For MOCVD-TiO2/Si MOS structure, oxygen vacancy and grain boundary are the main defects of polycrystalline TiO2 films. They are the main mechanisms for the leakage current. In order to improve the problems, oxygen annealing treatment is often used for filling oxygen vacancies. The electrical characteristics of as-grown MOCVD-TiO2 films can be improved. However, it is from the lattice mismatch between the TiO2 film and Si substrate. In order to release the stress, the TiO2 film will produce a lot of defects and degrade its stoichiometry. Besides, the thermal ionic emission is due to lower conduction band offset between TiO2/Si than that of SiO2/Si. These problems need further improvement. In order to solve the above mentioned problems, fluorinated liquid phase deposition (LPD) SiO2 deposited upon polycrystalline MOCVD-TiO2/Si. Higher barrier height (Eg = 9 eV) of fluorinated LPD-SiO2 could avoid the thermal ionic emission from lower conduction band offset of TiO2/Si. Moreover, the LPD-SiO2 film can provide fluorine (F-) from the hydrofluosilicic acid (H2SiF6) aqueous solution. Fluorine could passivate grain boundaries of poly-crystalline MOCVD-TiO2 films and interface state density (Dit) of the MOCVD-TiO2/Si interface. The main leakage current of polycrystalline MOCVD-TiO2 films could be .effective to reduce. Furthermore, nitrogen (N2) annealing was used to enhance fluorine passivation of LPD-SiO2/O2-annealed MOCVD-TiO2 films. Therefore, it can be expected that higher dielectric constant and lower leakage current density will be obtained from LPD-SiO2/O2-annealed MOCVD-TiO2/Si MOS structure. Therefore, MOSFET with fluorinated MOCVD-TiO2 gate oxide can have lower off state leakage current, smaller subthreshold swing, higher transconductance, and higher field effect mobility. On the other hand, LPD-SiO2/MOCVD-TiO2 film on (NH4)2Sx-treated GaAs not only can lower leakage current but can lower interface state density. The leakage current densities are 2.3¡Ñ10-7 A/cm2 and 3.6¡Ñ10-7A/cm2 under positive and negative electric fields at 10V, respectively. The lowest interface state density is 4.7¡Ñ1011 cm-2eV-1 in the band gap. Moreover, the dielectric constant can reach 62. Therefore, LPD-SiO2/MOCVD-TiO2/(NH4)2Sx-treated GaAs structure is a high dielectric constant and low leakage current film. This structure has high potential for the further development of GaAs MOSFETs.

The materials based on GaN have successfully developed on short-wavelength laser diodes (LDs), light-emitting diodes (LEDs) and ultraviolet photodetector. In this study, GaN epitaxial layers have been successfully grown on sapphire substrates. We used several methods including the nitridation temperature for substrates before growing epilayer, the growth temperature and time of buffer layer and the growth temperature of GaN epilayer to study it. From the results of the photoluminescence (PL) measured at 77K, the X-Ray diffraction measurement, SEM cross sectional views to realize the characteristic and we get a better qualities of GaN epilayers after using the foregoing methods. In this study, the re-crystallization of the buffer layer would occur while temperature re-rise to high temperature, and the phenomenon of conglomeration influence the quality and morphology of GaN epilayers. According to the results of the experiments, we study the mechanisms of yellows luminescence and donor-acceptor pair.

The GaN-based materials have successfully developed on short-wavelength laser diodes (LDs), light-emitting diodes (LEDs) and ultraviolet photodetector. Indium-tin-oxide (ITO) thin films have been studied extensively in the optoelectronic industry because they combine unique transparent and conducting properties. ITO thin film is a highly degenerate n-type semiconductor which has a low electrical resistivity of 2-4¡Ñ10-4 £[cm. The low resistivity value of ITO films is due to a high carrier concentration because the Fermi level (EF) is located above the conduction level (EC). The degeneracy is caused by both oxygen vacancies and substitutional tin dopants created during film deposition. Furthermore, ITO is a wide band gap semiconductor visible and near-IR region of the electromagnetic spectrum. Due to these unique properties, ITO has been used in a wide range of applications. In this study, we deposited InSnO film on n-type and p-type GaN by thermal evaporator to overcome the confrontation between brightness and current spreading in optoelectronic devices. According to the experimental results, we study the mechanisms and characteristics of InSnO on GaN. Photoenhanced wet etching of GaN has recently been identified as a means of greatly improving the chemical reactivity of GaN at room temperature. Ultraviolet illumination is used to generate electron-hole pairs at the semiconductor surface, which enhance the oxidation and reduction reactions within an electrochemical cell. We have previously studied a photocnhanced wet etching process n-type GaN using HeCd laser illumination and KOH solution. In this study, etch rates of approximately 300nm/min were obtained.

