Spelling suggestions: "subject:"entegrated circuits -- design"" "subject:"entegrated circuits -- 1design""
1 |
PHYSICS AND DEVICE DESIGN OF VACUUM INTEGRATED CIRCUITS (CATHODES).HONG, LAZARO MANUEL. January 1987 (has links)
A general schematic method is developed for modeling the fundamental parameters of vacuum integrated circuits (VIC's), a new class of microelectronics devices. A summary of the history of thermionic integrated circuits (TIC's) is presented, along with a discussion of the heater and its effect on device performance. The effects of the base metal on the emission properties of cathodes which are a mixture of the emission carbonates and negative photo-resist are also considered. The amplification factor is determined by using either a first or second order model depending on the desired degree of accuracy. The transconductance and anode resistance may be calculated as well by using the perveance model of cathode current. The voltage scaling factor used in the design of small voltage operating devices is applied to the analysis of planar devices. Electrostatic interactions between devices are important in the design of vacuum integrated circuits. The percent interaction function is used to quantify the effects of DC and small signal electrostatic interactions. The effect of work function differences on the DC biasing of circuits is also considered. The pseudo-radial electrostatic (PREF) lens is used to direct the electrons in a quasi-circular orbit from cathode to anode. The PREF lens is utilized in designing a series of planar devices including current source, triode (diode), enhancement-mode and depletion-mode type devices. The theory and experimentally determined characteristics of these devices are presented in detail.
|
2 |
TRENCH ETCHING IN SILICON WITH A CONTROLLABLE SIDEWALL ANGLE (TEMPERATURE)Smadi, Mithkal Moh'd, 1960- January 1986 (has links)
No description available.
|
3 |
On logic optimization for timing-speculated circuit.January 2012 (has links)
隨著工藝尺寸的縮小,集成電路的時序行為變得越來越難以預測,某原因在於各種偏差效應,比如製造偏差、供電電壓波動以及溫度變化。對於傳統的“確保正確“的設計方式,我們需要留出很大的餘量,這就減少了工藝進步帶來的好處。時序監測C Timing Speculation) 因為具有錯誤檢測和更正機制而成為一種很有前景的解決辦法。採用這種方式,電路可以工作在有不太頻繁時序錯誤的情況下。而對於這種時序監視的設計方式,現有的優化方法大多主要是在電路結構確定之後的一些小的改動。因為這些方法無法對電路結構進行改變,所以它們的效果很有限。因此,我們在這篇論文里提出了在電路綜合(synthesis)過程中的一些優化方法,這些方法是能夠改變電路結構的。我們提出的優化方法主要集中在優化電路的硬件開銷和電路性能的方面。我們提出的方法主要包括兩個設計階段。 / 第一個階段是在邏輯綜合(Logic synthesis) 的時候.在邏輯綜合的時候,我們有很大的自由度去根據時序監測的特性來改變電路的結構。如果結合了特殊的實現方法,電路出現時序錯誤的頻率就會得到降低,從而提高了電路的性能。 / 第二個階段是在邏輯綜合之後的后綜合(Post-synthesis) 階段。為了減少時序監測的硬件上的開銷,我們提出了基於retiming 手法的再綜合(resynthesis) 方法.這種方法可以減少可疑寄存器(suspicious FF) 的數量從而降低硬件開銷。另外這種辦法也可以提高電路的吞吐量(throughput) 。為了進一步對電路進行優化,我們挨著又提出了基於rewiring 手法的電路吞吐量優化方法。此外,利用這種方法我們還可以消除部份電路里的短通路(short path) 從而進一步減少電路的硬件開銷。在這個階段,我們仍然具有改變電路結構的靈活性,因此我們的方法具有很好的效果。 / With technology scaling, the timing behavior of integrated circuits (ICs) becomes more unpredictable due to various variation effects, such as manufacturing variability, voltage fluctuations and temperature changes. A large design guard band is therefore reserved to ensure “always correct“ operation for traditional designs, disminishing the benefits of technology scaling. Timing speculation with error detection and correction mechanisms is a promising solution to tackle the above problem. With this technique, circuit can work under infrequent timing errors. The existing optimization techniques for timing speculated circuits are mainly based on some small modifications after the circuit structure is determined. Without the ability to change circuit structure, the efficiency is limited. Therefore, in this thesis we propose optimization techniques during the process of synthesis so that the flexibility is provided to make circuit structural change. Our optimization fo¬cuses on hardware cost and circuit performance and the proposed techniques are included in two design steps. / First