Moore's law has defined the semiconductor industry for the past 50 years. Devices continue to become smaller and increasingly integrated into the world around us. Beginning with personal computers, devices have become integrated into watches, phones, cars, clothing and tablets among other things. These devices have expanded in their functionality as well as their ability to communicate with each other through the internet. Further, devices have increasingly been required to have diverse of functionality. This combination of smaller devices coupled with diversification of device functionality has become known as more than Moore. In this thesis, more than Moore applications of graphene are explored in-depth. Graphene was discovered experimentally in 2004 and since then has fueled tremendous research into its various potential applications. Graphene is a desirable candidate for many applications because of its impressive electronic and mechanical properties. It is stronger than steel, the thinnest known material, and has high electrical conductivity and mobility. In this thesis, the potentials of graphene are examined for pressure sensors, humidity sensors and transistors. Through the course of this work, high sensitivity graphene pressure sensors are developed. These sensors are orders of magnitude more sensitive than competing technologies such as silicon nanowires and carbon nanotubes. Further, these devices are small and can be scaled aggressively. Research into these pressure sensors is then expanded to an exploration of graphene's gas sensing properties -- culminating in a comprehensive investigation of graphene-based humidity sensors. These sensors have rapid response and recovery times over a wide humidity range. Further, these devices can be integrated into CMOS processes back end of the line. In addition to CMOS Integration of these devices, a wafer scale fabrication process flow is established. Both humidity sensors and graphene-based transistors are successfully fabricated on wafer scale in a CMOS compatible process. This is an important step toward both industrialization of graphene as well as heterogeneous integration of graphene devices with diverse functionality. Furthermore, fabrication of graphene transistors on wafer scale provides a framework for the development of statistical analysis software tailored to graphene devices. In summary, graphene-based pressure sensors, humidity sensors, and transistors are developed for potential more than Moore applications. Further, a wafer scale fabrication process flow is established which can incorporate graphene devices into CMOS compatible process flows back end of the line. / <p>QC 20160610</p>

Silicon Nanowire based Reconfigurable Field Effect Transistor (SiNW RFET) presents a solution to increase the system functionality beyond the limits of classical CMOS scaling in More-than-Moore era of semiconductor technology. They are not only spatially reconfigurable, i.e., the source and the drain can be interchangeable in design, but in such devices one can also control the primary charge carrier by controlling the voltage in the control gate. The two key morphological factors controlling reconfigurability are the structure and composition of the Schottky junctions, which serve as the location for Program and Control gates and radial strain induced by the self-limiting oxidation, which influences the carrier mobility resulting in symmetric p and n characteristic curves of an RFET. Despite its potential, in-depth nanoscale studies on the structural and compositional characterization of the key features controlling the reconfigurability are limited and thereby presents as a novel area of research. In this study, the composition and morphology of the Schottky junction and the radial strain profile due to self-limiting oxidation were studied using advanced imaging and sample preparation techniques like Transmission Electron Microscope (TEM) and Scanning Electron Microscope (SEM) imaging alongside with precise sample preparation methods like Focused Ion Beam (FIB) liftout techniques. For analysis of radial strain in nanowires that underwent self-limiting oxidation, a TEM lamella was taken of a cross-section of the NW. The lamella was kept at 200 nm thickness to preserve the strain state of the nanowire cross-section. It was observed that nanowires undergoing such oxidation have an omega (Ω) shaped oxide shell where the shell was discontinued at the spot where the nanowire was touching the substrate. Fast Fourier transform of the high-resolution image of such a NW crossection was used to calculate the strain profile. The strain is also found to be not radially uniform for such Ω shaped oxide shells. The strain profile shows a local maxima near the nanowire base where it touches the substrate then a minima approximately at the geometric center followed by the maximum strain at the area adjacent to the oxide shell thereby showing a sinusoidal profile. Theoretical simulations performed by Dr. Tim Baldauf further verified the nature of the sinusoidal strain that was observed experimentally. Similar simulations were done for different omega shell shapes, which yielded strain plots of similar sinusoidal strain plots, with the local maxima depending on the level of encapsulation of the NW by the shell. In the