Laser nano-patterning with near-field optical microscope (NSOM) and the associated energy transport analysis are achieved in this study. Based on combined experimental/theoretical analyses, it is found that laser nano-patterning with a NSOM probes strongly depend on the laser conditions and material properties of the target: the energy transport from the NSOM probes to the targets changes from pure optical to a combination of thermal and optical transport when the pulse duration of laser is increased from femtosecond to nanosecond. As a result, the mechanisms of nano-pattern formation on targets changes from nano-ablation to nano-oxidation/ recrystallization when the laser pulse duration is increased from femtosecond to nanosecond. Also, with the laser nano-patterning experiments, thermal damage of NSOM probes is observed which can be attributed to the low transport efficiency (10-4 – 10-6) and associated heating of the metal cladding of NSOM probes. The heating of NSOM probes are studied with developed time harmonic and transient thermoreflectance (TR) imaging. From time harmonic TR when the NSOM probes are driven with continuous laser, it is found that the location of heating of NSOM probes is ~20-30µm away from the NSOM tip. The strength of the heating is determined by the laser power (linear dependence), wavelength of the laser (stronger with short A), and aperture size of NSOM probes (stronger when aperture size < A/2). From the transient TR imaging when the NSOM probes are driven with pulsed laser, it is found that the peak temperature of the NSOM probe shifts much closer to the tip. The possible reason for the change in the location of peak temperature when continuous laser is changed to pulsed laser can be attributed to the competition between the heat generation and dissipation rates at different location of the probe: the tip experiences highest temperature with pulsed heating as the entire heating processes is adiabatic. The tip also experiences highest heat dissipation rate due to its large surface-to-volume ratio which overcomes the heat generation at the tip under quasi-steady state resulting in shift of the hot spot. The knowledge obtained in this study can be important in the future design of more efficient NSOM probes and other nano-optic devices.

Due to increasing trends of miniaturization, components with microscale features are in high demand. Accordingly, manufacturing and measurement of small components as small as a few microns became new challenges. Micro milling and femtosecond laser machining are the most common in use cutting operations providing high accuracy and productivity. Micro milling has unique features different from traditional milling including high ratio of tool size to feature size, and constant ratio of tool edge radius to tool size [1]. Due to the mentioned differences, low stiffness of the micro mill and the complexity of the cutting mechanism at the macroscale, selection of cutting parameters are difficult [2]. Therefore, process performance in micro milling, which affects surface quality and tool life, depends on the selected cutting parameters. Also, for measuring micro components, the available dimensional control systems in the market are atomic force microscopes (AFMs) and a combination of coordinate measuring machines (CMMs) and vision systems. These are confined to the scopes of nanoscale and macroscale parts, respectively. It is difficult to justify the high cost and large size of these systems for measurement of mesoscale/microscale features and components and dimensional verification of miniature parts with 3D features. Therefore, a new cost-effective way is needed for measuring components and features in these scales. Additionally, lack of advanced CAD/CAM software for micro laser machining providing constant velocity along the tool path, is the main problem in femtosecond laser machining. In this thesis, to address the mentioned challenges, different software packages are presented to improve micro machining productivity, to provide an accurate and cost effective way of micro scanning and to bring CAD/CAM capability for micro laser machining. / Graduate / 0548 / abdolreza.bayesteh@gmail.com

Carbon fibre reinforced polymer (CFRP) composites have found a wide range of applications in the aerospace, marine, sports and automotive industries owing to their lightweight and acceptable mechanical properties compared to the commonly used metallic materials. The currently dominating method of machining CFRP is by mechanical means that has found many problems including extensive tool wear, fibre pull-out and delamination. Lasers as non-contact tools have been widely applied for cutting and drilling materials. However, machining of CFRP composites using lasers can be challenging due to inhomogeneity in the material properties and structures, which can lead to thermal damage such as charring, heat affected zones (HAZs), resin recession and delamination. In previous studies, Nd:YAG, diode pumped solid state (DPSS), CO2 (continuous wave), disk and fibre lasers were used in machining CFRP composites and the control of damage such as the size of heat affected zones (HAZ) and achieving comparable material removal rate with the mechanical processes remain a challenge. Most reported work showed a typical heat affected zone of 0.2-1.2 mm. The availability of short pulsed transversely excited atmospheric (TEA) CO2 lasers and ultra-short laser pulse sources such as picosecond lasers make it possible to improve the laser machining quality of CFRP materials. In this research, the machining of CFRP composites using a microsecond pulsed TEA CO2 laser, a state of the art high power picosecond laser and a 1 kW single mode fibre laser system was investigated. The yielded heat affected zone was less than < 25 µm for the TEA CO2 and the picosecond laser machining, although the material removal rate was low. Additionally, it has been shown that the pulsed fibre laser improved the machining quality compared to that with the continuous mode. A potential application of the fibre laser for composite repair and remanufacturing was investigated. The interactions between picosecond laser beam and CFRP composite were studied in more detail including understanding the self-limiting effect in single and multiple parallel tracks drilling/machining through both experimental and theoretical studies. Furthermore, a sequential laser and mechanical drilling of CFRP was investigated to improve the machining rate. The work performed in this PhD was driven by aerospace industry needs, with the collaboration of Rolls-Royce plc and BAE Systems as industrial partners.

