Along with the increasing global environmental ism and the interest in green products, protecting the natural environment is essential to survival and economic development. The future marketing and promotion of products, in additional to the traditional variables of price and quality, requires consideration of a third variable - the environmental-friendly products. Many countries establish regulations to limit the application of ¡§lead¡¨ and other hazardous material. WEEE (Waste Electrical and Electronic Equipment) mandates recycling of electrical and electronic products. RoHS (Restriction of the Use of Certain Hazardous Substances in Electrical and Electronic Equipment) restricts 6 controlled materials starting on 2006.07.01. The ¡§lead-free¡¨ trend had unprecedented impact in the field of electronics. In the global industrial supply chain, Taiwan plays an important role in the manufacturing (OEM/ODM) stage. The Taiwan electronic industry¡¦s supply chain, in dealing with buyer¡¦s demands for green products have to take appropriate strategies to maintain the production competitive superiority of the global marketing. Facing the coming of the green electronic era, this research, with the aim on the solder industry and its future economic development, studies how the industry could effectively use the available resources, analyzes the internal operations and the external factors. Using the case study for A company, what are the feasible business model can apply? This research is hopping to elevate Taiwan¡¦s international competitiveness in light of the green revolution in the electronic industry.

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Abstract This thesis is mainly aimed to the study the basic physical properties of different flux, and the combination with semiconductor packaging of 0.6mm Sn96.5/Ag3.0/Cu0.5 (SAC305) big solder ball, and 0.3mm Sn98.5/Ag1.0/Cu0.5 (SAC105) small solder ball. Big solder ball was proceeded with shear stress test, pull ball test, and tray drop test. However small solder ball was proceeded with shear stress test, pull ball test, zone shear solder balls test and board level drop test. After experiments, samples of different flux, the effect of solder strength and mechanical properties were received and discussed. And failure modes were observed by high-power microscope, SEM and OM. The experimental result shows that the flux doesn¡¦t have direct relationship with the point of welding strong and weak, the point of welding strong and weak is determined by the metal¡¦s characteristics. However, the less of residual flux is, the higher the solder balls shearing force as well as pulling force are. As for the more of residual more of flux, after aged processing, some solder balls have the phenomenon of missing from the IMC layer. And the difference of the residual flux will affect the various failure modes of zone shear solder balls. From board level drop test, the majority of failure modes is pad peeling at the corner of test board side for all test flux, and the remaining failure modes exhibit solder fractured and IMC layer broken. Therefore, the judgement of the residual flux is a very important key factor for the semiconductor packaging. It doesn¡¦t have the direct correlation with the reliability of final products. Keywords: Lead Free, Solder Ball, Flux, Semiconductor Packaging, Tests.

Solder bump is used to connect organic substrate with chip to form Flip Chip package. Comparing to wire bond package, the path is reduced so the electrical performance is much better. Due to the environmental concern, eutectic bump is replaced by lead-free bump gradually. Meanwhile, since wafer technology is improved from 55 nm to 40 nm, the material for dielectric layers is also changed so the material for the package need to revised to meet the characteristic of wafer. Now the laser grooving is adopted before blade sawing to accommodate the brittleness of new 40nm wafer. Also, one extra polyimide is added in the wafer fabrication to reinforce the robustness of the circuit. The stress inside the lead-free bump can be reduced by optimizing the temperature of the reflow process and the speed of cooling. Different UBM structure is also reviewed to find out its affect on the strength of bump and low-K circuit so the failure mode of bump can be predicted. The selection of underfill need to be well considered so, the warpage of package can be reduced, the maximum protection of bump and low-K circuit can be achieved, and the process is easier to control. (The four underfills are reviewed) The reliability test is utilized to decide the best bump composition, the structure of UBM, the selection of underfills and the process parameter. By adding the laser grooving in the wafer sawing process, the chance of crack on die low-K layer is reduced during the reliability test. As for the UBM structure, the POU is better than RPI to reduce the crack of die low-K layer. The result is verified on the package with no underfill by Temperature cycle. Last, the matching of SnCu0.7 bump with SAC305 C4 pad has the best result. During the research, the variance of CTE for the core of substrate contributes less warpage of package, comparing to the difference of Tg for underfills. The adhesion of underfills varies and the underfill UA9 has the best result. The flip chip package with underfill UA9 can passes TCB1000. The optimization of UBM structure for lead-free bump is researched and discussed. Composition of the lead-free bump, process parameter, and cost, those factors are also studied.

Thesis (Ph. D.)--State University of New York at Binghamton, Dept. of Systems Science and Industrial Engineering, 2007. / Includes bibliographical references.

Dissertation (Ph.D.)--Auburn University, 2007. / Abstract. Vita. Includes bibliographic references.

Dissertation (Ph.D.)--Auburn University, 2005. / Abstract. Vita. Includes bibliographic references.

Thesis (M.S.)--State University of New York at Binghamton, Thomas J. Watson School of Engineering and Applied Science, Department of Systems Science and Industrial Engineering, 2007. / Includes bibliographical references.

Dissertation (Ph.D.)--Auburn University, / Abstract. Vita. Includes bibliographic references (p.139-147).

Thesis (M.Sc.)--City University of Hong Kong, 2005. / At head of title: City University of Hong Kong, Department of Physics and Materials Science, Master of Science in materials engineering & nanotechnology dissertation. Title from title screen (viewed on Sept. 4, 2006) Includes bibliographical references.