step is logic synthesis. During the process of logic synthesis, there is large flexibility to change the circuit structure by considering the features of timing speculation. With intentional strategy the timing error probability can be reduced so as to improve the circuit throughput. / Second step is post-synthesis techniques after logic synthesis. To reduce the hardware cost for timing speculation, we propose a re-synthesis method based on the idea of retiming to reduce the number of suspicious FFs where timing errors mainly happen. This technique can also help to improve the circuit throughput if carefully implemented. To further improve the throughput, we also propose to use rewiring technique which is also called redundancy addition and removal (RAR) to optimize circuit for throughput. Furthermore, this technique can also be used to break down short paths so as to save the hardware cost. During this step, flexibility is also provided to make circuit structural change so that the efficiency is guaranteed. / Detailed summary in vernacular field only. / Detailed summary in vernacular field only. / Detailed summary in vernacular field only. / Liu, Yuxi. / Thesis (M.Phil.)--Chinese University of Hong Kong, 2012. / Includes bibliographical references (leaves 70-76). / Abstracts also in Chinese. / Abstract --- p.i / Acknowledgement --- p.iv / Chapter 1 --- Introduction --- p.1 / Chapter 1.1 --- Timing Speculation --- p.1 / Chapter 1.1.1 --- Circuit Timing Problem --- p.1 / Chapter 1.1.2 --- Possible Solution --- p.3 / Chapter 1.1.3 --- Timing Speculation is Promising --- p.4 / Chapter 1.1.4 --- Razor Flip-flop --- p.5 / Chapter 1.2 --- Problems for Timing Speculation --- p.6 / Chapter 1.2.1 --- Hardware Cost of Timing Speculation --- p.7 / Chapter 1.2.2 --- Performance of Timing Speculation --- p.8 / Chapter 1.3 --- Thesis Motivation and Organization --- p.9 / Chapter 1.4 --- Thesis Contributions --- p.11 / Chapter 2 --- Logic Synthesis for Timing Speculation --- p.13 / Chapter 2.1 --- Introduction --- p.13 / Chapter 2.2 --- Preliminaries --- p.14 / Chapter 2.2.1 --- Timing Speculation --- p.14 / Chapter 2.2.2 --- AIG-Based Logic Synthesis --- p.15 / Chapter 2.3 --- Logic Synthesis for Timing Speculation --- p.16 / Chapter 2.3.1 --- Proposed Optimization Metric --- p.17 / Chapter 2.3.2 --- Proposed Logic Synthesis Solution --- p.19 / Chapter 2.4 --- Experimental Results --- p.24 / Chapter 2.4.1 --- Experimental Setup --- p.24 / Chapter 2.4.2 --- Results and Discussion --- p.25 / Chapter 2.5 --- Conclusion --- p.30 / Chapter 3 --- Post-Synthesis Optimization for Timing Speculation --- p.31 / Chapter 3.1 --- Optimization for Timing Speculation by Retiming --- p.32 / Chapter 3.1.1 --- Introduction --- p.32 / Chapter 3.1.2 --- Preliminaries and Motivation --- p.33 / Chapter 3.1.3 --- Reducing Suspicious FFs by Retiming --- p.35 / Chapter 3.1.4 --- Reducing Timing Error Probability by Retiming --- p.41 / Chapter 3.1.5 --- Padding Short Paths --- p.43 / Chapter 3.2 --- Optimization for Timing Speculation by Rewiring --- p.47 / Chapter 3.2.1 --- Introduction --- p.47 / Chapter 3.2.2 --- Preliminaries --- p.48 / Chapter 3.2.3 --- Timing Optimization by Rewiring --- p.52 / Chapter 3.2.4 --- Reduce Hardware Cost by Rewiring --- p.60 / Chapter 3.3 --- Experimental Results --- p.62 / Chapter 3.4 --- Conclusion --- p.66 / Chapter 4 --- Conclusion --- p.68 / Bibliography --- p.76
|
4 |
Design and optimization for timing-speculative circuits.January 2014 (has links)
