This study aimed to examine Swedish hunters' attitudes towards the use of leaded and lead-free ammunition, focusing on their perceptions regarding a potential transition to exclusive lead-free ammunition use. A questionnaire was utilized to gather insights from Swedish hunters about their attitudes and preferences. The results highlighted that the selection of ammunition type is primarily influenced by factors such as performance, availability, and costs. Notably, enhanced familiarity with non-leaded ammunition through increased usage correlated with more positive attitudes towards its adoption. The study also underscored the need to address sentimental values associated with traditional weapons and ammunition in balancing environmental and health considerations. Moreover, it delved into the varying factors influencing decision-making and explored the attitudinal differences between hunters who use lead and lead-free ammunition. In conclusion, it was found that the choice of ammunition among Swedish hunters isn't significantly influenced by gender or age, with lead ammunition being the preferred choice. Despite perceived hurdles associated with non-leaded ammunition, such as performance, cost, and availability, these barriers seemed to diminish with increased familiarity and experience, suggesting that focused education and improved availability could promote its adoption. As such, while perceptions about performance, cost, and availability are critical in hunters' choice of ammunition, these perceptions may evolve with a greater understanding and experience with lead-free alternatives.

Visible-light communication (VLC) has several advantages over the commonly used radio frequency (RF) spectrum, including high bandwidth and low crosstalk. These features have become of more significance, especially as the proliferation of wireless devices increases and causes spectrum crowding. The white light in VLC systems is typically obtained from blue/violet light-emitting diodes (LEDs) and phosphors partially converting blue light into longer wavelength colors spanning the visible-light band. One phosphor that is frequently used is cerium-doped yttrium aluminum garnet (YAG). However, YAG suffers from a low color-rendering index (CRI) and high correlated color temperature (CCT). Lead halide perovskites provide an alternative to YAG and have been extensively utilized for optoelectronic devices owing to their tunable bandgap and high photoluminescence quantum yield (PLQY). However, their drawbacks, e.g., lead toxicity and instability, hinder their widespread application. Herein, in order to take advantage of a high-performance lead-free tin-based halide perovskite phosphor that has a high absolute PLQY of near unity and a wide spectral emission ranging from 500 to 700 nm, we fabricated ultraviolet (UV) micro light-emitting diodes (micro-LEDs) with a peak wavelength at 365 nm to match the peak of the photoluminescence excitation (PLE) spectra of the material to obtain strong yellow-spectrum emission. Together with a blue LED, white light was obtained with a CRI of 84.9 and 4115-K CCT. Despite the long PL lifetime of the perovskite material, which is in the order of μs, a net data rate of 1.5 Mb/s was achieved using orthogonal frequency-division multiplexing (OFDM) with adaptive bit and power loading to take advantage of the exceptionally high PLQY of the phosphor to improve the data throughput of the VLC system using higher modulation orders. Furthermore, through improvements to the nanostructure of lead-free tin-based halide perovskite phosphor and the use of excitation sources with a higher power, the data rate is expected to be even higher. The lead-free nature of this material, along with its wide spectrum and high conversion efficiency, makes it a promising alternative to conventional toxic perovskite-based phosphors. As the first demonstration of VLC links using lead-free perovskite, this study paves the way for safer, more sustainable VLC systems.

No description available.