Abstract A method using CFD-based computer simulations as a virtual reactor was proposed for cost-effective CVD reactor design. The virtual reactor was developed by combining the chemical reactor mechanism and rate constants obtained from kinetic studies using a small-scale, with the momentum, mass and heat transport processes simulated using a CFD code. The effect of the flow structure on the film thickness uniformity is demonstrated for the growth of GaAs from a Ga(CH3)3 -AsH3- H2 mixture. We present a modeling study of the growth of gallium arsenide layers deposited onto a high-temperature susceptor in a cylindrical metalorganic chemical vapor deposition reactor. We analyzed the deposition process with a two-dimensional model that is axisymmetric about the vertical axis. We attempted to control the extent of the consecutive reaction by modifying the flow pattern. For the output of side walls, because the gas velocity increase near the wafer edge, the residence time was lower in the central part of the wafer than near the edge. Therefore, it can be controlled by locating the outlet such that residence time above the entire wafer is uniform. And the study finds that decreasing the hole size lowered the film uniformity. This occurred because relative to the velocity at the center of the wafer, the velocity near the wafer edge increased with decreasing hole size. This result confirms that the control of the boundary layer thickness is very important for the film thickness uniformity. We also find that decreasing the shower-to-wafer distance increased velocity near the wafer and therefore increased the growth rate. The present study indicates that we can design a MOCVD reactor and optimize the operating conditions efficiently using a computer simulation with other¡¦s experiments.

ABSTRACT Recently, there has been an increasing interest in the fabrication and theory of self-assembled quantum dots (SAQD). Self-assembled quantum dots are of great interest because of good optical properties and device applications such as quantum dot lasers and memory device. The main merit of laser based on quantum dot is both the low threshold current density and low temperature sensitivite. We can grow the ZnSe quantum dot on GaAs substrate. The maximum value of dots density is 1.3¡Ñ109cm-2 at 16.7 of ¢¾/¢º ratio. The dots densities are increasing by the flow rate of DEZn and H2Se. When the ¢¾/¢º ratio are lager than 16.7 or smaller than 7.5 will lead to quantum dots increasing. The blue shift is from 8 nm to 15 nm by quantum confinement. The high quality of ZnS0.81Se0.19 epilayers on GaP substrate are grown with DEZn, H2Se, H2S and H2 fixed at 2.4 sccm, 10 sccm, 10 sccm and 1 slm respectively, and prepared at 340¢J and 50 min. High quality ZnS0.81Se0.19:N epilayer which was lattice-matched to GaP substrate has been prepared. The FWHM of X-ray diffraction was 720.2 arcsec. Its R-value was 5.20%. Then we grow ZnSe quantum dots / ZnS0.81Se0.19/GaP. The largest density of quantum dots is 1.1¡Ñ109 cm-2 at 30 s growth time.

In this thesis, ZnSe self-assembled quantum dots (SAQDs) was grown on GaAs substrate by organic-metal vapor phase epitaxy (OMVPE) with Stranski-Krastanow (S-K) growth mode. The contact-mode atomic force microscopy (AFM) and photoluminescence (PL) are used to measure the surface morphology and optical properties of ZnSe SAQDs, respectively. Experimental data show that the flow rate of H2Se have a significant influence on the relation between the density and the growth temperature of ZnSe SAQDs. At the H2Se flow rate of 25 sccm, the density of ZnSe SAQDs increases up to 3.96¡Ñ108 cm-2 as the growth temperature increase from 140¢J to 380¢J. However, the growth temperature has a negligible effect of the density of ZnSe SAQDs at the flow rate of 30 sccm. At the H2Se flow rate of 40 sccm, the density of ZnSe SAQDs decreases as the growth temperature increases due to the coalescences of SAQDs. Furthermore, a cap layer of ZnS was deposited on ZnSe SAQDs. Experimental data indicate that the increase of the thickness of ZnS cap layer results in blue-shifted emission due to the ZnSe SAQDs experience more biaxial strain. Besides, the ZnS cap layer provides an additional source of carriers, which thermalize to the ZnSe SAQDs before recombination, resulting in a significantly stronger photoluminescence signal. In AFM images, the density of ZnSe SAQDs decreases as the increase of the thickness of ZnS cap layer. In conclusion, we have successfully grown the high density of ZnSe SAQDs on the GaAs substrate and deposit the ZnS cap layer on it. Based on the technique, the multi-quantum dots will be developed in the future.

