No projeto Habitar a Paisagem, propuz uma prática investigativa envolvendo a imagem impressa e diversos meios de reprodução de imagens, incluindo linguagens como o vídeo e a fotografia, considerando suas singularidades e aproximações. As imagens tratam poeticamente de questões relativas à paisagem e a relação do homem com os espaços que habita. Os principais conceitos que permeiam e constituem o eixo deste grupo de trabalhos são: serialidade, transitoriedade, materialidade, singularidade e repetição. / In the project Inhabiting the Landscape, I proposed an investigative practice involving the printed image and various means of reproduction of images, including languages such as video and photography, considering its uniqueness and approximations. The images poetically deal with issues of landscape and man\'s relation to the space it inhabits. The main concepts that permeate and constitute the axis of this group of works are: seriality, transience, materiality, uniqueness and repetition.

Orientador: André Luis Seixlack / Co-orientador: Marcio Antônio Bazani / Co-orientador: Amarildo Tabone Paschoalini / Banca: João Batista Campos Silva / Banca: Thiago Antonini Alves / Resumo: Este trabalho apresenta uma proposta de modelagem de uma réplica térmica de placa de circuito impresso, feita a partir de componentes com potência conhecidas objetivando analisar a distribuição de temperatura e os processos de troca de calor quando elementos semelhantes são utilizados em conjunto nos sistemas eletrônicos, visto que com o aumento da necessidade de maior capacidade de processamento os componentes estão cada vez menores e dissipando muito mais calor. Os obstáculos aquecidos que simulam componentes constituem-se em um resistor comercial envolvido por resina especial para encapsulamentos eletrônicos. Este modelo será criado para ter suas equações governantes resolvidas em software comercial. A réplica térmica será representada por blocos, com diferentes dissipações de potências e áreas de troca de calor. Uma vez que o desempenho térmico global depende da dissipação térmica de cada bloco, a avaliação poderá dizer quais blocos contribuem para uma melhor eficiência na troca de calor. Os experimentos fornecerão os valores de temperaturas dos componentes e velocidades de escoamentos para serem comparados com o modelo computacional, e desta forma, o melhor modelo de turbulência que descreve a análise experimental poderá ser encontrado. Foi estudada também a aplicação da teoria dos coeficientes de influência entre componentes. Este trabalho é adequado para a identificação de problemas que se relacionam direta ou indiretamente com falhas em componentes eletrônicos devido à alta temperatura / Abstract: This paper proposes a modeling of a thermal replica of the printed circuit board, made from components with known power aimed at analyzing the temperature distribution and the processes of heat exchange when similar elements are used together in the electronic systems, as that with the increasing need for higher processing components are smaller and more heat dissipating. The heated obstacles simulating components are in a trade resistor surrounded by special resin for electronic encapsulation. This model will be created to be their governing equations solved in commercial software. The thermal replica is represented by blocks with different power dissipation and heat exchange areas. Once the overall thermal performance depends on the thermal dissipation of each block, the evaluation can tell which blocks contribute to better efficiency in heat exchange. The experiments provide the values of the temperature and velocity components of flow to be compared with the computational model, and thus the turbulence model that best describes the experimental analysis can be found. The application of the theory of influence coefficients between components was also studied. This work is suitable for the identification of problems that relate directly or indirectly to failures in electronic components due to high temperature / Mestre

Apresenta-se inicialmente o problema do Circuito Impresso na Automação de Projetos de Sistemas Digitais. É descrito um processo de fabricação, já em uso mencionando-se as principais fases da implementação de circuitos impressos. Dá-se ênfase aos algoritmos desenvolvidos para a definição do mapa de rotas, bem como à forma de descrição dos dados para processamento de problemas. São descritos sumariamente os arquivos e programas usados para a realização do \"Lay-out\", e complementarmente, discute-se um caso exemplo desde o seu preparo até as saídas gráficas. Alguns exemplos reais são expostos a na forma como foram processados. Dá-se destaque ainda ao conjunto de mensagens de erro emitidas pelos programas, que auxiliam o usuário no projeto do mapa de rotas de interconexão. / The problem of printed circuit boards in digital systems Project automation is initially presented. A manufacturing process for printed circuit boards is considered and the important phases of its implementation are described. This manufacturing process has been already successfully implemented. The central point of this dissertation is the set of algorithms developed for route mapping. The format description for processing is also a problem of importance and concern. The files and program for lay-out construction are briefly described, and an example illustrates all the relevant steps in the process, starting from data preparation and ending with the graphic outputs. Several real case examples are also presented in the form they were processed. A set of error messages printed by the program is presented. These messages are of great help to the user in projecting interconnection routing map.