Ferroelectric (piezoelectric) and ferromagnetic materials have extensively permeated in modern industry. (Na1/2Bi1/2)TiO3-BaTiO3 (NBT-x%BT) single crystals and K1/2Na1/2NbO3 (KNN) textured ceramics are top environment-friendly candidates which have potential to replace the commercial lead zirconate titanate or PZT. High magnetostrictive strain (up to 400 ppm) of Fe-xat.%Ga makes this alloys promising alternatives to existing magnetostrictive materials, which commonly either contain costly rare-earth elements or have undesirable mechanical properties for device applications. These systems have common characteristics: compositional/thermal/ electrical dependent structural heterogeneity and chemical disorder on sub-micron or nano scale, resulting in diverse local structures and different physical properties. In this work, I have investigated domain and local structures of NBT-x%BT crystals, KNN ceramics and Fe-xat.%Ga alloys under various conditions, mainly by scanning probe and electron transmission techniques. In NBT-x%BT single crystals, polarized light, piezo-response force (PFM) and transmission electron (TEM) microscopies were used to study domain structures and oxygen octahedral tiltings. Hierarchical domain structures were found in NBT: a high-temperature tetragonal ferroelastic domain structure is elastically inherited into a lower temperature rhombohedral ferroelectric phase. Nanoscale domain engineering mechanism was found to still work in NBT-x%BT system and a modified phase diagram was proposed based on domain observations. An increased intensity of octahedral in-phase tilted reflections and a decrease in the anti-phase ones was observed, with increasing x as the morphotropic phase boundary (MPB) is approached. It was also found that Mn substituents favor the formation of long range ordered micro-sized ferroelectric domains and octahedral in-phase tilted regions near the MPB. Nano-size heterogeneous regions were observed within submicron domain structure, indicating that the nanoscale polarization dynamics are not confined by domain boundaries, and the high piezoelectricity of NBT-x%BT is due to a polarization dynamics with high sensitivity to electric field and a broadened relaxation time distribution. In KNN textured ceramics, an aging effect was found to exist in the orthorhombic single phase field, not only in the orthorhombic and tetragonal two-phase field as previously reported. No variation of phase structure was revealed between before and after aging states. However, pronounced changes in domain morphology were observed by both PFM and TEM: more uniform and finer domain structures were then found with aging. These changes were even more pronounced after poling the aged state. A large number of sub-micron lamellar domains within micron-domains were observed: suggesting a domain origin for improved piezoelectric properties. In Fe-xat.%Ga alloys, an underlying inhomogeneity from Ga atoms embedded into the α-Fe matrix was believed to be the origin of giant magneostrictive properties. I have systematically investigated the phase structure and nano-size heterogeneity of Fe-xat.%Ga alloys subjected to different thermal treatments using standard TEM and high resolution TEM for 10<x<30. Nano-precipitates were observed in all specimens studied: A2, D03 and B2 phases were found depending on x. Nano-precipitates of D03 were observed to be dominant for compositions near the magnetostriction peaks in the phase diagram. Quenching was found to increase the volume fraction of nanoprecipitates for x=19, near the first magnetostriction peak. With increasing x to 22.5, nanoprecipitates were observed to undergo a D03 – B2 transformation. A high density of D03 precipitates of nanoscale size was found to be the critical factor for the first maximum in the magnetostriction. / Ph. D.

Piezoelectric materials find applications in multitude of devices such as sensors, actuators and energy harvesters. However, most of these piezoelectric materials utilize lead-based systems which are becoming serious problem owing to the restrictions imposed by regulatory agencies across the globe. In the functional ceramics community, currently there is no problem more important than to find a replacement for lead-based piezoelectrics used for actuators. The electromechanical properties required for actuators (high piezoelectric constant, high coupling factor, low loss, and high transition temperatures) for known lead-free compositions are, however, far inferior to those of lead-based systems. There are three lines of research for addressing this fundamental problem "C (i) search for new systems through a combination of theory-based prediction followed by experimental effort (doping, solid solutions having a morphotropic (M) or polymorphic (P) phase boundary (PB), (iii) stabilization of metastable phases or finding the high temperature triclinic systems, and (iii) improving the properties of known compositions through microstructure optimization, domain engineering and multilayering. All these approaches are challenging and require innovation to make a significant impact on the current state-of-the-art. In this thesis, the later line of