Alumina is one of the most commonly used engineering ceramics for a variety of applications ranging from microelectronics to prosthetics due to its desirable properties. Unfortunately, conventional machining techniques generally lead to fracture, tool failure, low surface integrity, high energy consumption, low material removal rate, and high tool wear during machining due to high hardness and brittleness of the ceramic material. Laser machining offers an alternative for rapid processing of brittle and hard engineering ceramics. However, the material properties, especially the high thermal expansion coefficient and low thermal conductivity, may cause ceramic fracture due to thermal damage. Striation formation is another defect in laser cutting. These drawbacks limit advanced ceramics in engineering applications. In this work, various lasers and machining techniques are investigated to explore the feasibility of high-quality laser machining different thicknesses of alumina. The main contributions include: (i) Fibre laser crack-free cutting of thick-section alumina (up to 6-mm-thickness). A three-dimensional numerical model considering the material removal was developed to study the effects of process parameters on temperature, thermal-stress distribution, fracture initiation and propagation in laser cutting. A rapid parameters optimisation procedure for crack-free cutting of thick-section ceramics was proposed. (ii) Low power CW CO2 laser underwater machining of closed cavities (up to 2-mm depth) in alumina was demonstrated with high-quality in terms of surface finish and integrity. A three-dimensional thermal-stress model and a two-dimensional fluid smooth particle hydrodynamic model (SPH) were developed to investigate the physical processes during CO2 laser underwater machining. SPH modelling has been applied for the first time to studying laser processing of ceramics. (iii) Striation-free cutting of alumina sheets (1-mm thickness) is realised using a nano-second pulsed DPSS Nd: YAG laser, which demonstrates the capability of high average power short pulsed lasers in high-quality macro-machining. A mechanism of pulsed laser striation-free cutting was also proposed. The present work opens up new opportunities for applying lasers for high-quality machining of engineering ceramics.

The high energy lasers are emerging as an innovative material processing tool to effectively fabricate complex shapes on the hard and brittle structural ceramics, which previously had been near impossible to be machined effectively using various conventional machining techniques. In addition, the in-situ measurement of the thermo-physical properties in the severe laser machining conditions (high temperature, short time duration, and small interaction volume) is an extremely difficult task. As a consequence, it is extremely challenging to investigate the evolution of surface topography through experimental analyses. To address this issue, an integrated experimental and computational (multistep and multiphysics based finite-element modeling) approach was employed to understand the influence of laser processing parameters to effectively control the various thermo-physical effects (recoil pressure, Marangoni convection, and surface tension) during transient physical processes (melting, vaporization) for controlled surface topography (surface finish). The results indicated that the material lost due to evaporation causes an increase in crater depth of machined cavity, whereas liquid expulsion created by the recoil pressure increases the material pileup height around the lip of machined cavity, the major attributes of surface topography (roughness). Also, it was found that the surface roughness increased with increase in laser energy density and pulse rate (from 10 to 50Hz), and with the decrease in distance between two pulses (from 0.6 to 0.1mm) or the increase in lateral and transverse overlap (0, 17, 33, 50, 67, and 83%). The results of the computational model are also validated by experimental observations with reasonably close agreement.

