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Directional microphones, which suppress noise coming from unwanted directions while preserving sound signals arriving from a desired direction, are essential to hearing aid technology. The device presented in this paper abandons the principles of standard pressure sensor microphones, dual port microphones, and multi-chip array systems and instead employs a new method of operation. The proposed device uses a lightweight silicon micromachined structure that becomes “entrained” in the oscillatory motion of air vibrations, and thus maintains the vector component of the air velocity. The mechanical structures are made as compliant as possible so that the motion of the diaphragm directly replicates the motion of the sound wave as it travels through air. The microphone discussed in this paper achieves the bi-directionality seen in a ribbon microphone but is built using standard semiconductor fabrication techniques and utilizes piezoelectric readout of a circular diaphragm suspended on compliant silicon springs. Finite element analysis and lumped element modeling have been performed to aid in structural design and device verification. The proposed microphone was successfully fabricated in a cleanroom facility at The University of Texas at Austin. Testing procedures verified that the resonant frequency of the microphone, as expected, was much lower than in traditional microphones. This report discusses the theory, modeling, fabrication and testing of the microphone. / text

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Micromachined accelerometers have found large attention in recent years due to their low-cost and small size. There are extensive studies with different approaches to implement accelerometers with increased performance for a number of military and industrial applications, such as guidance control of missiles, active suspension control in automobiles, and various consumer electronics devices. This thesis reports the development of various capacitive micromachined accelerometers and various integrated CMOS readout circuits that can be hybrid-connected to accelerometers to implement low-cost accelerometer systems. Various micromachined accelerometer prototypes are designed and optimized with the finite element (FEM) simulation program, COVENTORWARE, considering a simple 3-mask surface micromachining process, where electroplated nickel is used as the structural layer. There are 8 different accelerometer prototypes with a total of 65 different structures that are fabricated and tested. These accelerometer structures occupy areas ranging from 0.2 mm2 to 0.9 mm2 and provide sensitivities in the range of 1-69 fF/g. Various capacitive readout circuits for micromachined accelerometers are designed and fabricated using the AMS 0.8 &micro / m n-well CMOS process, including a single-ended and a fully-differential switched-capacitor readout circuits that can operate in both open-loop and close-loop. Using the same process, a buffer circuit with 2.26fF input capacitance is also implemented to be used with micromachined gyroscopes. A single-ended readout circuit is hybrid connected to a fabricated accelerometer to implement an open-loop accelerometer system, which occupies an area less than 1 cm2 and weighs less than 5 gr. The system operation is verified with various tests, which show that the system has a voltage sensitivity of 15.7 mV/g, a nonlinearity of 0.29 %, a noise floor of 487 Hz &micro / g , and a bias instability of 13.9 mg, while dissipating less than 20 mW power from a 5 V supply. The system presented in this research is the first accelerometer system developed in Turkey, and this research is a part of the study to implement a national inertial measurement unit composed of low-cost micromachined accelerometers and gyroscopes.

Made available in DSpace on 2014-06-11T19:28:35Z (GMT). No. of bitstreams: 0 Previous issue date: 2005-06Bitstream added on 2014-06-13T20:18:25Z : No. of bitstreams: 1 freitasjr_jl_me_guara.pdf: 1619418 bytes, checksum: c9f600bef1bd4a38f5a6b1437fb62dd6 (MD5) / Universidade Estadual Paulista (UNESP) / Sistemas micro-eletromecânicos (MEMS) é uma tecnologia revolucionária que envolve a miniaturização de componentes e estruturas para a transdução, atuação e controle de sinais, através de interfaces eletrônicas, afetando a forma que pessoas e máquinas interagem com o mundo físico. Este avanço tecnológico é conseqüência da integração de áreas multidisciplinares, que possibilitou o desenvolvimento de componentes de pequenas dimensões, de baixo consumo e operando em diferentes ambientes. O objetivo deste trabalho foi estudar a aplicabilidade de sensores de aceleração tipo capacitivo que utilizam desta tecnologia, visando desenvolver um sistema para monitoramento de sinais de vibração em máquinas rotativas, levando em consideração o custo, a portabilidade e a capacidade de monitoramento de sinais na faixa entre zero e 5kHz. Os resultados foram satisfatórios, alcançando os objetivos propostos. / Micro-electromechanical Systems (MEMS) is a revolutionary technology involving miniaturization of components and structures to transduction, performance and control of signals, through electronic interface, affecting the form that people and machines interact with the physical world. This technologic progress is consequence of the integration of several areas, which made possible the development of devices with small dimensions, requiring low power and able to operate in several environments. The objective of this work was to study the applicability of the capacitive sensor based in this technology, seeking to develop a monitor system for vibration in rotative machines, taking into account the cost, the portability and the capacity of work with frequency between zero and 5kHz. The results were satisfactory, reaching the proposed objectives.

