This study experimentally investigated the effect of hydrophobic and hydrophilic surfaces characteristics on nucleate boiling heat transfer performance for the application of direct immersion cooling of electronics. A dielectric liquid, HFE – 7100 was used as the working fluid in the saturated boiling tests. Twelve types of 1-cm2 copper heater samples, simulating high heat flux components, featured reference smooth copper surface, fully and patterned hydrophobic surface and fully and patterned hydrophilic surfaces. Hydrophobic samples were prepared by applying a thin Teflon coating following photolithography techniques, while the hydrophilic TiO2 thin films were made through a two step approach involving layer by layer self assembly and liquid phase deposition processes. Patterned surfaces had circular dots with sizes between 40 – 250 μm. Based on additional data, both hydrophobic and hydrophilic surfaces improved nucleate boiling performance that is evaluated in terms of boiling incipience, heat transfer coefficient and critical heat flux (CHF) level. The best results, considering the smooth copper surface as the reference, were achieved by the surfaces that have a mixture of hydrophobic/hydrophilic coatings, providing: (a) early transition to boiling regime and with eliminated temperature overshoot phenomena at boiling incipience, (b) up to 58.5% higher heat transfer coefficients, and (c) up to 47.4% higher CHF levels. The studied enhanced surfaces therefore demonstrated a practical surface modification method for heat transfer enhancement in immersion cooling applications.

This study aimed to investigate performance of ARM-based computer clusters using two-phase immersion cooling approach, and demonstrate its potential benefits over the air-based natural and forced convection approaches. ARM-based clusters were created using Raspberry Pi model 2 and 3, a commodity-level, single-board computer. Immersion cooling mode utilized two types of dielectric liquids, HFE-7000 and HFE-7100. Experiments involved running benchmarking tests Sysbench high performance linpack (HPL), and the combination of both in order to quantify the key parameters of device junction temperature, frequency, execution time, computing performance, and energy consumption. Results indicated that the device core temperature has direct effects on the computing performance and energy consumption. In the reference, natural convection cooling mode, as the temperature raised, the cluster started to decease its operating frequency to save the internal cores from damage. This resulted in decline of computing performance and increase of execution time, further leading to increase of energy consumption. In more extreme cases, performance of the cluster dropped by 4X, while the energy consumption increased by 220%. This study therefore demonstrated that two-phase immersion cooling method with its near-isothermal, high heat transfer capability would enable fast, energy efficient, and reliable operation, particularly benefiting high performance computing applications where conventional air-based cooling methods would fail.