Recently, the ripple phenomena of liquid crystal display module were occurred frequently after burning machine test. The phenomena were mainly caused by the non-uniformity of the flatness of light guide plate. But, it is difficult to detect the ripple phenomena when the light guide plate is in a free state. It is usually can be detected until the burning machine test of liquid crystal display module was finished. But it will cost massive manpower and the physical resource wasting in this process. In this study, the through analyses of flatness variations of light guide plate in its free state, in the back light module, and in the liquid crystal display module after the burning machine test, respectively, were executed. Also, the effects of variations of process factors of a light guide plate on the ripple phenomena were studied. It is hoped to achieve the purpose that one can control the flatness of light guide plate in the initial stage so that the ripple phenomena will no longer occur.

In this thesis, we utilized CCFL as the sidelight of backlight module. At the same time, we designed many um-size and 45 degree stepped microstructures on the bottom of LGP to reach the goal of uniform plane light due to its diffraction effect. Then mostly incident light can be induced to the ejected surface by once of total reflection. This way can avoid light energy being wasted, which always happens in traditional LGP design because of several times of diffraction and reflection occurred in front of light being ejected out of LGP. Moreover, stepped microstructures LGP combines the functions of reflector, diffuser, and prism film, so it can lower material cost. Relating to geometrical optics, we simulated our design with TracePro software to verify the effect we expect; relating to wave motion theory, we verified it by Definite Difference Method and programming with Matlab language. At last, we made samples to verify the above simulations and theories.

The objective of this thesis is to apply semiconductor etching process technologies on 6 inch P-type Si substrate and produce a mold of Light Guiding Plate (LGP). After evaporate chromium (Cr) onto the Si substrate as etch mask, the thin films were then patterned and subsequently etch by plasma. Different powers were used to compare the cross-sections of the patterns. The results would be the references of Si molding process. Another objective is to fabricate Si-V grooves which can connect the fibers and accurately position fibers. Anisotropic etching of Si-V grooves were formed using EDP solution, and sputtered Ta2O5 was used as the etch mask. At a etching temperature of 1100C, the under cut is 2.5~3mm . Additionally using SiO2 as etch mask by thermo evaporation at 1050¢J .Use EDP solution at 1100C, the under cut is 2.25mm which had a better result.

Orientador: Celso Aparecido Bertran / Tese (doutorado) - Universidade Estadual de Campinas, Instituto de Quimica / Made available in DSpace on 2018-08-05T16:03:35Z (GMT). No. of bitstreams: 1 CarinhanaJunior_Dermeval_D.pdf: 1993187 bytes, checksum: 8551883498a0459ecaf6e225dd799789 (MD5) Previous issue date: 2006 / Doutorado / Físico-Química / Doutor em Quimica

This thesis deals with an evolutionary solving of the Rubik's cube. The worldwide known puzzle has been for several decades not only a toy for children and adults, but also almost a lifestyle for crowds of fans and definitely a big challenge in the world of computation, where scientists seek to find an effective automated solution. The potential for its solution could also be borne by evolutionary algorithms. The author of this thesis has developed an application employing, apart from genetic algorithms, also many advanced technics, such as linear genetic programming or local search. The goal of this special technics is to make the evolutionary process more effective. There have also been made tests of the crossover, the population size and the mutation probability influence. All the tests have been statistically evaluated.