For decades, advances in device scaling has proven to be critical in improving the performance and productivity of 2D systems. In this thesis, we explore how advances in technology have pushed functional integration to such a high-level that interconnection and packaging issues represent real barriers to further progress. While three-dimensional (3D) integration offers to be a potential contender to overcome the barriers of increased energy consumption due to interconnects and bandwidth limitations, there are certain challenges that must be overcome before systems can be successfully stacked. Cooling and power delivery are among these key challenges in the integration of high performance 3D ICs. To address these challenges, microchannel heat sinks for inter-stratum cooling and through-silicon vias (TSVs) for signaling and power delivery between stacked ICs were explored. Novel integration schemes to integrate these uidic and electrical interconnects in conventional CMOS processes were also explored. Compact physical modeling was utilized to understand the trade-offs involved in the integration of electrical and microfluidic interconnects in a 3D IC stack. These concepts were demonstrated experimentally by showing different CMOS compatible methods of fabricating microchannels and integration of high aspect ratio (~20:1) and high density (200,000/cm²) electrical TSVs in the fins of the microchannels for signaling and power delivery. A novel mesh process for bottom up plating of high aspect ratio TSVs is also shown in this work. Fluidic reliability measurements are shown to demonstrate the feasibility of this technology. This work also demonstrates the design and fabrication of a 3D testbed which consists of a 2 chip stack with microchannel cooling on each level. Preliminary testing of the stack along with interlayer electro-fluidic I/Os has also been demonstrated.

This thesis is divided into four distinct chapters all linked by the topic of spray cooling. Chapter one gives a detailed categorization of future and current spray cooling applications, and reviews the major advantages and disadvantages that spray cooling has over other high heat flux cooling techniques. Chapter two outlines the developmental goals of spray cooling, which are to increase the output of a current system and to enable new technologies to be technically feasible. Furthermore, this chapter outlines in detail the impact that land, air, sea, and space environments have on the cooling system and what technologies could be enabled in each environment with the aid of spray cooling. In particular, the heat exchanger, condenser and radiator are analyzed in their corresponding environments. Chapter three presents an experimental investigation of a fluid management system for a large area multiple nozzle spray cooler. A fluid management or suction system was used to control the liquid film layer thickness needed for effective heat transfer. An array of sixteen pressure atomized spray nozzles along with an imbedded fluid suction system was constructed. Two surfaces were spray tested one being a clear grooved Plexiglas plate used for visualization and the other being a bottom heated grooved 4.5 x 4.5 cm2 copper plate used to determine the heat flux. The suction system utilized an array of thin copper tubes to extract excess liquid from the cooled surface. Pure water was ejected from two spray nozzle configurations at flow rates of 0.7 L/min to 1 L/min per nozzle. It was found that the fluid management system provided fluid removal efficiencies of 98% with a 4-nozzle array, and 90% with the full 16-nozzle array for the downward spraying orientation. The corresponding heat fluxes for the 16 nozzle configuration were found with and without the aid of the fluid management system. It was found that the fluid management system increased heat fluxes on the average of 30 W/cm2 at similar values of superheat. Unfortunately, the effectiveness of this array at removing heat at full levels of suction is approximately 50% & 40% of a single nozzle at respective 10[degrees]C & 15[degrees]C values of superheat. The heat transfer data more closely resembled convective pooling boiling. Thus, it was concluded that the poor heat transfer was due to flooding occurring which made the heat transfer mechanism mainly forced convective boiling and not spray cooling. Finally, Chapter four gives a detailed guide for the design and construction of a high heat flux heater for experimental uses where accurate measurements of surface temperatures and heat fluxes are extremely important. The heater designs presented allow for different testing applications; however, an emphasis is placed on heaters designed for use with spray cooling.