characterization of the Schottky junction, a TEM lamella was taken along the longitudinal direction of a nanowire, which was silicidized from both ends, similar to ones used in SiNW RFET devices. High resolution TEM micrographs and EDX (Energy dispersive X-Ray Spectroscopy) in the TEM along the Schottky junction showed a Ni rich phase and pure Si on either side of the junction. This participating phase was identified as NiSi2. However, the transition between the phases shows a gradient and in-situ experiments were designed to verify the sharpness of the junction. In in-situ silicidation experiments, Si nanowires with a thin native oxide shell were distributed on an electron transparent surface and were partially covered with Ni islands by shadow sputtering. The whole setup was then heated in a heating stage of a TEM and the Ni was allowed to disperse within the Si nanowires forming NiSi2. HRTEM (High Resolution TEM), EDX and EELS (Electron Energy Loss Spectroscopy) studies were performed on the silicidized samples for further ex-situ analysis. During the in-situ experiment, it was observed that Ni-phase interface is atomistically sharp and seldom progresses perpendicularly to the nanowire’s direction but through the closed packed planes of the NW. The interface velocity at different temperatures was used to calculate the activation energy of the silicidation process. The value of the activation energy indicates the Ni undergoing volume diffusion through the Ni-rich phase. The velocity of the interface was observed to be much higher in nanowires with smaller diameters than those with higher diameters, further proving the hypothesis. During the in-situ experiments, in around 10% of nanowires that underwent complete silicidation and held isothermally, the crystalline silicide phase was observed to partially or fully diffuse out of the nanowire core, leaving only a thin shell of Silicon oxide forming ultra-thin walled SiO2 nanotubes (NT). The onset and the time required for completion of the process varies in the nanowires depending on size of the nanowire, the distance and contact to the nearest Ni islands and presence of defects such as kinks and twists within the nanowire. In order to study the dynamics of the process, the velocity of the receding front was calculated for nanowires of two different diameters. They are found to be identical, indicating the volume flow rate of the process is directly proportional to the cross-sectional area. The voids were formed by the reduced diffusivity of Ni in Ni2Si phase in comparison to phases with lower percent of Ni. This indicates that the reason behind the phenomenon is coalition of Kirkendall voids and thus dependent on volume diffusion. From this study, it can be concluded that the extent of self-limiting oxidation and shape of the shell can influence the radial strain state. This can be used to manipulate the strain to tailor the electron and hole transfer characteristics within the RFET. A variety of factors including temperature, time, orientation and radius of the nanowires has been studied with respect to silicidation of a SiNW. The calculated activation energy can be used for precise process control over the location and morphology of Schottky junction. Although not directly related to SiNW RFET devices, the self-assembly of ultra-thin-walled SiO2 NT is a novel research area in itself, the findings of which can be applied in to design novel electronics and sensors.:TABLE OF CONTENTS Preface List of Abbreviations CHAPTER 1: Introduction and Motivation 1.1 Definition and History 1.2 Synthesis Routes 1.3 Properties and Applications 1.4 Nanoscale Electronics and Role of Si Nws 1.4.1 1.4.2 SiNW Reconfigurable Field Effect Transistor 1.5 Introduction to The Topic of The Thesis 1.6 Outline of The Thesis CHAPTER 2: Physical Basics and Previous Research: A Short Summary 2.1 Strain Measurement and Effects of Strain on on Nanoelectronics 2.1.1 Strain Analysis in Planar CMOS Structures 2.2 Silicidation and Schottky Junction 2.2.1 In-situ Silicidation 2.2.2 Silicon oxide nanotubes CHAPTER 3: Background of Instruments and Experimental Set-up 3.1 Scanning Electron Microscope 3.2 Transmission Electron Microscope 3.2.1 Imaging Techniques 3.2.2 TEM sample preparation 3.3 Focused Ion Beam CHAPTER 4: Strain in Nanowire 4.1 Goal of This Study 4.2 Strain in SiNW RFET Devices 4.3 Strain Analysis in SiNW Cross-section 4.3.1 Sample Preparation 4.3.2 Experimental Process 4.3.3 Results and Discussion 4.4 Conclusions CHAPTER 5: Schottky Junction 5.1 Crystallographic Data on Nickel Silicides 5.2 Formation of Silicides in 2-D Structures 5.2.1 Sample History 5.2.2 Sample Preparation 5.2.3 Results and Discussion 5.3 Formation of Silicides in 1-D Structures: Schottky Junction in NWs 5.3.1 Sample History 5.3.2 Sample Preparation 5.3.3 Results and Discussion 5.3.4 Shortcomings of The Lift-out Technique 5.4 In-situ Silicidation 5.4.1 Motivation 5.4.2 Sample Preparation 5.4.3 Experimental Procedure 5.4.4 Results and Discussions 5.4.5 Shortcoming of The Experiment 5.5 Self-assembling SiO2 Nanotubes 5.5.1 Sample Preparation 5.5.2 Experimental Process 5.5.3 Results and Discussion . 5.5.4 Post In-situ Experiment TEM Analysis 5.5.5 Conclusions CHAPTER 6: Conclusions and Outlook 6.1 Strain Analysis 6.2 Schottky Junction Studies Bibliography Acknowledgements