research was focused which is promising for near future applications, as it builds upon the known material systems with high depoling temperatures that have demonstrated the potential to be practical. In the first chapter, a novel method for the synthesis of lead-free (1-x)(Na0.5Bi0.5)TiO₃ "C xBaTiO3 piezoelectric ceramics was investigated. Initially, multiple compositions around morphotrpic phase boundary (MPB) were synthesized to identify the optimum composition 0.93Na0.5Bi0.5TiO3-0.07BaTiO3 (NBT-BT) for electromechanical effect. The new synthesis method starts with the synthesis of Na2Ti6O13 (NTO) whiskers which are then transformed into lead-free NBT-BT ceramics. Synthesis of NTO whiskers was performed using molten salt synthesis (MSS) method. Tape casting method was used to align the whiskers in base matrix powder and subjected to various processing temperatures to elucidate the microstructure and texture evolution. For this, scanning electron microscopy (SEM), high resolution transmission electron microscopy (HRTEM), atomic force microscopy (AFM) and energy dispersive spectroscopy (EDS) analysis were used as principal tools. The sintering process can be understood by dividing it into three stages, namely (i) transformation of monoclinic whiskers in to NBT-BT perovskite phase through topochemical reaction (<800°C), (ii) localized sintering confined on single whisker (800-1050°C), and (iii) liquid phase sintering as densification and grain growth occurs in the whole matrix (>1050°C). The concentric growth ledges observed on grain surfaces were found to be preferably confined on the corners of cubical grains indicating <111> growth direction. The Lotgering factor (f100) for the sintered matrix was found to decrease with increase in sintering temperature. The longitudinal piezoelectric constant (d33) of samples sintered for 20h at 1175°C, 1200°C and 1225°C was measured to be ~153 pC/N, ~216 pC/N and ~180 pC/N, respectively. Next, a novel method was developed for the synthesis of nanostructured lead-free ferroelectric NBT-BT whiskers with high aspect ratio using NTO as a host structure. High energy x-ray diffraction coupled with atomic pair distribution function (PDF) and Raman scattering analyses were used to confirm the average structure of lead-free NBT-BT whiskers as rhombohedral, i.e. a ferroelectricity enabling type. The HRTEM analysis revealed local monoclinic-type structural distortions indicating a modulated structure at the nanoscale in the MPB composition of lead-free NBT-BT whiskers. The structural rearrangement during the synthesis of lead-free NBT-BT whiskers was found to occur via translation of edge shared octahedra of NTO into a corner sharing coordination. The high temperature morphological changes depicting disintegration of isolated whiskers into individual grains due to higher grain boundary energy have been found to occur in a close analogy with Rayleigh-type instability. In lead-based ABO3 compounds, with B-site disorder, the origin of enhancement of piezoelectric properties near MPB has been associated with the presence of an intermediate monoclinic/orthorhombic state that bridges the adjacent ferroelectric rhombohedral and tetragonal phases. However, the origin of high piezoelectric response in lead-free ABO3 compounds with A-site disorder has not been conclusively established. In this thesis, a microscopic model derived from comparative analyses of HR-TEM and neutron diffraction was developed that explains the origin of high piezoelectric response in lead "C free MPB compositions of NBT-BT. Direct observation of nanotwins with monoclinic symmetry confirmed the presence of an intermediate bridging phase that facilitates a pathway for polarization reorientation. Monoclinic distortions of an average rhombohedral phase were attributed to localized displacements of atoms along the non-polar directions. These results provide new insight towards design of high performance lead "C free piezoelectric materials. Microstructure and domain structure play dominant role towards controlling the magnitude of piezoelectric coefficient and hysteretic losses in perovskites. Brick-wall like microstructure with large grain size and small domain size can provide significant enhancement in the magnitude of piezoelectric coefficient. A synthesis technique for lead-free piezoelectric NBT-BT system that can provide [001]pc/[012]Rh grain oriented ceramics with large grain size and an electrical poling technique that results in smaller domain size will have significant impact on the electromechanical response. In this research, a synthesis technique was developed and the processing variables that play deterministic role in achieving the large grain brick-wall like microstructure were explained. Interfaces in the microstructure were found to be coherent at the atomic scale facilitating the domain wall motion with applied electric field. The piezoelectric response was found to increase monotonously with the incease in the degree of texturing and optimized microstructure was found to provide 200% enhancement in the magnitude of piezoelectric coefficient as compared to its random form. In order to understand the mechanism