Hydropower has been around for more than a century and is considered a mature technology, but with recent advancements in power electronics and simulation capability new exciting ways to increase efficiency and reliability is possible. At Uppsala University a brushless exciter has been constructed for the experimental test rig, SVANTE. Power electronics are mounted on the shaft for control of the generator's excitation current. In addition a wireless control and measurement system is needed to provide the desired switching patterns to the power electronics and to evaluate performance of the system. In this thesis a shaft mounted embedded system for control and measurement is constructed as well as magnetic field sensors with measurement range up to 700mT. The computational power comes from a National Instruments sbRIO-9606. The system has 14 individual totem pole power electronics driving channels, 48 analog input channels for current signals and it communicates wirelessly through a bluetooth connection. The system is tested and works satisfactory but has not been mounted on the rotating side of the generator due to delays in the manufacturing.

Thin film copper indium gallium selenide (CIGS) solar cells have exhibited single junction power conversion efficiencies above 20% and have been commercialized. The large scale production of CIGS solar cells, however, is hampered by the relatively high cost and poor stoichiometric control of coevaporating tertiary and quaternary semiconductors in high vacuum. To reduce the overall cost of production, CIGS nanocrystals with predetermined stoichiometry and crystal phase were synthesized in solution. Colloidal nanocrystals of CIGS provide a novel route for production of electronic devices. Colloidal nanocrystals combine the well understood device physics of inorganic crystalline semiconductors with the solution processability of amorphous organic semiconductors. This approach reduces the overall cost of CIGS manufacturing and can be used to fabricate solar cells on flexible and light-weight plastic substrates. As deposited CIGS nanocrystal solar cells were fabricated by ambient spray-deposition. Devices with efficiencies of 3.1% under AM1.5 illumination were fabricated. Examining the external and internal quantum efficiency spectrums of the devices reveal that in nanocrystal devices only the space charge region is actively contributing to the extracted photocurrent. The device efficiency of the as-deposited nanocrystal films is presently limited by the small crystalline grains (≈ 15 nm) in the absorber layer and the relatively large interparticle spacing due to the organic capping ligands on the nanocrystal surfaces. Small grains and large interparticle spacing limits high density extraction of electrons and holes from the nanocrystal film. A Mott-Schottky estimation of the space charge region reveals that only 50 nm depth of the nanocrystalline absorber is effectively contributing to the photogenerated current. One strategy to improve charge collection involves increased space charge region for extraction by vertical stacking of diodes. A much longer absorption path for the photons exists in the space charge region with the stacked devices, increasing the probability that the incident radiation is absorbed and then extracted. This method enables an increase in the collected short circuit current. The overall device efficiency, however, suffers with the increased series resistance and shunt conductance of the device. Growth of nanocrystal grains was deemed necessary to achieve power conversion efficiencies comparable to vapor deposited CIGS films. Simple thermal treatment of the nanocrystal layers did not contribute to the growth of the crystalline grain size. At the same time, because of the loss of selenium and increased trap density in the absorber layer, there was a measurable decrease in device efficiency with thermal processing. For increased grain size, the thermal treatment of the absorber layer took place in presence of compensating amounts of selenium vapor. The process of selenization, as it is called, took place at 500°C in a graphite box and led to an increase of the grain size from 15 nm to several microns in diameter. Devices with the increased grain size yielded efficiencies up to 5.1% under AM1.5 radiation. Mott-Schottky analysis of the selenized films revealed a reduction in doping density and a comparable increase in the space-charge region depth with the increased grain size. The increased collection combined with the much higher carrier mobility in the larger grains led to achieved Jsc values greater than 20 mA/cm2. Light beam induced current microscopy (LBIC) maps of the devices with selenized absorber layers revealed significant heterogeneity in photogenerated current. Distribution of current hotspots in the film corresponded with highly selenized regions of the absorber films. In an effort to improve the overall device efficiency, improvements in the selenization process are necessary. It was determined that the selenization procedure is dependent on the selenization temperature and processing environment. Meanwhile, the reactor geometry and nanocrystal inks composition played important roles in determining selenized film morphology and the resulting device efficiency. Further work is necessary to optimize all the parameters to improve device efficiency even further. / text

The research presented in this thesis entailed an investigation of heavy metal uptake by Palmaria palmata, a red marine alga. The alga was dry and organically certified. The heavy metals of interest were those commonly found in the wastewaters of the printed wiring board industry, namely Cu2+Pb2+, Cd2+, Zn 2+ and Ni2+. The ultimate objective of the work was to determine whether or not the factors expected to influence the metal uptake to the greatest extent could be optimized within functional ranges, leading eventually to process design (beyond the scope of this thesis). These factors were pH, temperature, initial concentration of metal in aqueous solution, and contact time. A number of preliminary experiments were performed to establish a basis for the design of the optimization studies. / Although it was not possible to adequately define optimal regions of operation for the biosorption of heavy metals by Palmaria palmata , general trends were elucidated, and the limitations of the methodology used were clarified. (Abstract shortened by UMI.)