Esta tese tem por objetivos apresentar a edição criteriosa de manuscritos brasileiros seiscentistas; mostrar tendências gramaticais do português do século XVII, com base nesses manuscritos e em impressos coetâneos; analisar a retenção gráfica desses textos, muito mais próxima da escrita fonética do que da etimológica e, ainda, analisar o uso freqüente das conjunções coordenativas. A preocupação com o estado da língua portuguesa no século XVII justifica-se pela pouca quantidade de estudos voltados especificamente a esse período, através de fontes primárias, e por ser este um período em que a escrita, baseada de modo geral nos textos literários, é considerada pelos lingüistas de modo geral como pseudo-etimológica, contrariando fatos apresentados nas cartas e textos notariais seiscentistas. Os passos seguidos para a análise partiram da edição criteriosa de manuscritos seiscentistas brasileiros, da comparação com impressos e com gramáticas e tratados de ortografia de mesma época e do confronto com o que dizem os atuais especialistas em lingüística diacrônica. Os resultados obtidos permitemnos afirmar que a ortografia portuguesa do século XVII e o uso dos nexos de coordenação apresentam fortes características do português medieval, contrariando o que se pregava na época, em função da revolução filosófica desencadeada pelo Renascimento. Tal conclusão, a nosso ver, deve-se, especialmente, ao fato de a educação em Portugal, e conseqüentemente no Brasil, estar nas mãos da Companhia de Jesus, defensora da filosofia escolástica e opositora, portanto, ao pensamento racional e cartesiano dos países reformados, o que manteve Portugal afastado das grandes correntes filosóficas do século em questão. / The purpose of this thesis is to present a discerning edition of seventeenth Brazilian manuscripts; to demonstrate grammatical trends of Portuguese from the Seventeenth Century, based on these manuscripts and on coetaneous printed versions; to analyze the graphical retention of these texts, much more near to the phonetic writing than to the etymological one, and, also, to analyze the frequent use of the coordinative conjunctions in those texts. The concern with the Portuguese language condition in the Seventeenth Century is justified by the little quantity of studies specifically focused on that period, through primary sources, and because that is a period in which the writing, usually based upon literary texts, is considered by almost all linguists as pseudo-etymological, contesting facts presented in letters and in seventeenth century notarial texts.The steps followed for the analysis arose from the discerning edition of seventeenth Brazilian manuscripts, the comparison with printed versions and with grammar books and treaties on orthography from the same period and from the parallel with what the specialists on diachronic linguistic say. The obtained results allow us to affirm that the Portuguese orthography from the Seventeenth Century and the use of the coordination nexus present strong characteristics of medieval Portuguese, opposing to what was preached in that period, on account of the philosophical revolution broken out by the Renascence. Such conclusion, in our point of view, is specially due to the fact that the Education in Portugal, and consequently in Brazil, in the hands of \"Companhia de Jesus\", defensor of the scholastic philosophy and, therefore, opponent of the Rational and Cartesian thought of the reformed countries, what kept Portugal away from the great philosophical chains of the century under discussion.