Recently, many dielectric materials have been considered as future promising candidates for a thin dielectric in DRAM storage capacitors. Due to its properties of high dielectric constant (£`// = 170, £`¡æ = 89), high refractive index (~2.5) and high chemical stability. TiO2 is a promising candidate for fabricating thin dielectrics in dynamic random access memory (DRAM) storage capacitors and as gate dielectrics of metal-oxide-semiconductor field effect transistor (MOSFET) without the problem of conventional SiO2 thickness scaling down in ULSI processes because of its high dielectric constant. TiO2 thin films grown on p-type (100) Si substrate are investigated by a cold wall horizontal MOCVD system using Ti(i-OC3H7)4, N2O and O2 as precursors in the growth temperature range from 400¢J to 700¢J. The growth rate of using N2O as the oxidizer is quicker than the growth rate of using O2 as the oxidizer because N2O is the more efficient in producing free O atoms. XRD results indicate that the structures of TiO2 films are polycrystalline and the phase transformation temperature of TiO2 films from the anatase phase to the rutile phase is about 650¢J. Electrical properties are strongly influenced by the growth temperature. The electrical properties of as-grown TiO2 films can be improved by annealing treatment. The TiO2 films using O2 as the oxidizer at the growth temperature of 600¢J has the highest dielectric constant of 119.3 and the lowest leakage current density of 1.43¡Ñ10-6 A/cm2 at the applied electric field of 1 MV/cm after annealing for 20 minutes in O2. In order to obtain the better electrical properties of TiO2 films on Si substrate, we prepared TiO2 films by combination of MOCVD and LPD. The dielectric constant of post-annealed TiO2 films prepared by combination of MOCVD and LPD is 34.1. And the leakage current density of it is 3.7¡Ñ10-6 A/cm2 at the applied electric field of 1 MV/cm. It is lower than the films prepared in the same MOCVD-TiO2 growth condition (about 8.2¡Ñ10-6 A/cm2). It suggests that this growth method can reduce the leakage current density.

In this study, the characteristics of atomic layer deposited TiO2 films on Gallium Arsenide substrate were investigated. The physical and chemical properties were measured and surveyed. And an Al/ALD-TiO2/GaAs MOS structure was used for the electrical characterizations. For the electrical property improvements, we investigated the atomic layer deposited TiO2 films by the (NH4)2Sx treatments for GaAs substrate. The leakage currents and the hysteresis loop flatband voltage shift can be improved for ALD-TiO2 films on S-GaAs. Furthermore, in order to resist the leakage current from the grain boundary of the polycrystalline TiO2 films, amorphous-like structure of TiO2 thinner films are investigated. The combination of sulfur passivation and amorphous-like structure thinner films is sufficient to improve the electrical properties effectively.