Orientador: Mauro Hugo Mathias / Banca: Sandro Aparecido Baldacim / Banca: João Zangrandi Filho / Resumo: Sistemas micro-eletromecânicos (MEMS) é uma tecnologia revolucionária que envolve a miniaturização de componentes e estruturas para a transdução, atuação e controle de sinais, através de interfaces eletrônicas, afetando a forma que pessoas e máquinas interagem com o mundo físico. Este avanço tecnológico é conseqüência da integração de áreas multidisciplinares, que possibilitou o desenvolvimento de componentes de pequenas dimensões, de baixo consumo e operando em diferentes ambientes. O objetivo deste trabalho foi estudar a aplicabilidade de sensores de aceleração tipo capacitivo que utilizam desta tecnologia, visando desenvolver um sistema para monitoramento de sinais de vibração em máquinas rotativas, levando em consideração o custo, a portabilidade e a capacidade de monitoramento de sinais na faixa entre zero e 5kHz. Os resultados foram satisfatórios, alcançando os objetivos propostos. / Abstract: Micro-electromechanical Systems (MEMS) is a revolutionary technology involving miniaturization of components and structures to transduction, performance and control of signals, through electronic interface, affecting the form that people and machines interact with the physical world. This technologic progress is consequence of the integration of several areas, which made possible the development of devices with small dimensions, requiring low power and able to operate in several environments. The objective of this work was to study the applicability of the capacitive sensor based in this technology, seeking to develop a monitor system for vibration in rotative machines, taking into account the cost, the portability and the capacity of work with frequency between zero and 5kHz. The results were satisfactory, reaching the proposed objectives. / Mestre

Now-a-days sensors are not limited only to industry or research laboratories but have come to common man’s usage. From kids toys to house hold equipment like washing machine, microwave oven as well as in automobiles, a wide variety of sensors and actuators can be easily seen. The aim of the present thesis work is to discuss the design, development, fabrication and testing of miniaturized piezoresistive, absolute type, low pressure sensor and flow sensor. Detailed performance study of these sensors in different ambient conditions (including harsh environment such as radiation, temperature etc.) has been reported. Extensive study on designing of thin silicon diaphragms and optimization of piezoresistor parameters is presented. Various experiments have been performed to optimize the fabrication and packaging processes. In the present work, two low range absolute type pressure sensors (0-0.5 bar and 0-1 bar) and a novel flow sensor (0-0.1 L min-1) for gas flow rate measurement are developed. The thesis is divided into following six chapters. Chapter 1: It gives a general introduction about miniaturization, MEMS technology and its applications in sensors area. A brief overview of different micromachining techniques is presented, giving their relative advantages and limitations. Literature survey of various types of MEMS based pressure sensors along with recent developments is presented. At the end, the motivation for the present work and organization of the thesis is discussed. Chapter 2: In this chapter, various design aspects of low, absolute type pressure sensors (0-0.5 bar and 0-1 bar) are discussed in detail. Static analysis of the silicon diaphragms has been carried out both analytically as well as through finite element simulations. Piezoresistive analysis is carried out to optimize the piezoresistor dimensions and locations for maximum sensitivity and minimum nonlinearity. All the Finite Element Analyses (FEA) were carried out using Coventorware software. A novel approach for the selection of resistor parameters (sheet resistance, length to width ratio) is reported . Finally, the expected performance of the designed sensors is summarized. Chapter 3: This chapter is divided into two parts. The first part presents the fabrication process flow adopted to develop these low range absolute pressure sensors. Two fabrication process approaches (wet etching and dry etching) which are used to fabricate the thin diaphragms are discussed in detail. Following an overall description, various aspects of the fabrication are elaborated on, like mask design, photolithography process, ion-implantation, bulk micromachining and wafer bonding. The required parameters for implantation doses, annealing cycles, low stress nitride deposition and anodic bonding are optimized through extensive experimental trials. The second part of this chapter discusses about the different levels of packaging involved in the realization of pressure sensors. Finite Element Analyses (FEA) of Level -0 and Level-1 packages has been carried out using ANSYS software to optimize the packaging materials. Exhaustive experimental studies on the selection of die attach materials and their characterization is carried out. Based upon these studies, the glass thickness and die-attach materials are selected. Chapter 4: The chapter discusses the measurement of the fabricated devices. The wafer level characterization which includes I-V characterization, measurement of offset and full scale output is discussed first. And then the temperature coefficient of resistance and offset is measured at wafer level itself. The performance characteristics like sensitivity, nonlinearity, hysteresis and offset of packaged pressure sensors is presented for all the variants (0.5 bar and 1 bar sensors fabricated by KOH and DRIE process) and their comparison with simulated values shows a close match. The measurement of dynamic characteristics using in-house developed test set-up are presented. The next section discussed detailed study about the stability of the developed sensors. The last part of this chapter reports the harsh environment characterization of the sensors viz. high temperature, humidity exposure, radiation testing etc. Chapter 5: The development of a novel micro-orifice based flow sensor for the flow rate measurement in the range of L min-1 is presented in this chapter. The sensing element is a thin silicon diaphragm having four piezoresistors at the edges. A detailed theoretical analysis showing the relationship between output voltage generated and flow rate has been discussed. The flow sensor is calibrated using an in-house developed testing set-up. Novelty of the design is that the differential pressure is measured at the orifice plate itself without the need of two pressure sensors or u-tube which is required otherwise. Chapter 6: This chapter summarizes the salient features of the work presented in this thesis with the conclusion. And then the scope for carrying out the further work is discussed.

