collect photogenerated and increase demodulation performance. The designed 464x197-pixel (QVGA) test chip has been fabricated, different pixel variants and different technology trials have been studied and analyzed. Pixel functionality has been verified for demodulation frequencies from 20 to 165MHz, using a laser source of wavelength 850nm or 950nm. A first acquired depth image using the test chip made is a validation of the proposed pixel

Designs for deep ultraviolet (DUV) edge emitting laser diodes (LDs) based on the wurtzite III-nitride (III-N) material system are presented. A combination of proprietary and commercial advanced semiconductor LD simulation software is used to study the operation of III-N based DUV LDs theoretically. Critical factors limiting device performance are identified based on an extensive literature survey. A comprehensive design parameter space is investigated thoroughly with the help of advanced scripting capabilities. Several design strategies are proposed to eliminate the critical problems completely or partially. A DUV LD design is proposed based exclusively on AlInN active layers grown epitaxially on bulk AlN substrates because AlInN offers a promising alternative to AlGaN for the realization of LDs and LEDs operating in the DUV regime. The proposed AlInN-based design also features a tapered electron blocking layer (EBL) instead of a homogeneous one. Tapered EBLs redistribute the interfacial polarization charge volumetrically throughout the entire EBL thickness via compositional grading, and eliminate the parasitic inversion layer charge. AlGaN based DUV LD designs are explored also because at present, it may be difficult to grow AlInN epitaxially with superior crystalline quality. Polarization charge matching is proposed to improve electron and hole wavefunction overlap within the active region. Although the strategy of polarization charge matching has already been proposed in the literature to enhance performance of visible wavelength LEDs and LDs, the proposed design presents the first demonstration that polarization charge matching is also feasible for DUV LDs operating at sub-300 nm wavelengths. A lateral current injection (LCI) LD design is proposed featuring polarization-charge-matched barriers and regrown Ohmic contacts to avoid a group of issues related to the highly inefficient p-type doping of wide bandgap III-N materials in vertical injection designs. The proposed design partially decouples the problem of electrical injection from that of optical confinement. Although the idea of an LCI LD design has been proposed in the literature in the 90s to be used as longer wavelength active sources in optoelectronic integrated circuits using GaInAsP/InP and related material systems, the proposed design is the first theoretical demonstration that this concept can be applied to DUV LDs based on III-N material system. To solve the problem of hole transport in vertical injection designs, a DUV LD design based exclusively on AlGaN material system is presented, featuring an inverse-tapered p-waveguide layer instead of an EBL. Several EBL designs are investigated, and compared with conventionally-tapered EBL design. Through judicious volumetric redistribution of fixed negative polarization charge, inverse tapering may be exploited to achieve nearly flat valence band profiles free from barriers to hole injection into the active region, in contrast to conventional designs. Numerical simulations demonstrate that the inverse tapered strategy is a viable solution for efficient hole injection in vertical injection DUV LDs operating at shorter wavelengths (< 290 nm).