隨著半導體工藝技術的不斷進步 (technology scaling) ,更多的設計資源不得不用於確保集成電路的時序正確性。這種“面向最壞情況(worstcase-oriented) 的芯片設計方法導致了悲觀保守的芯片設計方案,增加了性能及功耗開銷,減少了工藝進步帶來的效益。 / “優於最壞情況(better-than-worst-case) 的芯片設計方法允許犧牲一定的芯片可靠性 (reliability) 來提高性能以及降低功耗,從而提高計算的能量效率 (energy efficiency) 。“優於最壞情況設計方法的核心思想在於放松對芯片可靠性的硬性需求。既然時序錯誤 (timing error) 在關鍵路徑中的發生頻率並不高,我們可以允許錯誤發生,從而節約用於防止錯誤發生所需要的高額開銷。而當錯誤發生時,再利用錯誤檢測和更正方法(error detection and correction) 來消除錯誤造成的影響。這種無須保證計算過程永遠正確無誤的方法通常被稱作“ 時序推測 (timing speculation) 。然而,不幸的是,由於傳統的“面向最壞情況的設計方法往往導致芯片中存在所謂的“關鍵路徑壁壘(wall of critical paths) ,時序推測技術的有效性在一定程度上受限。 / 為了解決上述問題,我們首先研究了時序推測技術的前提與前景,也就是研究了如何估計時序推測技術能夠帶來的最小和最大效益。此外,我們也研究了時序推測芯片 (timing-speculative circuit) 中的若幹設計優化問題。首先,由於引入時序推測技術能夠提高多電壓 (multi-supply voltage)技術的靈活性,我們闡述了時序推測芯片中的多電壓設計問題,並創造性地提出了一種基於動態規劃 (dynamic programming) 的算法來解決這個問題。此外,我們提出了時序推測芯片中的時鐘差異規劃 (clock skew scheduling) 問題。在考慮了時序錯誤率 (timing error rate) 等因素的影響後,我們設計了新穎有效的方法來解決該問題。最後,鑒於工藝差異(process variation) 和老化效應 (wearout effect) 對芯片時序的影響,而且這種影響很難在設計階段被消除,我們提出了一種實時的時序差異調整(clock skew tuning) 架構。利用精心設計的硬件結構,我們可以實時地收集時序錯誤的信息,相應地調整時鐘差異,從而極大地減弱了時序不確定性對芯片性能的影響。 / As circuit non-idealities inevitably worsen with technology scaling, more design resource has to be incorporated to ensure integrated circuit (IC) timing correctness. Such worst-case-oriented design methodology results in pessimistic designs with considerable power and performance overheads, lessening the benefits provided by technology scaling. / Better-than-worst-case (BTWC) design methodology that allows reliability to be traded off against power and performance was proposed to dramatically improve the computation energy-efficiency. The basic idea behind BTWC design methodology is that, since circuit non-idealities mainly manifest themselves as infrequent timing errors on critical paths of the circuit, we can over-clock operating frequency and/or over-scale supply voltage of the chip to a critical point, where timing errors occur, and achieve error-resilient computations by performing timing error detection and correction. This approach is generally referred to as timing speculation, with which it is not necessary to guarantee “always correct operations. Unfortunately, there is usually a “wall of critical paths in the final implementation of a circuit caused by conventional worst-case-oriented design methodology, suggesting that, given a fixed circuit design, the effectiveness of timing speculation is limited by a fixed threshold beyond which the circuit performance/energy efficiency will drop significantly. / To address the above problem, this thesis first proposes to study the premises and prospects of timing speculation by analyzing the minimum and maximum potential benefits that are achievable by timing speculation techniques. After answering the question posed by the conflict between conventional techniques and timing speculation, this thesis investigates multiple design and optimization problems in timing-speculative circuits. Firstly, as introducing timing speculation capability into circuits can naturally extend the flexibility of multi-supply voltage (MSV) designs to a new horizon, this thesis formulates the MSV design problem for timing-speculative circuits and develops a novel algorithm based on dynamic programming to solve it. Secondly, this thesis develops a general formulation of clock skew scheduling (CSS) problem for timing-speculative circuits, wherein timing error rate and its corresponding impact are explicitly considered, and proposes novel algorithms to tackle this problem. Finally, considering the impact of timing uncertainties caused by process variation and wearout effects, which is very difficult to be modeled and addressed at design stage, this thesis also develops a novel online clock skew tuning framework for timing-speculative circuits. By utilizing an elaborately-designed hardware architecture to collect timing error information and tune clock skews at runtime, variation effects can be effectively mitigated. / Detailed summary in vernacular field only. / Detailed summary in vernacular field only. / Detailed summary in vernacular field only. / Ye, Rong. / Thesis (Ph.D.) Chinese University of Hong Kong, 2014. / Includes bibliographical references (leaves 131-142). / Abstracts also in Chinese.