This thesis presents the design and analysis for development of a Capacitive Micromachined Ultrasonic Transducer (CMUT), a novel sensor and actuator, aimed at replacing the conventional piezoelectric transducers for air-coupled ultrasonic imaging applications. These CMUTs are fabricated using the silicon micromachining technology wherein all fabrication is done on the surface of a silicon wafer by means of thin-film depositions, patterning with photolithography and etching. The main emphasis of this study is on developing analytical models that serve as effective design tools for the development of these devices. A desirable goal of such study is to create reasonable mathematical models, obtain analytical solutions, wherever possible, for various measures of transducer performance and provide design aids. A logical start is the lumped parameter modeling wherein the explicit dependence of the physical parameters on the spatial extent of the device is ignored. The system lumped parameters, such as the equivalent stiffness, the equivalent mass, and the equivalent damping are extracted from reasonable analytical or numerical models and subsequently used in the static and dynamic analysis of the device. Useful predictions are made with regard to the key transducer parameters, such as, the pull-in voltage, the static deflection, the dynamic response and the acoustic field produced. The modeling work presented embodies two main objectives: (i) it serves to provide direction in the design phase, and, (ii) it serves to aid in the extraction of critical parameters which affect the device behavior. Comparison of the results with the more rigorous FEM simulations as well as with those present in the existing literature assure that the developed models are accurate enough to serve as useful design tools. The distributed parameter modeling is presented next. Analysis of MEMS devices which rely on electrostatic actuation is complicated due to the fact that the structural deformations alter the electrostatic forces, which redistribute and modify the applied loads. Hence, it becomes imperative to consider the electro-elastic coupling aspect in the design of these devices. An approximate analytical solution for the static deflection of a thin, clamped circular plate caused by electrostatic forces which are inherently nonlinear, is presented. The model is based on the Kirchhoff-Love assumptions that the plate is thin and the deflections and slopes are small. The classical thin-plate theory is adequate when the ratio of the diameter to thickness of the plate is very large, a situation commonly prevalent in many MEMS devices, especially the CMUTs. This theory is used to determine the static deflection of the CMUT membrane due to a DC bias voltage. The thin-plate electro-elastic equation is solved using the Galerkin weighted residual technique under the assumption that the deflections are small in comparison to the thickness of the plate. The results obtained are compared to those obtained from ANSYS simulations and an excellent agreement is observed between the two. The pull-in voltage predicted by our model is close to the value predicted by ANSYS simulations. A simple analytical formula, which gives fairly accurate results (to within 3% of the value predicted by ANSYS simulations) for determination of the pull-in voltage, is also presented. As stated, this formula accounts for the elastic deflection of the membrane due to the coupled interaction with the electrostatic field. The effect of vacuum sealing the backside cavity of a CMUT is investigated in some detail. The presence or absence of air inside the cavity has a marked effect upon the system parameters, such as the natural frequency and the pull-in voltage. The possibility of using sealed CMUT cavities with air inside at ambient pressure is explored. In order to estimate the transducer loss due to the presence of air in the sealed cavity, the squeeze film forces resulting from the compression of the trapped air film are evaluated. Towards this end, the linearized Reynolds equation is solved in conjunction with the appropriate boundary conditions, taking the flexure of the membrane into account. From this analysis, it is concluded that, for a sealed CMUT cavity, the presence of air does not cause any squeeze film damping even when the flexure of the membrane is taken into account (the case of a rigid plate is already known). Although the emphasis of the study undertaken here is not on the physical realization of a working CMUT, a single cell as well as a linear array based on the design presented here, were fabricated (in a foundry elsewhere) in order to verify some of the most fundamental device parameters from experimental measurements. The fabricated devices have been characterized for their resonant frequency, quality factor, and structural integrity. These tests were conducted using the laser Doppler vibrometer and the Focused Ion Beam milling. Having investigated thoroughly the behavior of a single cell, we proceed to demonstrate how these cells can be arranged optimally in the form of an array to provide a comprehensive ultrasonic imaging system. A thorough analysis of the requirements for the array architecture is undertaken to determine the optimal configuration. The design constraints that need to be taken into account for CMUT arrays, especially for NDE applications, are presented. The main issue of designing an array consisting of a large number of CMUT cells required for producing a pressure wave of sufficient strength which is detectable upon reflection from the desired location even after suffering severe attenuation resulting from propagation in various media is addressed. A scalable annular array architecture of CMUT cells is recommended based on the analysis carried out.