Filmes finos de TiO2 e N:TiO2, e multicamadas TiO2/N:TiO2 foram crescidos sobre substratos de aço AISI 316 e Si(100), por meio da técnica de deposição química de organometálicos em fase vapor (MOCVD). Foram produzidos filmes com diferentes espessuras, nas temperaturas de 400 e 500°C. Os filmes foram caracterizados utilizando-se técnicas de difração de raios X (DRX), espectroscopia de fotoelétrons excitados por raios x (XPS) e microscopia eletrônica de varredura (MEV). A resistência à corrosão foi avaliada por meio de testes de polarização potenciodinâmica em eletrólito 3,5%p NaCl. Filmes não dopados, crescidos a 400°C, apresentaram TiO2 anatase, enquanto que os crescidos a 500°C apresentaram a fase rutilo, além de anatase. Nos filmes dopados com nitrogênio (7,29 e 8,29 at% a 400 e 500°C, respectivamente), em ambas as temperaturas, houve a formação de TiO2 anatase, bem como de fases contendo nitrogênio. Os filmes de TiO2 crescidos a 400°C ofereceram melhor proteção contra a corrosão que os crescidos a 500°C. Filmes crescidos a 500°C apresentaram estrutura colunar, que representa alto nível de porosidade, enquanto que os filmes crescidos a 400°C apresentaram estrutura mais densa. A dopagem não foi eficiente para proteger o substrato contra corrosão, provavelmente devido à formação das fases contendo nitrogênio. Os resultados para os testes com filmes compostos por multicamadas sugerem que aqueles com mais interfaces apresentam melhor resistência à corrosão. O processo de corrosão das amostras se inicia na superfície do filme, que está em contato com o meio agressivo, originando pites, que permitem ao meio corrosivo acessar o substrato metálico. O metal é atacado e dissolvido sob o filme, e resulta na delaminação do filme. / TiO2 and N-doped TiO2 (N:TiO2) thin films, and TiO2/N:TiO2 multilayered films were grown on AISI 316 steel substrates, and Si (100) by using metallorganic chemical vapor deposition (MOCVD) technique. The growth of the films was carried out at 400 and 500°C, and films with different thicknesses and structures were obtained. Titanium dioxide films were produced by using only titanium isopropoxide IV as both titanium and oxygen sources. In order to obtain N:TiO2 films, NH3 was also added to the system. The films were characterized by using X-ray diffraction (XRD), X-ray photoelectron spectroscopy (XPS), and scanning electron microscopy (SEM) The corrosion resistance was evaluated by potentiodynamic polarization tests in a 3.5wt% NaCl electrolyte. TiO2 undoped films, grown at 400°C, presented anatase, while those grown at 500°C showed the rutile phase, besides anatase. For nitrogendoped films (7.29 and 8.29 at% at 400 and 500°C, respectively), at both temperatures, TiO2 anatase was formed, as well as nitrogen-containing phases. TiO2 films grown at 400°C provided better protection against corrosion than those grown at 500°C. Films grown at 500°C showed a columnar structure, which represents a high level of porosity, while the films grown at 400°C presented a denser structure. Doping was not efficient to protect the substrate against corrosion, probably due to the formation of nitrogen containing phases. The corrosion results for tests with multilayered films suggest that those with more interfaces present better resistance to corrosion. The corrosion of the samples starts at the surface of the films, which is in contact with the aggressive medium, causing pitting in this film, which allows the corrosive medium to reach the metallic substrate. The metal is attacked and dissolved under the film, and results in film delamination.

Filmes finos de TiO2 foram crescidos sobre silício (100) através do processo de deposição química de organometálicos em fase vapor (MOCVD). Os filmes foram crescidos a 400, 500, 600 e 700ºC em um equipamento horizontal tradicional. Tetraisopropóxido de titânio foi utilizado como fonte tanto de titânio como de oxigênio. Nitrogênio foi utilizado como gás de arraste e como gás de purga. Foram realizadas análises de difração de raios-x para a caracterização da estrutura cristalina. Microscopia eletrônica de varredura com canhão de emissão de campo foi utilizada para a avaliação da morfologia e da espessura dos filmes. Os filmes de TiO2 crescidos a 400 e a 500ºC apresentaram fase anatase. O filme crescido a 600ºC apresentou as fases anatase e rutilo, enquanto que o filme crescido a 700ºC apresentou, além de anatase e rutilo, a fase broquita. Para se avaliar o comportamento eletroquímico dos filmes foi utilizada a técnica de voltametria cíclica. Os testes indicaram um forte caráter capacitivo dos filmes de TiO2. O pico de corrente anódica é diretamente proporcional à raiz quadrada da velocidade de varredura para os filmes crescidos a 500ºC, sugerindo que o mecanismo predominante de transporte de cátions seja por difusão linear. Observou-se que o filme crescido por 60 minutos permitiu maior facilidade de intercalação e desintercalação de íons Na+. Os filmes crescidos nas demais condições não apresentaram pico de corrente anódica, embora o acúmulo de cargas se fizesse presente. / Titanium dioxide (TiO2) thin films were grown on silicon substrate (100) by MOCVD process (chemical deposition of organometallic vapor phase). The films were grown at 400, 500, 600 and 700 ° C in a conventional horizontal equipment. Titanium tetraisopropoxide was used as source of both oxygen and titanium. Nitrogen was used as carrier and purge gas. X-ray diffraction technique was used for the characterization of the crystalline structure. Scanning electron microscopy with field emission gun was used to evaluate the morphology and thickness of the films. The films grown at 400 and 500°C presented anatase phase. The film grown at 600ºC presented rutile besides anatase phase, while the film grown at 700°C showed, in addition to anatase and rutile, brookite phase. In order to evaluate the electrochemical behavior of the films cyclic voltammetry technique was used. The tests revealed that the TiO2 films formed exclusively by the anatase phase exhibit strong capacitive character. The anodic current peak is directly proportional to the square root of the scanning rate for films grown at 500ºC, suggesting that linear diffusion is the predominant mechanism of cations transport. It was observed that in the film grown during 60 minutes the Na+ ions intercalate and deintercalate easily. The films grown in the other conditions did not present the anodic current peak, although charge was accumulated in the film.