of enhanced piezoelectric response in textured NBT-BT, in-situ neutron diffraction experiments revealed that characteristically different structural responses are induced in textured and randomly-oriented NBT-BT ceramics upon application of electric fields (E), which are likely related to the varying coherence lengths of polar nano regions and internal stresses induced by domain switching. In conjunction to focus on NBT-BT, new lead-free piezoelectric materials with enhanced piezoelectric response were synthesized. This study provides fundamental understanding of the enhanced piezoelectric instability in lead-free piezoelectric (1-x) BaTiO₃-xA(Cu1/3Nb2/3)O3₃ (A: Sr, Ba and Ca and x = 0.0-0.03) solid solutions. These compositions were found to exhibit large d33 of ~330 pC/N and electromechanical planar coupling constant (kp)~ 46% at room temperature. The piezoelectric instability in these compositions was found to increase with x despite monotonous decrease in the long range polar ordering. High energy X-ray diffraction coupled with PDFs indicated increase in local polarization. Raman scattering analysis revealed that substitutions on A and B-site both substantially perturbed the local octahedral dynamics and resulted in localized nano polar regions with lower symmetry. These localized polar distortions were found to persist much above the Curie temperature (Tc). Polarization "C electric field (P-E) hysteresis loop analysis indicated presence of the internal bias that was found to be correlated with the formation of polar defects. This defect structure was found to modulate the domain structure resulting in nano domains and broad domain walls with higher mobility as revealed through analysis from HR-TEM and piezoresponse force microscopy (PFM). The presence of nano domains and local structural distortions smears the Curie peak resulting in diffuse order-disorder type phase transitions. The electron paramagnetic resonance (EPR) investigations revealed that substitution of Cu²⁺ takes place on octahedral sites that are distorted due to Jahn-Teller effect. The A-sites were distorted by substitution of Sr and Ca on Ba-site possessing different ionic radii and electronegativity. The effect of these distortions on the variations in physical property was modeled and analyzed within the context of nanodomains and phase transitions. As an application, the solid solution with nominal composition of (1-x)BaTiO₃-xBa(Cu1/3Nb2/3)O₃ (BCN) (x = 0, 0.025) was synthesized by conventional mixed oxide route, followed by compositional modification with varying concentration of Sn, as given by the formulation: 0.975 BaTi1-ySnyO₃ "C 0.025 Ba(Cu1/3Nb2/3)O₃ (y = 0.05, 0.06, 0.075, 0.1). Room temperature XRD patterns showed decrease in tetragonality of BT after modifying with BCN (BT-BCN). Modifications with Sn lead to further decrement in tetragonality and the room temperature structure became cubic at 6.0 at% doping level. The decrement in tetragonality was accompanied by lowering of Tc.  BT-BCN doped with 6 and 7.5 at% Sn were found to exhibit diffuse phase transition accompanied by high dielectric constant "Ý 7000, low loss tangent "Ü 1% and grain size in the submicron regime ("Ü 1 "Ìm). These compositions were found to be promising for Y5V type multilayer ceramic capacitors (MLCCs). Lastly, the dielectric and ferroelectric responses of compositionally graded bilayer and trilayer composites consisting of BT and 0.975BaTiO₃-0.025Ba(Cu1/3Nb2/3)O₃ (BT-BCN) were investigated. Two types of graded bilayer samples were synthesized, one with same thickness of BT and BT-BCN while other with different layer thicknesses. The graded trilayer sample consisted of BT layer sandwiched between two BT-BCN layers of equal thickness. SEM and TEM images showed a sharp interface with needle-shape domains across the interface. The domain size on BT-side was found to be larger than that on BT-BCN-side. The temperature dependence of dielectric response for all composite systems was found to exhibit shifting of characteristic Curie peak compared to constituent material which was associated to coupling between layers. Moreover, the differences in grain size, tetragonality, domain mobility of each layer was found to perturb the electrical response of composite. The polarization mismatch between uncoupled BT and BT-BCN established internal electric field in composite specimen and defined new polarization states in each layer by perturbing free energy functional of the composite specimen. Dynamic hysteresis behaviors and power-law scaling relations of all specimens were determined from P"CE field hysteresis loop measurements as a function of frequency. All systems were found to exhibit similar dynamic scaling relationships. Hysteresis area, Pr and EC decreased with increasing frequency due to delayed response, but increased with increasing applied electric field due to enhancement of driving force. Trilayer system was found to exhibit strong internal-bias field and double hysteresis behavior. The coupling effect resulting due to polarization mismatch between layers had substantial influence on the dynamic hysteresis behavior and power-law scaling relations. / Ph. D.