Orientador: Giovani Fornereto Gozzi / Resumo: Dispositivos Eletroluminescentes (EL) são comumente utilizados para iluminação ambiente e transmissão visual de informações, possuem uma enorme gama de aplicações em setores diversos, como para tratamento fototerápico e decoração. Entre as atuais tecnologias, os dispositivos produzidos com compósitos eletroluminescentes têm potencial de emprego em aplicações emergentes devido ao seu baixo custo, flexibilidade mecânica e escalabilidade. Estas vantagens tecnológicas estão atreladas ao fato destes dispositivos poderem ser produzidos utilizando-se técnicas de impressão gráfica, como por exemplo, a técnica de impressão serigráfica. Neste sentido, este trabalho tem como objetivo o desenvolvimento de dispositivos EL totalmente impressos utilizando a técnica de impressão serigráfica. Para tanto, a pasta condutora transparente (PCT) e a pasta de prata (PTF), ambas fornecidas pela empresa TICON, foram utilizadas para a produção de eletrodos transparentes e opacos, respectivamente. A camada ativa dos dispositivos foi produzida com o compósito eletroluminescente (PEL), o qual foi desenvolvido durante o presente estudo. Filmes dos materiais PCT, PEL e PTF foram depositados utilizando-se telas com diversas lineaturas e caracterizados com relação às suas propriedades morfológicas, elétricas e ópticas, com a finalidade de identificar as melhores lineaturas de telas serigráficas para o processamento de cada um dos materiais. Por fim, dispositivos EL do tipo LECEL (Light-Emitting Composite Ele... (Resumo completo, clicar acesso eletrônico abaixo) / Abstract: Electroluminescent (EL) devices have a wide range of applications. Among current technologies, devices produced with electroluminescent composites have potential for use in emerging applications due to their low cost, flexibility and scalability. Scalability and cost-effectiveness are characteristics also related to device processing methods, amongst which printing techniques, such as screen-printing, are the most appropriated to achieve these goals. Therefore, this research regards on development of screen-printed EL devices. For this purpose, the transparent conductive paste (PCT) and the silver paste (PTF), both sourced by TICON, were used for transparent and opaque electrodes fabrication, respectively. The active layer of the devices have been produced with an electroluminescent composite (PEL) developed during the present study. We have produced screen-printed films with the PCT, PEL and PTF materials using screens with different mesh counts to study the influence of mesh count on the morphological, electrical and optical properties of the films. In addition, we have performed a study regarding the influence of mesh count on the EL device performance parameters. As main result, we have fabricated a screen-printed EL device, using screens with appropriated mesh counts for deposition of each material, which exhibited luminance of 50 cd/m2 (at 110 V) and turn-on voltage of (18 ± 2) V. / Mestre

Orthodontic brackets undergo resistance during sliding that includes classical friction, binding, and notching. Current bracket systems are hampered by these challenging forces. As a result, the clinician usually needs to apply additional forces to overcome the resistance which increases the risk of root resorption and discomfort for the patient. This study evaluated frictional properties of a novel bracket that had polytetrafluoroethylene (Teflon™) coated rollers in its design. Five types of brackets (n = 10, each), including a passive self-ligating bracket, a traditional ligated bracket, a three-dimensionally printed direct metal laser sintering (DMLS) bracket with and without Teflon™ rollers, and computer numeric controlled (CNC) machine milled bracket with Teflon™ rollers were tested. The peak resistance values were assessed at 0°, 4°, and 8° of tip on a 0.019 x 0.025” arch wire. At 8° of tip, the DMLS and the CNC milled bracket systems, both with Teflon™ rollers, exhibited less friction as compared to the other brackets tested (p

