<p dir="ltr">Semiconductor technology has propelled human society into the information age, and that progress continues. Silicon CMOS device has been aggressively scaled down to 5 nm technology node. To further boost the on-state performance, MOS technology based on high-mobility channels such as III-V and Ge have been intensively studied. 3D structures such as FinFETs and gate-all-around (GAA) FETs are also applied to III-V and Ge to improve the electrostatic control of the channels for the ultimate scaling. </p><p><br></p><p dir="ltr">Traditional semiconductor device characterization techniques are inapplicable to devices created through these novel materials and device structures. This work applies various techniques to characterize a wide variety of semiconductor devices, in addition to presenting novel techniques studying the reliability of commercial off the shelf (COTS) products. Finally, the design of an ultra-low-power RF ASIC implementing wireless neural recording and stimulation, designed for cranial implantation, will be presented.</p>