The ever-increasing popularity and usage of communication devices has resulted in power density becoming more demanding due to crowding of frequency spectrums and narrowing of bandwidths. Consequently, the power-handling capability of filters has emerged as an important research area. With the size and mass of filters shrinking to accommodate the needs of the latest technology, designing narrowband filters necessitates the operation of filters close to their maximum power capacities. Hence, there is an urgent need to properly measure and estimate power-handling capability in filter-based products such as satellite multiplexers and wireless diplexers. In this research, the design of filters and diplexers capable of handling higher power was investigated using modifications of available methods to predict the maximum input power that a filter can handle before breakdown. This method was utilized to improve the power-handling capability and quality factor of the conventional coaxial resonator while avoiding time-consuming EM simulations. A novel coaxial resonator configuration was proposed using this method and the performance of suggested configuration was validated by designing 2-pole filters using both conventional and novel configurations. A 4-pole chebyshev filter was also designed and realized using the proposed configuration, and a power-handling analysis utilizing HFSS was compared with that of the estimated value. A novel approach in the design procedure of coaxial diplexers was proposed that provided a faster design method using step-by-step group delay matching of EM simulation results with a diplexer equivalent circuit. A method for predicting air breakdown was also applied to the diplexers to determine maximum power-handling capability.

High thermal stability and humidity resistance of phosphor-converted white-light-emitting diodes (PC-WLEDs) using Ce:YAG doped glass, instead of conventional Ce:YAG doped silicone, as a phosphor-converted layer is proposed and fabricated. The glass has five times higher glass transition temperature (Tg) of 750¢J compare with silicone of 150¢J, that could exhibited better performance than silicone, including lumen loss, chromaticity shift, transmittance loss, and peak emission intensity undergoing three industry-standard reliability tests at either high (8wt%) or low (2wt%) doping concentrations of Ce:YAG. The proposed glass phosphor possesses host stability as glass and retains desired fluorescence as Ce:YAG. In thermal aging, thermal shock, and damp heat reliability results, the thermal aging has the largest degradation of lumen loss, but the results showed better thermal stability that the glass phosphor with 22~30% lumen loss improvement for 2~8 wt% Ce:YAG doping than silicone phosphor. The damp heat test has the largest degradation of chromaticity shift, but the results showed excellent humidity resistance that the glass phosphor with highest 49~65% chromaticity shift improvement for 2~8 wt% Ce:YAG doping than silicone phosphor. But under thermal shock test, there isn¡¦t a large difference between glass and silicone phosphor. In this study, we demonstrate the feasibility of adapting glass as a phosphor-converted layer in PC-WLED module that can potentially provide higher reliability and better performance for high-power LEDs, particularly in the area where strict reliability is highly required and in the environment where silicone does not stand for long.

A study of double-variable-curvature microlenses (DVCM) for promoting coupling efficiency between the high-power 980-nm laser diodes and the single-mode fibers has been proposed. The purpose of the fiber microlens fabrication was to make the mode field match between the laser beam and the fiber as the beam propagating through the fiber microlens. To make the mode match, the shapes of the fiber microlens demanded nothing else but the offset and the curvature radii in minor and major axes. The double-variable-curvature fiber endface (DVCFE) was manufactured through a single-step fully automation grinding process and had less average offset of 0.3£gm, consequently. The radii of curvature in minor and major axis were controlled as an average of 1.2£gm and 33.6£gm, respectively. In the fusing procedure, the slight arc fusion was mainly applied for fine polishing merely instead of reshaping for the reason that the fabricated DVCFE was very close to the ideal shape. Hence, the fabrication time was reduced and the yield was promoted due to the withdrawn step of tip elimination. Furthermore, while the fusion parameters were set to be: fusing distance: 10£gm, arc intensity: 3bits, and fusing time: 200ms in the slight fusion process, the offset was reduced to 0.2£gm due to the shape constraint and surface tension of the DVCFE. And the radii of curvature increased 1.7£gm to 2.9£gm in the minor axis and increased 4.5£gm to 38.1£gm in the major axis, respectively. Owing to the controls of the fully automated grinding procedure and the omission of the tip elimination, the coupling efficiency and yield were improved. As a result, in the experiment, the average and maximum coupling efficiency of 83% and 88% were demonstrated, respectively. And the coupling efficiencies of the 20 samples were higher than 80%. In other words, the proposed DVCM structure of this study was a high coupling efficiency, a high yield output, and reproducible and fully automated single-step grinding process.

In last decade, white light emitting diodes(LEDs) have become used widely from traditional indicator to general illumination. The increase of its power is the key improving issue. The current light efficiency of white LED about 30%. In other words ,more than 70% of the input electrical energy will be generated in the form of heat. So, how to get rid of the heat damage in high power LED is a severe problem. The finite element analysis is employed to simulate high power white LEDs temperature distribution and thermal stress distributions caused by the dissipated heat. The effects of package parameters, i.e. die attach, solder material, solder thickness, and chip substrate, on the temperature and thermal stress distributions on high power LED packages are simulated and studied in this thesis. A comparison between the 40mil single chip package and the chip on board(CoB) package has also been executed in this study. Simulated results indicate that the highest power of a single 40mil chip package is 7watt. The thermal stress distribution , i.e. the peak value of local thermal stress is over its yield strength, is occurred as the power up to 7watt. Numerical results also reveal that the appropriate fin design can improve the heat dissipation significantly in high power LED package.