O uso de equipamentos eletroeletrônicos (EEE) tem se tornado tão inerente aos hábitos cotidianos que a demanda por novas tecnologias aumentou, impulsionando o desenvolvimento tecnológico. Assim, houve um aumento em sua rotatividade pela redução do tempo de vida útil, com a chamada obsolescência programada. Esta combinação resulta no aumento da geração de resíduos de equipamentos eletroeletrônicos, os chamados REEE, devido ao descarte após seu ciclo de vida. Os REEE apresentam composição heterogênea em termos de materiais, e podem representar um problema ambiental se forem descartados na natureza, entrando em contato com o solo e corpos hídricos. As placas de circuito impresso (PCIs) estão presentes na maioria dos REEE e apresentam uma ampla gama de metais em sua composição, o que justifica a motivação por aliar interesses ambiental e econômico com sua reciclagem. A prata está presente nas soldas das PCIs lead free e pode ser recuperada por meio da combinação de processamento físico e hidrometalúrgico. Após a purificação, o metal pode ser utilizado como precursor na síntese de nanopartículas de prata, que apresentam potencial para aplicação em diversos setores da indústria, justificando seu valor agregado. Neste trabalho, foi estudada e composição de placas de memória de computadores obsoletos por meio de um processamento físico de cominuição e quarteamento, seguido da caracterização física e química por meio de análise granulométrica, análise em estereoscópio, digestão em água régia e ácido nítrico, ensaio de perda ao fogo e análise em MEV/EDS e ICP-OES. Da fração metálica, 0,045% corresponde à prata, cuja recuperação foi estudada. Para isto, foi realizada uma lixiviação ácida em meio oxidante com H2SO4 2M como agente lixiviante e em 95°C em duas relações sólido-líquido (1:10 e 1:20) e tempos (8 e 12h), de forma que foi possível alcançar 97,3% de extração da prata com relação sólido-líquido de 1:10 em 12h. Paralelamente, o estudo da síntese de nanopartículas de prata pelo método de Turkevich utilizando dois precursores, AgNO3 e AgCl, foi conduzido, variando as proporções molares entre o precursor e o redutor em 1:0,25, 1:1, 1:1,3673, 1:2, 1:3, 1:4 e 1:5, para avaliar as características das nanopartículas e sua estabilidade ao longo do tempo. Na síntese com AgNO3 como precursor sugere-se que as melhores condições combinadas foram referentes à proporção de 1:2. Na síntese com AgCl como precursor, embora nas melhores condições estudadas (proporção molar de 1:5) o resultado em termos de estabilidade, dispersividade e diâmetro médio tenham sido melhores se comparados aos ensaios utilizando AgNO3 como precursor, houve a precipitação de prata micrométrica que era indesejada. / The use of electrical and electronic equipments (EEE) has become so inherent in daily habits that the demand for new technologies increased, boosting technological development. Thus, there was an arising on EEE\'s turnover because of the reduction of the useful time, with the so-called planned obsolescence. This combination results on the increase of the generation of waste electrical and electronic equipments (WEEE) due to discard after the life cycle. WEEEs have heterogeneous composition and may represent an environmental issue if discarded on environment, coming into contact with soil and water bodies. Printed Circuit Boards (PCBs) are present in most WEEE and present a lot of metals in their composition, which justifies the motivation on combine environmental and economic interests with recycling. Silver is present on the weld of lead free PCBs and can be recovered through the combination of physical and hydrometallurgical processing. After the recovery, the metal can be used as precursor on the synthesis of silver nanoparticles, which present potential of application in many industry fields. In this work, the composition of memory boards from obsolete computers was studied through physical processing of comminution and quartering, followed by physical and chemical characterization through granulometric analysis, stereoscope analysis, aqua regia and nitric acid digestion, fire loss test and SEM/EDS and ICP-OES analysis. Of the metallic fraction, 0.045% corresponds to silver, whose recovery was studied. For the recovery, it was performed an acid leaching in oxidant media with H2SO4 2M as leaching agent in 95°C and using two solid-liquid ratios (1:10 and 1:20) and times (8 and 12h), and it was possible to reach 97.3% of silver extraction in 12h for solid-liquid ratio of 1:20. In parallel, it was performed the study of the synthesis of silver nanoparticles by Turkevich method using two precursors, AgNO3 e AgCl, with the variation of molar ratios of the precursor and the reductant in 1:0,25, 1:1, 1:1,3673, 1:2, 1:3, 1:4 e 1:5, aiming the evaluation of nanoparticles characteristics and stability through the time. In the synthesis with AgNO3 as precursor, the combined results suggest the proportion of 1:2 as the best synthesis condition. In the synthesis with AgCl as precursor, even in the best studied conditions (molar ratio 1:5) the results in terms of stability, dispersity and medium diameter was best then obtained using AgNO3 as precursor in same conditions, there was undesirable micrometric silver precipitation.

Four linked experiments were run in order to understand the relationship between frequency judgment and recognition discrimination tasks. The purpose of these studies was to contrast the common-path model and recursive reminding hypothesis as explanations for the underlying principles that drive these tasks. Item-attribute variables such as printed frequency, connectivity, and set size, and an episodic variable, study frequency were manipulated. Memory for recent episodes was evaluated using recognition and frequency judgment tasks. Although all of the variables, with the exception of set size, had significant effects in both tasks, an analysis of effect sizes revealed differences between the tasks in relation to the variables. Specifically, the item-attribute variables had larger effects in recognition than in JOF, and the effect size for study frequency was greater in the JOF task compared to recognition. The reliability of these differences was statistically established by a repeated measures analysis run on the correlations between each subject's mean and the variables. Although the effect size pattern is consistent with the reminding hypothesis, the effects of connectivity and printed frequency in the JOF task are not as they represent familiarity measures. Thus, this finding indicates that familiarity must be involved in making frequency judgments, making the reminding hypothesis inadequate as an explanation as it does not take into account the effect of item-attribute variables and their contribution to familiarity with its subsequent effect on frequency estimates. Therefore, it is proposed that a dual-process approach that takes into account both the reminding and recollection at test in the JOF task, as well as attempting to explain the influence of an underlying construct such as familiarity that effects both tasks may be the most appropriate explanation for frequency estimation results.