|
5 |
Embedded passives in a multilayer mediumSeo, Yongseok, 1958- 15 July 1997 (has links)
Recent advances in high density low cost RF and microwave three dimensional
integration technologies using LTCC(Low Temperature Cofired Ceramics),
laminate and other multilayer hybrid and integrated circuits have increased interest
in the design of embedded passive components such as inductors, capacitors and
filters. The purpose of this study is to develop the design methodology of multilayer
components such as coupled line filters in a multilevel inhomogeneous medium. Although
multilayer assembly including simple components have been used in the past
for digital and low frequency systems, RF and microwave circuits have been fabricated
mostly in single level configurations. The use of multilayer three dimensional
components and circuits makes microwave circuits more compact and the design
more flexible.
This thesis describes the basic principles and computational procedure for
the design of multilayer components such as, planar single and two-level spirals for
applications as an inductive elements for RF and MICs, and coupled line band-pass
filter circuits consisting of multiple sections. It is shown that both the quality factor
and the inductance values can be enhanced by using multilevel spirals. Design methodology for general multisection filter consisting of asymmetric and multiple
coupled lines is formulated and presented. It is shown that given the filter specifications,
e.g., bandwidth, selectivity, input and output impedances, single, two and
multilevel coupled line filters can be physically realized.
The design procedure for narrow band filters is formulated in the conventional
manner by using the equivalent circuit with admittance inverters and the component
values of the low-pass prototype for Butterworth, Chebyshev and other response
functions. Examples of Butterworth and Chebyshev multisection filters are included
to demonstrate the design procedure.
The physical multilevel filter is then optimized by using the SPICE model
for coupled multiconductor lines on commercial CAD tool like LIBRA. The optimized
multilevel structure design has been validated by MOMENTUM commercial
electromagnetic simulator tool. The design methodology is validated by comparing
the theoretical results with measurement data for a strip line filter fabricated on
FR-4. / Graduation date: 1998
|
6 |
Design of radix 4 divirs using high redundancy in 65 nanometer CMOS technologyPham, Tung Nang 28 August 2008 (has links)
Not available / text
|
7 |
Design of an integrated circuit for instructional useSoman, Vijay Nilkanth, 1941- January 1973 (has links)
No description available.
|
8 |
Enhancement of flow time and adhesion of high-performance underfill encapsulants for flip-chip applicationsVincent, Michael Brien 12 1900 (has links)
No description available.
|
9 |
The effect of die attach voiding on the thermal resistance of integrated circuit packageChang, Li-hsin, 1946- January 1987 (has links)
The effect of die attach voiding on the thermal resistance of a hybrid integrated circuit package has been investigated. Voids with precisely controlled geometry, morphology, distribution, and different volume percentages are fabricated in the backside of the silicon chips by modern micro-photolithographic techniques. A large thin film resistor over the entire chip surface area served as a uniform heat generating source. A TO-3 steel package with beryllia substrate is used for chip packaging. Correlation of thermal resistance to power dissipation in the range studied is presented and discussed. The dependence of thermal resistance on void characteristics and total void area are demonstrated through infrared mapping of chip surface temperature; and the correlations are qualitatively analyzed. A brief discussion on die bond void reduction is also given.
|
10 |
Optimum design and error analysis of digital integratorsBurt, Roger William, 1932- January 1963 (has links)
No description available.
|
Page generated in 0.1019 seconds