<p> Lithium niobate has interesting characteristics such as the electro-optic effect, the acousto-optic effect, piezoelectricity and large nonlinear optical coefficients. Potential applications in MEMS field could be explored if microstructures are fabricated in lithium niobate substrates,. This thesis presents the fabrication and characterization of a lithium niobate MEMS device. As lithium niobate crystal is difficult to process using standard semiconductor techniques including both wet etching and dry etching, new methods are required to process lithium niobate. In our project, picosecond laser pulses were chosen to produce bridges on lithium niobate. Fabrication of grooves with high aspect ratio were attempted and grooves with clean morphology were obtained when laser pulses with low cutting speed, medium pulse energy, and large number of passes were employed. This shows picosecond laser machining is a viable method to process lithium niobate.</p> <p> Waveguides in Z cut lithium niobate crystal were fabricated using Ti-indiffusion techniques. After the fabrication of waveguides in lithium niobate, a SiO2 film with a thickness of 0.3μm was deposited as a buffer layer. Ti-Pt-Au electrodes for actuation function were then deposited through lift-off technique. Finally a bridge structure (80um in width and 600um in length) with a waveguide embedded in it was fabricated with picosecond laser. The insertion loss before and after laser machining was 6.99dB and 5.01dB respectively.</p> <p> Optical and electrical tests were performed in an effort to determine the resonance frequency of bridge. In the optical test, many bulk piezoelectric resonance peaks were presented in the frequency spectrum. After damping the vibration of substrate, these spikes disappeared and only a background noise with small spikes were obtained. As those small spikes are not reproducible, the optical test is not a viable method to determine resonance frequency of the bridge structure in our device. The electrical test was then carried out in a vacuum environment in order to find the resonance frequency. The spectrum presents a spike with large amplitude. However, the phase and amplitude of the spike remained the same when the vacuum condition was removed, which indicates the spike is not related to the resonance of the bridge. In summary, the resonance frequency of bridge structure could not be determined by these two approaches.</p> <p> Future work could involve directly investigating the material properties surrounding the machining region to see whether the piezoelectricity of the material has been damaged from laser ablation process. New laser machining process of lithium niobate may also need to be studied to avoid this damage to the substrate structure. Even though our device could not be driven to vibrate at its resonance frequency, it is worth making microstructures in lithium niobate substrates. The combination of optical, mechanical and electrical elements will make lithium niobate a great potential material for optical MEMS applications.</p> / Thesis / Master of Applied Science (MASc)

The microelectronics industry requires continuous advances due to ever-evolving technology and the corresponding need for higher density substrates with smaller features. Specifically, new dielectric materials with enhanced electrical properties are needed. At the same time, adhesion must be maintained in order to preserve package reliability and mechanical performance. As a result, this research investigates the use of thin glass sheets as an alternative substrate material as it offers a number of advantages including coefficient of thermal expansion similar to silicon, good dielectric properties and optical transparency to assist in the alignment of buried features. As part of this project it was necessary to deposit metallic coatings onto the glass sheets to create electrical tracks, pads and microvias. In order to meet these requirements, the metallisation of both smooth as received glass surfaces and surfaces roughened by laser machining using electroless copper and nickel deposition were investigated. This study resulted in a number of important conclusions about the roles of chemical bonding and mechanical anchoring in both the adhesion and catalyst adsorption, that are key factors in the electroless metallisation process.....