The aim of this master thesis was to develop a process for fabricating Schottky diodes, using techniques that are suitable for cheap large volume mass production e.g. printing, with tetrapod structured ZnO as the semiconductor. Part of the work involved selecting suitable metals for ohmic and Schottky contact and identification of a binder that can be used for dispersion of the Zinc Oxide (ZnO). ZnO is a II-VI compound semiconductor with a wide band gap (3,4 eV). The Schottky diode is used as a rectifier. A rectifier serves the purpose to turn Alternating Current (AC) to Direct Current (DC). The Schottky diode should only conduct current in the forward direction, in the reverse direction the current should be blocked. In this thesis printed diodes were used to construct different types of rectifiers for example half wave rectifiers and full wave rectifiers. Aside from electrical properties, adhesion properties have also been investigated. Adhesion was showed to depend on not only the choice of binder, but also UV-dose and annealing temperature. Aluminum and silver together with ZnO proved to be the best materials combination with a rectification ratio up to 105−106. Different sizes of Schottky diodes were printed and the smaller diodes with an area of 0,5x0,5mm^2 performed best as a half wave rectifiers while the larger size,1x1mm^2, performed best as a full wave rectifier.

The purpose of this research was to investigate the factors that enhance conductive anodic filament (CAF) formation in printed wiring boards. The variables studied were (1) flux formulation, (2) conductor spacing, (3) operating voltage, and (4) temperature. A Weibull distribution of failure times due to CAF was observed. A novel test circuit was designed and implemented that allowed the mean time to failure to be determined for boards processed with three different fluxes, at 0.5 mm and 0.75 mm conductor spacings and at 150V and 200V. The boards were aged at 85%RH and a temperature of 75°C, 85°C or 95°C. It was found that the flux formulation affected the rate of CAF formation. A modified linear aliphatic polyether flux with a chloride activator had a significantly different activation energy than control printed wiring boards or those boards processed with a poly(ethylene/propylene) glycol flux or a poly(ethylene/propylene) glycol flux with a bromide activator. The addition of bromine to a poly(ethylene/propylene) glycol flux decreased the rate of CAF formation as compared to poly(ethylene/propylene) glycol without a halide activator. The inter-relation between voltage and conductor spacing was quantified as a L4/V2 relationship for the plated through hole test pattern used in this study. 325V/mm was found to be a critical voltage gradient for the formation of CAF. The maximum temperature of the reflow profile also greatly enhances CAF formation and decreases the mean time to failure. Microscopic analysis showed distinct differences in CAF morphology between the various processed boards. Control boards had small halo-like CAF formations around a separated fiber / epoxy interface. CAF that formed on boards processed with poly(ethylene/propylene) glycol or poly(ethylene/propylene) glycol with a bromine activator had a stratified appearance that penetrated well into the epoxy. Boards that were processed with the modified linear aliphatic polyether with chlorine activator had a striated morphology that also penetrated into the epoxy. All CAFs were consistently copper and chlorine containing despite the use of a bromine containing flux. Electron diffraction revealed that a CAF observed in this study was synthetic atacamite. Stainless steel (i.e., iron, nickel, and chromium) residues were also observed as a result of drill bit breakage during PTH formation.

No description available.

The purpose of this creative project was to create a functional and aesthetically pleasing line of garments. The goals of this project were to: 1) produce three textile designs (motifs), 2) screen print the textile designs on fabric, and 3) design and construct a functional/aesthetically pleasing garment line using the three original textile motifs. There were several processes involved in creating the end result. The processes involved in this project were designing a motif for fabric, screen printing the designs on to the fabric, and designing and constructing the clothing line.The work of three artists from the Surrealism movement in art history were used as a source of inspiration for designing the motifs printed on the fabric. The three artists were Joan Miro, Salvador Dali and Max Ernst.The images of the motifs were first sketched and redrawn on the MicroDesign I Cad system. The motifs were printed on 100% cotton using the stencil process in screen printing. Five alternating colors were used to print the three different images. After the fabric was printed, three garment designs were created to be constructed using the new fabric. The patterns for the garments were created using the draping method for pattern making.The results of the project were favorable. The fun spirited motifs represented the feel of the Surrealist movement. The completed garments looked like the original illustrations. Although much was achieved through this project, it far exceeded the time expectations for completion. / Department of Family and Consumer Sciences