Today’s state of the art additive manufacturing (AM) systems have the ability to fabricate multi-material devices with novel capabilities that were previously constrained by traditional manufacturing. AM machines fuse or deposit material in an additive fashion only where necessary, thus unlocking advantages of mass customization, no part-specific tooling, near arbitrary geometric complexity, and reduced lead times and cost. The combination of conductive ink micro-dispensing AM process with hybrid manufacturing processes including: laser machining, CNC machining, and pick & place enables the fabrication of printed electronics. Printed electronics exploit the integration of AM with hybrid processes and allow embedded and/or conformal electronics systems to be fabricated, which overcomes previously limited multi-functionality, decreases the form factor, and enhances performance. However, AM processes are still emerging technologies and lack qualification and standardization, which limits widespread application, especially in harsh environments (i.e. defense and industrial sectors). This dissertation explores three topics of electronics integration into AM that address the path toward qualification and standardization to evaluate the performance and repeatable fabrication of printed electronics for resilience when subjected to harsh environments. These topics include: (1) the effect of smoothing processes to improve the as-printed surface finish of AM components with mechanical and electrical characterization—which highlights the lack of qualification and standardization within AM printed electronics and paves the way for the remaining topics of the dissertation, (2) harsh environmental testing (i.e. mechanical shock, thermal cycling, die shear strength) and initiation of a foundation for qualification of printed electronic components to demonstrate survivability in harsh environments, and (3) the development of standardized methods to evaluate the adhesion of conductive inks while also analyzing the effect of surface treatments on the adhesive failure mode of conductive inks. The first topic of this dissertation addresses the as-printed surface roughness from individually fusing lines in AM extrusion processes that create semi-continuous components. In this work, the impact of surface smoothing on mechanical properties and electrical performance was measured. For the mechanical study, surface roughness was decreased with vapor smoothing by 70% while maintaining dimensional accuracy and increasing the hermetic seal to overcome the inherent porosity. However, there was little impact on the mechanical properties. For the electrical study, a vapor smoothing and a thermal smoothing process reduced the surface roughness of the surfaces of extruded substrates by 90% and 80% while also reducing measured dissipative losses up to 24% and 40% at 7 GHz, respectively. The second topic of this dissertation addresses the survivability of printed electronic components under harsh environmental conditions by adapting test methods and conducting preliminary evaluation of multi-material AM components for initializing qualification procedures. A few of the material sets show resilience to high G impacts up to 20,000 G’s and thermal cycling in extreme temperatures (-55 to 125ºC). It was also found that coefficient of thermal expansion matching is an important consideration for multi-material printed electronics and adhesion of the conductive ink is a prerequisite for antenna survivability in harsh environments. The final topic of this dissertation addresses the development of semi-quantitative and quantitative measurements for standardizing adhesion testing of conductive inks while also evaluating the effect of surface treatments. Without standard adhesion measurements of conductive inks, comparisons between materials or references to application requirements cannot be determined and limit the adoption of printed electronics. The semi-quantitative method evolved from manual cross-hatch scratch testing by designing, printing, and testing a semi-automated tool, which was coined scratch adhesion tester (SAT). By cross-hatch scratch testing with a semi-automated device, the SAT bypasses the operator-to-operator variance and allows more repeatable and finer analysis/comparison across labs. Alternatively, single lap shear testing permits quantitative adhesion measurements by providing a numerical value of the nominal interfacial shear strength of a coating upon testing while also showing surface treatments can improve adhesion and alter the adhesive (i.e. the delamination) failure mode of conductive inks.

High performance communications, sensing and computing systems are growing exponentially as modern life continues to rely more and more on technology. One of the factors that are currently limiting computing and transmission speeds are copper wire interconnects between devices. Optical fiber interconnects would greatly increase the speed of today’s electronic devices. In this study it has been demonstrated that by using a new Direct Print Additive Manufacturing (DPAM) process of Fused Deposition Modeling (FDM) of plastic and micro-dispensing of pastes and inks, we can 3D print single and multi-mode optical fibers in a controlled manner such that compact, 3-dimensional optical interconnects can be printed along non-lineal paths. We are FDM printing the core materials from a plastic PMMA material. We are dispensing a urethane optical adhesive as the core material. These materials are available in many different refractive indices. During numerical simulations of these fibers, we were able to show through manipulation of the refractive indices of the core and cladding that we can also improve the bend performance of our fibers. As a result, they can perform better as an interconnect in tight routings between components as long as the interconnect fiber distances remain less than 1 meter. Fibers have been fabricated with diameters between 77 and 17 µm across an air gap with a surface roughness of less than 450 nm and cladded and tested with transmission rates of about 46%. 12 µm fibers have successfully been fabricated on a cladded surface as a proof of concept to test the small diameter and 3D shaping capability of this process.