Four main aspects are studied and explored throughout this dissertation: (1) On-Package Multipolar antenna system design for integration with commercial wireless sensor nodes for machine-to-machine communication applications; (2) Development of a novel MMIC packaging process and subsequent antenna integration for chip-to-chip communication applications, (3) Design and characterization of additively manufactured lumped passive elements for integration with MMIC and hybrid circuits, (4) Design and characterization of antennas for on- and off-metal radio frequency identification (RFID) applications. This work presents the design of different 3-D printed tripolar antenna systems operating at 2.4 GHz. The antennas are designed for integration with commercial wireless nodes with the purpose of mitigating multipath and depolarization channel effects that might be present in many machine-to-machine (M2M) deployments. The antennas are fabricated utilizing an additive manufacturing (AM) approach that combines fused deposition modeling (FDM) of ABS plastic for dielectric parts and micro-dispensing of silver paste Du-Pont CB028 for conductive layers as the majority of the devices presented in this work. Over the air testing demonstrates a 1% channel improvement of up to 14 dB, achieved in a highly-reflective, Rayleigh-like fading environment by implementing selection diversity between three mutually orthogonal monopoles. This improvement leads to better bit error rate (BER) performance (as is also shown). Additionally, RSSI measurements show significant improvement when the prototype antenna system is integrated with commercial wireless sensor hardware. Implications of tripolar antenna integration on M2M systems include reduction in energy use, longer communication link distances, and/or greater link reliability. In order to incorporate the proposed multipolar selection diversity technique into short range wireless chip-to-chip communications, a novel and versatile 3D printed on-chip integration approach using laser machining is subsequently demonstrated for microwave and mm-wave systems in a process herein referred to as Laser Enhanced or Laser Assisted Direct Print Additive Manufacturing (LE-DPAM). The integration process extends interconnects laterally from a MMIC to a chip carrier. Picosecond laser machining is applied and characterized to enhance the 3D printing quality. Specifically, the width of micro-dispensed printed traces is accurately controlled within micrometer range (e.g. laser cuts ~12 μm wide), additionally, 150 μm probe pads are cut in order to facilitate RF measurement. The S-parameters of a distributed amplifier integrated into the package are simulated and measured from 2 to 30 GHz. It is seen how the overall performance is significantly better than a traditional wirebonded QFN package and previously reported AM MMIC interconnections. The attenuation of the microstrip line including interconnects is only 0.2 dB/mm at 20 GHz and return loss with the package is less than 10 dB throughout the operating frequency band A 17 GHz package integrated linearly polarized patch antenna, fabricated with a multi-layer and multi-material LE-DPAM process is then introduced for vertical interconnection with a MMIC die. Performance is successfully measured and characterized achieving a return loss greater than 19 dB at the desired design frequency. Good agreement between simulated and measured radiation patterns is also obtained with a peak gain of 4.2 dBi. Another section of this work utilizes LE-DPAM to fabricate lumped capacitors and inductors for coplanar waveguide (CPW) circuits, especially useful for filtering and matching network implementation. Laser machining is used to achieve ~12 µm slots on printed conductors, producing aspect ratios greater than 2:1, as well as to fabricate vertical interconnects or vias that allow for the fabrication of the multilayer inductors. Inductances in the range of 0.4-3 nH are achieved, with a maximum quality factor of 21, self-resonance frequencies up to 88 GHz, and an inductance per unit of area of 5.3 nH/mm2. Interdigital capacitors in the range of 0.05-0.5 pF are fabricated, having a maximum quality factor of 750 and self-resonances up to 120 GHz. All the components are made on the center line of a CPW that is 836 µm wide. The results show that LE-DPAM enables the fabrication of compact passive circuits that can be easily interconnected with MMIC dies, which at the same time, can be manufactured as part of a larger component. This enables the fabrication of structural electronics that are functional into the mm-wave frequency range. A final aspect of this work goes through antenna designs for specific RFID (radio frequency identification) applications. RFID tag design is generally focused specifically on either off-metal or on-metal configurations. In this work passive 2D and 3D RFID tags are presented which perform similarly in both configurations. The presented tags operate in the ISM RFID UHF bands that cover 864-868 MHz and 902-928 MHz. A matching loop consisting of two parallel stubs to ground is used for impedance matching to a passive integrated circuit, which has -18 dBm sensitivity. A planar 2D tag with a footprint of 13126.5 mm2 is first introduced, showing a simulated gain of approximately 3 dBi and a measured read range of 10 m (for 31 dBm transmit power from the reader) in both on-metal and off-metal conditions. The tag is miniaturized into a 3D geometry with a footprint of 2524.25 mm2 (520% reduction) and achieves the same broadside simulated on-metal gain. The antennas are fabricated using a DPAM process, and a meshed ground configuration is explored in order to accomplish a 50% conductive paste reduction without disrupting the performance. The proposed tags are compared with commercially available tags as well as previously published tags in terms of read range and size. The tags in this work present an improvement in terms of read range, gain, and area with respect to previous designs covering the ISM RFID UHF bands. Moreover, the performance of these tags is maintained in on- and off-metal conditions, achieving comparable performance and a reduction in volume of 11482% with respect to the best tag reported.