A substantial raise in recuperator effectiveness has been established in the past by improving the fabricating and joining configurations regarding the manufacturing of compact recuperators. Further advancement of state-of-the-art recuperators requires providing for increased temperatures and pressures. 1bis can only be achieved by incorporating high temperature materials into the recuperator design. Although many high temperature materials have been identified in past research, less of these can be utilized in new concepts due to difficulties regarding fabricating and joining. However recently, in an independent study, a tungsten-copper alloy was identified through detailed material selection methods as a suitable material for high temperature applications. The validity of tungsten-copper regarding fabricating and joining, to establish a leak tight structure still needs to be demonstrated. The aim of the study is to carry out a comprehensive review of existing recuperator technologies and design methodologies as well as to investigate the manufacturability of tungsten-copper for use in a recuperator design of limited size. More specifically, the objectives entail the following: (1) The comprehensive review of existing recuperator technologies and recuperator design methodologies, (2) The design and fabrication of a recuperator of limited size using tungsten-copper as a heat transfer material and (3) The determination of the feasibility of fabrication of the design and the applicability of the selected W -eu alloy in the design. The fabrication technique that is presented in the design entailed the use of 2.Irm tungsten carbide drill bits to machine the correct recuperator profile, while the recuperator unit was joined by utilizing a mechanical fastening system. Although diffusion bonding was initially identified as the ideal joining technique for the recuperator of this research, restrictions and limitations relating to the use of diffusion bonding has lead to the identification of a fastening system as the technique used. Evaluation of the fabricated recuperator revealed that several factors were outside the initially specified values, inter alia the flatness tolerance of recuperator plate geometries and machined slots precision. These factors contributed to a leaJdng recuperator structure when tested. The most likely contributing factors for the latter relate to non-conforming tolerances achieved in the fabricated design, residual stresses induced by the machining process as well as design issues relating to the recuperator plate geometries. The design and fabrication of a recuperator of limited size using tungsten-copper as a heat transfer material, requires re-evaluation. Similar work will ensure a design of a high quality when provision is made for advanced surface fmishing of machined parts (notably the recuperator plate geometries), slight modifications to the design as well as stress relieving of machined components for the purpose of eliminating any residual stresses thatJnight be present. / Thesis (M.Ing. (Mechanical Engineering))--North-West University, Potchefstroom Campus, 2009.

A substantial raise in recuperator effectiveness has been established in the past by improving the fabricating and joining configurations regarding the manufacturing of compact recuperators. Further advancement of state-of-the-art recuperators requires providing for increased temperatures and pressures. 1bis can only be achieved by incorporating high temperature materials into the recuperator design. Although many high temperature materials have been identified in past research, less of these can be utilized in new concepts due to difficulties regarding fabricating and joining. However recently, in an independent study, a tungsten-copper alloy was identified through detailed material selection methods as a suitable material for high temperature applications. The validity of tungsten-copper regarding fabricating and joining, to establish a leak tight structure still needs to be demonstrated. The aim of the study is to carry out a comprehensive review of existing recuperator technologies and design methodologies as well as to investigate the manufacturability of tungsten-copper for use in a recuperator design of limited size. More specifically, the objectives entail the following: (1) The comprehensive review of existing recuperator technologies and recuperator design methodologies, (2) The design and fabrication of a recuperator of limited size using tungsten-copper as a heat transfer material and (3) The determination of the feasibility of fabrication of the design and the applicability of the selected W -eu alloy in the design. The fabrication technique that is presented in the design entailed the use of 2.Irm tungsten carbide drill bits to machine the correct recuperator profile, while the recuperator unit was joined by utilizing a mechanical fastening system. Although diffusion bonding was initially identified as the ideal joining technique for the recuperator of this research, restrictions and limitations relating to the use of diffusion bonding has lead to the identification of a fastening system as the technique used. Evaluation of the fabricated recuperator revealed that several factors were outside the initially specified values, inter alia the flatness tolerance of recuperator plate geometries and machined slots precision. These factors contributed to a leaJdng recuperator structure when tested. The most likely contributing factors for the latter relate to non-conforming tolerances achieved in the fabricated design, residual stresses induced by the machining process as well as design issues relating to the recuperator plate geometries. The design and fabrication of a recuperator of limited size using tungsten-copper as a heat transfer material, requires re-evaluation. Similar work will ensure a design of a high quality when provision is made for advanced surface fmishing of machined parts (notably the recuperator plate geometries), slight modifications to the design as well as stress relieving of machined components for the purpose of eliminating any residual stresses thatJnight be present. / Thesis (M.Ing. (Mechanical Engineering))--North-West University, Potchefstroom Campus, 2009.

As integrated circuits and printed circuit boards increase in complexity, testing becomes a major cost factor of the design and production of the complex devices. Testability has to be considered during the design of complex electronic systems, and automatic test systems have to be used in order to facilitate the test. This fact is now widely accepted in industry. Both design for testability and the usage of automatic test systems aim at reducing the cost of production testing or, sometimes, making it possible at all. Many design for testability methods and test systems are available which can be configured into a production test strategy, in order to achieve high quality of the final product. The designer has to select from the various options for creating a test strategy, by maximising the quality and minimising the total cost for the electronic system. This thesis presents a methodology for test strategy generation which is based on consideration of the economics during the life cycle of the electronic system. This methodology is a concurrent engineering approach which takes into account all effects of a test strategy on the electronic system during its life cycle by evaluating its related cost. This objective methodology is used in an original test strategy planning advisory system, which allows for test strategy planning for VLSI circuits as well as for digital electronic systems. The cost models which are used for evaluating the economics of test strategies are described in detail and the test strategy planning system is presented. A methodology for making decisions which are based on estimated costing data is presented. Results of using the cost models and the test strategy planning system for evaluating the economics of test strategies for selected industrial designs are presented.