Currently, there are two major driving forces for considering alternative materials to lead- based products, specifically interconnections, in electronics applications, including the impending legislation or regulations which may tax, restrict, or eliminate the use of lead and the trend toward advanced interconnection technology, which may challenge the limits of present soldering technology. The reliability of solder joints is a concern because fracture failures in solder joints accounts for 70% of failures in electronic components. Lead-free solders are being investigated as replacements for lead solders currently used in electronics. Thermo-mechanical properties describe the stresses accumulated due to thermal fatigue as a result of CTE mismatch within the system. By understanding the failure mechanisms related to lead-free solders, the application of lead- free solders could be more strategically designed for specific applications. The objective of this thesis is to observe microstructural change in large-area solder joints caused by thermal cycling and relate these changes to reliability issues in large-area lead and lead-free solder constructed semiconductor power devices. This study focused on the microstructural changes within the solder alloy of a large-area solder joint under thermal cycling conditions. Two major primary observations were made from this research, they are: 1) due to a combination of testing conditions and material properties, the lead-free solders, Sn/3.5Ag and Sn/Ag/0.7Cu, sustained the most severe damage as compared to Sn/37Pb, and 2) due to elevated stresses at the solder/substrate interface in a simulated power semiconductor device sample damage was found to be most severe. / Master of Science

Sn-Pb solder has long been used in the Electronics industry. But, due to its toxic nature and environmental effects, certain restrictions are made on its use and therefore many researchers are looking to replace it. Sn-3.0Ag-0.5Cu (SAC) solders are suggested as lead-free replacements but their coarse microstructure and formation of hard and brittle Inter-Metallic Compounds (IMCs) like Ag₃Sn and Cu₆Sn₅ have limited their use in high temperature applications. In this research work, RE elements, mostly lanthanum (La), are used as potential additives to SAC alloys. They reduce the surface free energy, refine the grain size and improve the mechanical and wetting properties of SAC alloys. An extensive experimental work has been performed on the microstructure evolution, bulk mechanical properties, individual phase (matrix and IMCs) mechanical properties, creep behavior and wettability performance of the SAC and SAC-La alloys, with different (La) doping. SEM and EDS have been used to follow the continuous growth of the IMCs at 150°C and 200°C and thus provide a quantitative measure in terms of their size, spacing and volume fraction. Grain size is measured at regular intervals starting from 10 hours up to 200 hours of thermal aging using Optical Microscope with cross polarized light. Bulk mechanical properties are evaluated using tensile tests at low strain rates. Individual phase mechanical properties like Young's modulus, hardness, strain rate sensitivity index and bulge effects are characterized with nanoindentation from 100 µN up to 5000 µN loadings at different temperatures of 25°C, 45°C, 65°C and 85°C. Creep experiments are performed at elevated temperatures with good fitting of Dorn creep and back-stress creep models. Activation energy measurements are made at 40°C, 80°C and 120°C. Wettability testing on copper substrates is used for surface tension, wetting force and contact angle measurements of SAC and SAC-La doped alloys at 250°C and 260°C.

Electromigration (EM) and thermomigration (TM) reliability of Pb-free solder joints are emerging as critical concerns in advanced packages. In this study, EM and TM phenomena in Sn-2.5Ag solder joints with thick Cu or thin Ni under-bump metallurgy (UBM) were investigated. A series of EM tests were performed to obtain activation energy (Q) and current density exponent (n), and to understand failure mechanisms. Joule heating was also taken into account. Q and n values were determined as follows: for Cu UBM solders, Q = 1.0 eV and n = 1.5; for Ni UBM solders, Q = 0.9 and n = 2.2. Important factors limiting EM reliability of Pb-free solder joints were found to be UBM dissolution with extensive intermetallic compound (IMC) growth and current crowding. IMC growth without current stressing was found to follow the parabolic growth law whereas linear growth law was observed for Cu₆Sn₅ and Ni₃Sn₄ under high current stressing. For Cu UBM solders, the apparent activation energy for IMC growth was consistent with the activation energy for EM, which supports that EM failure was closely related to IMC growth. In contrast, for Ni UBM solders the apparent activation energy was higher than the EM activation energy. It was suggested that the EM failure in the Ni UBM solders could be associated with more than one mass transport mechanism. The current crowding effect was analyzed with different thicknesses of Ni UBM. It was found that the maximum current density in solder could represent the current density term in Black's equation better than the average current density. FEM studies demonstrated that current crowding was mainly controlled by UBM thickness, metal trace design, and passivation opening diameter. A large temperature gradient of the order of 10³ °C/cm was generated across the sample to induce noticeable TM and to compare its effect against that of EM. TM-induced voiding was observed in Ni UBM solders while UBM dissolution with IMC formation occurred in Cu UBM solders. However, the relative effect of TM was found to be several times smaller than that of EM even at this large temperature gradient. / text