This research work investigates the development and application of process fingerprinting for conventional micro-injection moulding and ultrasonic micro injection moulding manufacturing of microneedle arrays for drug delivery. The process fingerprinting method covers in-depth analysis, interrogation and selection of certain process data features and correlation of these features with product fingerprints which are defined by the geometrical outcomes of the microneedle arrays in micro scale. The method was developed using the data collected using extensive sensor technologies attached to the conventional and ultrasonic micromoulding machines. Moreover, a machine vision based microneedle product evaluation apparatus is presented. Micromachining capabilities of different processes is also assessed and presented where state-of-the-art laser machining was used for microneedle tool manufacturing in the work. By using process fingerprinting procedures, conventional and ultrasonic micromoulding processes has been characterised thoroughly and aspects of the process that is affecting the part quality was also addressed for microneedle manufacturing. It was found that polymer structure is of paramount importance in obtaining sufficient microneedle replication. An amorphous polymer have been found to be more suitable for conventional moulding whereas semi-crystalline materials performed better in ultrasonic micromoulding. In-line captured micromoulding process data for conventional and ultrasonic moulding provided detailed insight of machine dynamics and understanding. Linear correlations between process fingerprints and micro replication efficiency of the microneedles have been presented for both micromoulding technologies. The in-line process monitoring and product quality evaluation procedures presented in this work for micro-injection moulding techniques will pave ways for zero-defect micromanufacturing of miniature products towards Industry 4.0.

The recent developments in Low Temperature Co-fired Ceramic (LTCC) as a substrate material enable it to be used in the micro and millimetre wave range providing low dissipation factors at high frequencies, good dielectric properties and a high degree of integration for further miniaturised devices. The most common metallisation method used in LTCC technology is screen printing with high cost noble metals such as silver and gold that are compatible with the high sintering temperatures (850°C). However, these techniques require high capital cost and maintenance cost. As the commercial world requires convenient and low cost process technologies for mass production, alternative metallisation methods should be considered. As a result, electroless copper plating of fired LTCC was mainly investigated in this research. The main goals of this project were to carry out electroless plating of fired LTCC with sufficient adhesion and to extend the process to metallise closed LTCC channel structures to manufacture Substrate Integrated Waveguide (SIW) components. The objectives were focused on electroless copper deposition on fired LTCC with improved adhesion. Electroless deposits on the Sn/Pd activated LTCC surface showed poor adhesion without any surface pre-treatments. Hence, chemical etching of fired LTCC was carried out using concentrated NaOH solution. NaOH pre-treatment of LTCC led to the formation of flake like structures on the LTCC surface. A number of surface and chemical analysis techniques and weight measurements were used to investigate the mechanism of the modification of the LTCC surface. The results showed that the flake like structures were dispersed in the LTCC material and a material model for the LTCC structure was proposed. SEM EDX elemental mapping showed that the flake like structure consisted of aluminium, calcium, boron and oxygen. Further experiments showed that both the concentration of NaOH and the immersion time affect the surface morphology and the roughness of fired LTCC. The measured Ra values were 0.6 μm for untreated LTCC and 1.1 μm for the LTCC sample treated with 4M NaOH for 270 minutes. Adhesion tests including peel test and scratch test were carried out to examine the adhesion strength of the deposited copper and both tests indicated that the NaOH pre-treatment led to an improvement, with the best results achieved for samples treated with 4M NaOH. A second aspect of the research focused on the selective metallisation of fired LTCC. Excimer laser machining was used to pattern a resist film laminated on the LTCC surface. This process also roughened the substrate and created channels that were characterised with respect to the laser operating parameters. After patterning the resist layer, samples were activated using Sn/Pd catalyst solution followed by the electroless copper deposition. Electroless copper was selectively deposited only on the patterned LTCC surface. Laser parameters clearly affected the copper plating rate. Even with a similar number of shots per area, the tracks machined with higher repetition rate showed relatively more machining depth as well as good plating conditions with low resistance values. The process was further implemented to realize a complete working circuit on fired LTCC. Passive components including a capacitor and an inductor were also fabricated on LTCC using the mask projection technique of the excimer laser system. This was successful for many designs, but when the separation between conductor lines dropped below 18 μm, electroless copper started to deposit on the areas between them. Finally, a method to deposit copper films on the internal walls of closed channel structures was developed. The method was first demonstrated by flowing electroless copper solutions through silane treated glass capillaries. A thin layer (approx. 60 nm) of electroless copper was deposited only on the internal walls of the glass capillaries. The flow rate of the electroless copper solution had to be maintained at a low level as the copper deposits tended to wash away with higher flow rates. The structures were tested for transmission losses and showed low (<10dB) transmission losses in the terahertz region of the electromagnetic spectrum. The process was further applied to deposit electroless copper on the internal walls of the LTCC closed channel structures to manufacture a LTCC Substrate Integrated Waveguide (SIW).