Thesis (M.S.)--Virginia Polytechnic Institute and State University, 1993. / Vita. Abstract. Bibliography. Also available via the Internet.

Thesis (Ph. D.)--University of Wisconsin--Madison, 1942. / Typescript. Includes abstract and vita. eContent provider-neutral record in process. Description based on print version record. Includes bibliographical references (leaves 125-126).

Thesis (Ph. D.)--Virginia Polytechnic Institute and State University, 1992. / Vita. Abstract. Bibliographic references included. Also available via the Internet.

Thesis (M.Sc.)--City University of Hong Kong, 2006. / "Master of Science in Materials Engineering & Nanotechnology dissertation." Title from title screen (viewed on Nov. 21, 2006) Includes bibliographical references.

Investigations are made into the properties of 20 - 600 A gold films deposited onto freshly cleaved mica substrates by high vacuum evaporation. An accurate method of determining the equivalent thickness of a film is developed by combining a radio frequency technique employing quartz crystals with direct weighing. It is found that thicknesses as low as 0.5 A can be monitored to within ± 5%. An attempt is made to improve the structure of the gold films by using rapid deposition rates (15 to 20 A per second) and by depositing the gold films on nucleating silver layers of molecular thicknesses. The effect of increasing nucleating layer thicknesses (up to 25 A) is studied by electron microscopy and d.c. resistance measurements. A critical nucleating layer thickness for silver is found to exist between 5 to 7 A. On these critical layers, gold films down to 25 A are found conducting. All the films tested show an irreversible change in conductivity with heating. Without a silver layer, continuous decrease in the conductivity of gold films is observed, the film being destroyed at 450° C. On the other hand, increasingly better conductivities are observed by heating the gold-on-silver films, and an optimum annealing temperature of about 350° C is indicated. Above this temperature the conductivity decreases; however, films are still conducting and continuous at 600° C. These films are, therefore, suitable as heat reflecting windows. D.C, and high frequency measurements (at 9.7 Gc) on gold films are given. In both cases, almost identical values of surface resistance are obtained in the range 10 to 1,000 ohms per square. A method for preparing gold film bolometer elements using interrupted deposition of gold on a nucleating silver layer is discussed. As very thin gold on silver films with high d.c. conductivities are found to have low microwave transmission coefficients, the possible application of visual protection from microwave radiation is discussed. / Applied Science, Faculty of / Electrical and Computer Engineering, Department of / Graduate

No description available.

The purpose of this study is to investigate the varying conditions in types of solutions, concentrations of solutions, hydrogen-ion concentration, current densities and potentials in the electro deposition of nickel.

by Chow Yeung Ming = 化學鍍鎳層的表面性質與焊接能力之關係 / 周洋明. / Thesis (M.Phil.)--Chinese University of Hong Kong, 2000. / Includes bibliographical references (leaves 62-65). / Text in English; abstracts in English and Chinese. / by Chow Yeung Ming = Hua xue du nie ceng de biao mian xing zhi yu han jie neng li zhi guan xi / Zhou Yangming. / Abstract --- p.i / 論文摘要 --- p.ii / Acknowledgements --- p.iii / Table of Contents --- p.v / List of Figures --- p.viii / List of Tables --- p.ix / Abbreviations --- p.x / Chapter Chapter 1 --- INTRODUCTION / Chapter 1.1 --- Electroless Plating (Autocatalytic Deposition) --- p.1 / Chapter 1.2 --- Electroless Nickel (EN) Plating --- p.2 / Chapter 1.3 --- Types of Electroless Nickel Deposits --- p.2 / Chapter 1.4 --- Properties of Electroless Nickel --- p.5 / Chapter 1.5 --- Applications of Electroless Nickel in Electronic Packaging Industry --- p.7 / Chapter 1.6 --- Importance of Solderability --- p.8 / Chapter 1.7 --- Literature Review of Solderability Studies of Electroless Nickel --- p.9 / Chapter 1.8 --- Motivations & Aims of Studies --- p.10 / Chapter Chapter 2 --- EXPERIMENTAL & INSTRUMENTATION / Chapter 2.1 --- Electroless Nickel Plating --- p.11 / Chapter 2.2 --- Solderability Measurements / Chapter 2.2.1 --- Soldering --- p.13 / Chapter 2.2.2 --- Various test methods for solderability --- p.13 / Chapter 2.2.3 --- Wetting balance method --- p.15 / Chapter 2.2.4 --- Solderability measurements of electroless nickel deposits --- p.17 / Chapter 2.2.5 --- Assessment of wetting curves --- p.19 / Chapter 2.3 --- Surface Oxidation Studies / Chapter 2.3.1 --- Use of X-ray photoelectron spectroscopy (XPS) in surface characterization --- p.19 / Chapter 2.3.2 --- XPS system --- p.22 / Chapter 2.3.3 --- Surface composition of electroless nickel deposits --- p.22 / Chapter 2.3.4 --- Oxide thickness characterization by angle-resolved XPS --- p.25 / Chapter 2.3.5 --- Oxide thickness characterization by XPS depth profiling with low-energy-ion sputtering --- p.28 / Chapter 2.4 --- Surface Morphology Studies / Chapter 2.4.1 --- Surface morphology studies by scanning Auger electron microscopy (SAM) & atomic force microscopy (AFM) --- p.28 / Chapter 2.4.2 --- SAM studies of electroless nickel surfaces --- p.29 / Chapter 2.4.3 --- AFM studies of electroless nickel surfaces --- p.29 / Chapter 2.5 --- Oxide Quality Studies --- p.31 / Chapter Chapter 3 --- RESULTS & DISCUSSIONS / Chapter 3.1 --- Solderability Measurements by the Wetting Balance Method --- p.33 / Chapter 3.2 --- Surface Oxidation Studies / Chapter 3.2.1 --- Surface composition of electroless nickel deposits --- p.36 / Chapter 3.2.2 --- Oxide thickness characterization by angle-resolved XPS --- p.38 / Chapter 3.2.3 --- Oxide thickness characterization by XPS depth profiling with low-energy-ion sputtering --- p.44 / Chapter 3.2.4 --- Conclusion --- p.47 / Chapter 3.3 --- Surface Morphology Studies / Chapter 3.3.1 --- SAM studies of electroless nickel surfaces --- p.49 / Chapter 3.3.2 --- AFM studies of electroless nickel surface --- p.49 / Chapter 3.3.3 --- Conclusion --- p.53 / Chapter 3.4 --- Interpretation of Wetting Kinetics of Electroless Nickel --- p.54 / Chapter Chapter 4 --- CONCLUSIONS & FURTHER STUDIES / Chapter 4.1 --- Conclusions --- p.59 / Chapter 4.2 --- Further Studies --- p.60 / Appendix --- p.61 / References --- p.62

This thesis describes an automatic Rinse Tank Control System used in detection and removal of contaminating agents from industrial plating rinse tanks. It automatically monitors the purity of the rinse water in sixteen separate rinse tanks, and permits fresh water to enter the tanks only when the conductivity of the rinse water in each tank exceeds a predetermined level. Its use will result in large savings in consumption of fresh water and the subsequent reduction in discharge of effluent to the treatment plants.

Thesis (M.S.)--Rochester Institute of Technology, 2008. / Typescript. Includes bibliographical references (leaves 56-58).