Saab Microwave Systems, SMW is a supplier of radar systems. The circuit boards that are operating in their radars have components which solder joints contains lead. However, the EU directive RoHs and WEEE are causing SMW to prepare for a transition to lead free solder joints. The objective of this thesis is to gain deeper knowledge of lead free solder joints. Brittle fractures in solder joints is a type of failure that might increase in a transition to lead free solder joints. The brittle fractures are induced by the creation of the intermetallic phases which are formed during soldering. The amount and composition of the intermetallics affects the mechanical strength of the joint. An intermetallic layer is thickened during heat exposure as during soldering, thermal aging and rework. The focus of this thesis was to investigate how rework affect the brittleness of the lead free solder joint and thereby how the intermetallic layers change depending on chemical composition, design and reflow cycles. Two types of components and two types of solder materials (SnPb and SAC305) were studied. To study the mechanical properties of the joint a shear testing device was used. This is a way of measuring the reliability of the joint when subjected to mechanical shock. The intermetallic layers were examined in a Scanning Electron Microscope and the fracture surfaces were studied in a optical microscope, a scanning electron microscope and a stereomicroscope. The heat spread over the board where examined by soldering thermocouples to the board and plotting the values of time and temperature. The results showed that the rework process did not have any significant impact of the intermetallic growth. The adjecent and distant components were not damaged during rework. A lead free rework process can therefor be preformed successfully at SMW. The intermetallic layers formed at the interface between the a lead free solder and a nickel finish grew faster than an intermetallic layer formed between a leaded solder and a nickel finish. The presence of nickel could therefore have a more negative effect on the intermetallic growth rate for the lead free material compared to the leaded.

Sabemos que em placas de circuito impresso montadas com tecnologia SMD Surface Mount Device podem ocorrer problemas com a migração eletroquímica. O fenômeno aparece principalmente porque os novos encapsulamentos possuem terminais com espaçamentos muito próximos. A migração eletroquímica pode tornar-se um potencial problema no processo de soldagem eletrônica quando é utilizado a tecnologia Lead Free na montagem das placas. O processo de migração eletroquímica ocorre quando temos metal, isolante e metal, em ambiente de alta umidade e sobre polarização elétrica, o metal deixa a posição inicial em forma de íon e se redeposita sobre o isolante. Em uma placa de circuito impresso, dois terminais adjacentes podem tornar-se eletrodos, dessa forma as dendritas crescem do cátodo para o ânodo. Podem aparecer diferentes morfologias com diferentes elementos envolvidos no processo de migração, dependendo da composição da pasta de solda ou acabamento da placa de circuito impresso. Uma estrutura do tipo pente comb feita sobre laminado FR4 foi utilizada nos experimentos. A distância entre as trilhas foram de 102 e 254 mícrons para simular uma distancia real dos terminais dos dispositivos. Os fatores considerados durante os experimentos foram: A distancia entre os terminais na estrutura (102 ou 254 mícrons), tensão aplicada (2 ou 3 V). Foi observado que a pasta de solda e o acabamento final não influenciam no processo de migração eletroquímica. O Estanho foi o principal metal que migrou. Todos os resultados obtidos nesse estudo concordam com a literatura. / It is well known that in printed circuits boards assembled by SMT technology may occur Electrochemical migration (ECM). This phenomenon appears mainly because the new packaging has the terminals very close. Also the Electrochemical migration may become a potential reliability problem in electronic soldering when lead free technology is used in soldering electronic devices. Electrochemical migration is an electrochemical process where metal on an insulating material, in a humid environment and under an applied electric field, leaves its initial location in ionic form and redeposit. In a PCB two adjacents terminal may behave as electrodes so the dendrites grow from cathode to anode. It can show different morphologies with the different migration elements involved depending on the solder paste composition or PCB surface finishing. A structure with a comb shape printed on FR4 substrate was used in the experiments. The distance between the fingers in the structure was 102 or 254 microns, in order to simulate a real distance between dispositive terminals. The factors considered during the experiments were surface finishing (ENIG or HASL), solder paste composition, distance between terminals (102 or 254 microns) and applied voltage (2 or 3 V). It was observed that the solder paste and the surface finishing dont influence the ECM process. Tin was the main metal that migrates. All the results obtained in these study agrees with the literature.