Due to the improvement of luminous efficiency, LED has been applied in general lighting nowadays. However, the efficacy and life of high power LED lamps are degraded for the problem of overheat temperature of the chips. In accordance with the above reason, the thermal management has been important in LED application. The thesis aims to analyze the thermal problem of high power LED lamp by FEM. In the beginning, we analyzed the temperature curves and thermal stress curves of chips by changing the thickness of AuSn solder in 4 structures. According to the results, the better thickness range and structures were chosen. In the second step, the effect of different sizes of a vapor chamber on the different thermal conductivities of lamp system was discussed. Finally, we orthogonalized all the designed parameters by Taguchi orthogonal array method, and then found the optimal design by comparing the results with the initial analyses. In this study, we proposed a solution to improve the quality characteristics of LED lamp by Taguchi method. So the effect of each control factors on the performance was able to be determined. For different features of demand, the present study is helpful to achieve the ideal design in manufacturing. Key words: FEM, high power LED lamps, Taguchi orthogonal array method

The width of an ultra high-power laser diode is greater than 50 £gm and more than 20 times of low-power laser diode.The core diameter of Erbium Doped Fiber Amplifier fiber (EDFA) is 4~6 £gm and it is a single-mode fiber (SMF).However¡Athe ultra high-power laser diode is multi-mode laser. Therefore¡Athe mismatch between high-power laser and SMF resulting in low coupling efficiency. We improve coupling efficiency by using a wedge-shaped graded-index fiber (GIF) tip spliced to a SMF then fused a fiber bragg grating (FBG) to form an external cavity laser. The GIF is a focusing action like a graded-index fiber. From near-field pattern (NFP)¡Awe find the best GIF length is 400 £gm. The coupling efficiency between ultra high-power laser diode and wedge-shape lensed fiber is only 5% .

Two new schemes of fiber microlenses for coupling between the high-power 980nm laser diodes and single-mode fibers (SMFs) are proposed. The quadrangular-pyramid-shaped fiber microlens (QPSFM) is fabricated by grinding a quadrangular-pyramid-shaped endface and then through heating in a fusing splicer to form an elliptical microlens endface. In comparison to the traditional wedge-shaped fiber microlens, the QPSFM structure can control two axial curvatures to form an elliptical microlens endface, and then control the aspect ratio of fiber far-field pattern to match the elliptical mode fields of lasers. The coupling efficiency of 83% for the QPSFM has been demonstrated. Another scheme of fiber microlens is the conical-wedge-shaped fiber microlens (CWSFM). The CWSFM is fabricated by grinding a conical-shaped fiber endface, then grinding a pair of wedge planes on the conical-shaped fiber endface, and finally through heating in a fusing splicer to form a good elliptical microlens endface. The coupling efficiency of 84% for CWSFM has been demonstrated. The fabrication of QPSFM requires five-step grinding processes. The range of grinding offset is 0.5~3.0£gm, and the average of grinding offset is 1.5£gm. The fabrication yield of QPSFM is low due to the large grinding offset. The fabrication of CWSFM requires only three-step grinding processes. The range of grinding offset is 0.3~1.5£gm, the average of grinding offset is 0.8£gm. The fabrication yield of CWSFM is high due to the small grinding offset. The fabrication yield is about 60% for 70% coupling efficiency; whereas the fabrication yield becomes 96% for 60% coupling efficiency. The laser-to-SMFs coupling of the fiber microlens was modeled based on the diffraction theory. The coupling efficiency, the tolerance of alignment, and the tolerance of fiber microlens offset were calculated according to this model. There is a good agreement between the simulation and the experiment values. In this study, two new scheme of fiber microlenses of the QPSFM and CWSFM with high coupling efficiency have been demonstrated. The CWSFM structure has the benefits of simple process and high yield that is suitable for use in commercial high power laser module.

In this thesis, a high voltage discharging testing circuit is proposed for cold cathode fluorescent lamps(CCFLs). The testing circuit uses only a single active power switch operating at a high frequency incorporating with reactive components to accumulate a relatively high voltage on the capacitor. This voltage is then stepped up by a transformer to provide the required high voltage for discharging the CCFLs. The circuit has the advantages of simple configuration, less component count, and low cost. In addition, a high power factor at the ac line source can be achieved. The proposed circuit is analyzed based on the mode operation. Accordingly, the design equations are derived to determine the circuit parameters. A prototype is designed and built for testing the 19 inch CCFLs. The discharging tests are made to recognize the malfunctions during the manufacturing process. Moreover, the distributions on the spectral power and chromaticity of lamps can be examined to ensure the product quality.

This thesis presents a single-stage high-power-factor electronic ballast for metal halide lamps. The proposed ballast integrates a buck-boost converter, a buck converter and a full-bridge inverter into a single power conversion circuit. The buck-boost converter is designed to be operated at the discontinuous conduction mode (DCM) with a constant duty ratio at a fixed switching frequency to provide a constant lamp power and to achieve a high power factor for a given ac input voltage. The full-bridge inverter supplies a square-wave current for the lamp at a low frequency the same as the line frequency to avoid acoustic resonance. For the universal input voltage ranged from 90 V to 264 V, the lamp remains at the rated power by controlling the duty-ratio of the buck converter. The circuit operation is analyzed in detail to derive the design equations. An electronic ballast for 70 W lamps is designed and tested. Computer simulations and experimental measurements are provided to verify that the proposed ballast has the merits of a nearly unity input power factor, a high efficiency greater than 82 % and can drive the lamp at a constant power.

Permanent magnet machines have become an attractive topology for several applications due to their high power density and brushless qualities as compared to conventional wound field machines or squirrel cage machines. The presences of permanent magnets provide distinct advantages, but at the same time unique behaviors that must be accounted for. Recent work has developed permanent magnet machines for high-power and high-speed applications such as may be found in the petro-chemical industry, naval ships, and energy storage systems. / text