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The Global ETD Search service is a free service for researchers
to find electronic theses and dissertations. This service is
provided by the
Networked Digital Library of Theses and Dissertations.
Our metadata is collected from universities around the world. If you manage a university/consortium/country archive and want to be added, details can be found on the NDLTD website.
Search results
Showing 51 to 60 of 180 (0.045 seconds)Spelling suggestions: "subject:"lead free"" "subject:"lead tree""
| 51 |
Synthesis of tin, silver and their alloy nanoparticles for lead-free interconnect applicationsJiang, Hongjin. January 2008 (has links)
Thesis (Ph. D.)--Chemistry and Biochemistry, Georgia Institute of Technology, 2008. / Committee Chair: Dr. C. P. Wong; Committee Member: Dr. Boris Mizaikoff; Committee Member: Dr. Rigoberto Hernandez; Committee Member: Dr. Z. John Zhang; Committee Member: Dr. Z.L. Wang.
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| 52 |
Investigation of the impact response of Pb-free electronic assemblies and comparison of drop with cyclic 4-point bend testMirza, Fahad. January 2007 (has links)
Thesis (M.S.)--State University of New York at Binghamton, Thomas J. Watson School of Engineering and Applied Science, Department of Mechanical Engineering, 2007. / Includes bibliographical references.
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| 53 |
Initialization and progression of damage in lead free electronics under drop impactIyengar, Deepti Raju, Lall, Pradeep, January 2008 (has links) (PDF)
Thesis (M.S.)--Auburn University, 2008. / Abstract. Vita. Includes bibliographical references (p. 100-111).
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| 54 |
Flip chip and heat spreader attachment developmentLi, Yuquan. Johnson, Robert Wayne, January 2009 (has links)
Thesis (Ph. D.)--Auburn University. / Abstract. Includes bibliographical references (p. 91-100).
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| 55 |
Explicit finite element modeling in conjunction with digital image correlation based life prediction of lead-free electronics under shock-impactShantaram, Sandeep. Lall, Pradeep, January 2009 (has links)
Thesis--Auburn University, 2009. / Abstract. Includes bibliographical references (p. 111-121).
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| 56 |
Reliability of lead-free and advanced interconnects in fine pitch and high I/O electronics subjected to harsh thermo-mechanical environmentsHinshaw, Robert Bruce. Lall, Pradeep, January 2009 (has links)
Thesis--Auburn University, 2009. / Abstract. Includes bibliographical references (p. 170-177).
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| 57 |
Evaluation of the effects of processing conditions on shear strength in Pb-free surface mount assemblyBukhari, Sarfaraz. January 2004 (has links)
Thesis (M.S.)--State University of New York at Binghamton, Department of Systems Science and Industrial Engineering, 2004. / Includes bibliographical references.
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| 58 |
Thermal management of heat sensitive components in Pb-free assemblyRaut, Rahul. January 2005 (has links)
Thesis (M.S.)--State University of New York at Binghamton, Department of Systems Science & Industrial Engineering, 2005. / Includes bibliographical references.
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| 59 |
Effects of Lanthanum doping on the microstructure and mechanical behavior of a SnAg alloyPei, Min. January 2007 (has links)
Thesis (Ph. D.)--Mechanical Engineering, Georgia Institute of Technology, 2007. / Neu, Richard W., Committee Member ; Sanders, Thomas H. Jr., Committee Member ; Wong, C.P., Committee Member ; McDowell, David L., Committee Member ; Qu, Jianmin, Committee Chair.
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| 60 |
A systematic approach for selection of best PB-free printed circuit board (PCB) surface finishSubbarayan, Guhan. January 2007 (has links)
Thesis (Ph. D.)--State University of New York at Binghamton, Department of Systems Science and Industrial Engineering, 2007. / Includes bibliographical references (leaves 203-208).
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